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1. 发明专利

JP2010130943A Food and drink for preventing hangover 审中-公开
标题翻译：食物和饮料，以防止远距离
公开(公告)号：JP2010130943A
公开(公告)日：2010-06-17
申请号：JP2008309558
申请日：2008-12-04
申请人： Junji Yamada , 潤二山田
发明人： YAMADA JUNJI
IPC分类号： A23L1/325 , A23L1/30 , A23L1/327 , A23L2/38 , A23L2/52
摘要： PROBLEM TO BE SOLVED: To provide food and drink expected to bring a dramatic effect on hangover prevention, and containing blowfish fins and components extracted from blowfish fins. SOLUTION: The food for preventing hangover comprises blowfish fins, contains extracted components from blowfish fins, and has as the main ingredient a product obtained by crushing dried blowfish fins. The drink for preventing hangover has as the main ingredient, a liquid containing extracted components from blowfish fins or a liquid obtained by soaking blowfish fins for a prescribed time, and in this case, the liquid comprises water. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供预期会对宿醉预防产生重大影响的食物和饮料，并且包含从河豚翅鱼提取的鱼翅和部件。解决方案：用于防止宿醉的食物包括河豚鳍，含有来自鱼翅的提取成分，以粉碎干燥的鱼翅为主要成分。用于防止宿醉的饮料作为主要成分，是含有来自鱼翅的提取成分的液体或通过将鱼翅散热规定时间而获得的液体，在这种情况下，液体包含水。版权所有（C）2010，JPO＆INPIT

2. 发明授权

US07919852B2 Semiconductor device and insulating substrate utilizing a second conductor with a non-joint area 有权
标题翻译：半导体器件和利用具有非接合区域的第二导体的绝缘基板
公开(公告)号：US07919852B2
公开(公告)日：2011-04-05
申请号：US11332539
申请日：2006-01-17
申请人： Junji Yamada
发明人： Junji Yamada
IPC分类号： H01L23/34 , H01L21/00 , H05K7/20
CPC分类号： H01L23/3735 , H01L2924/0002 , H05K1/0306 , H05K3/0061 , H05K3/341 , H05K2201/0394 , H05K2201/0397 , Y02P70/613 , H01L2924/00
摘要： A semiconductor device including: an insulating substrate including a ceramic substrate having first and second principal surfaces, a first metallic conductor fixed on the first principal surface, and a second metallic conductor fixed on the second principal surface; a semiconductor element disposed on the first metallic conductor on the first principal surface; and a base plate connected to the second metallic conductor on the second principal surface, and on which the insulating substrate being disposed. The second metallic conductor includes a joint area connected to the second principal surface, and a non-joint area formed around the joint area.
摘要翻译：一种半导体器件，包括：绝缘基板，包括具有第一和第二主表面的陶瓷基板，固定在所述第一主表面上的第一金属导体和固定在所述第二主表面上的第二金属导体; 半导体元件，设置在所述第一主表面上的所述第一金属导体上; 以及与所述第二主表面上的所述第二金属导体连接的基板，所述绝缘基板设置在所述基板上。第二金属导体包括连接到第二主表面的接合区域和形成在接合区域周围的非接合区域。

3. 发明授权

US07777325B2 Power semiconductor module 有权
标题翻译：功率半导体模块
公开(公告)号：US07777325B2
公开(公告)日：2010-08-17
申请号：US12046046
申请日：2008-03-11
申请人： Junji Yamada
发明人： Junji Yamada
IPC分类号： H01L23/48
CPC分类号： H05K3/325 , H01L24/48 , H01L25/072 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/01068 , H01L2924/01078 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H05K2201/10265 , H05K2201/10295 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A power semiconductor module comprising: a power semiconductor element; a case for receiving the power semiconductor element; a control terminal which is connected to a control electrode of the power semiconductor element, the control terminal is installed in a state of protruding from an upper surface of the case; and a conductive spring which is inserted into the control terminal so that an inner surface of the spring makes contact with at least a part of the side surface of the control terminal, the conductive spring is electrically connected to a printed substrate placed as opposed to the upper surface of the case by making pressurization contact with the printed substrate.
摘要翻译：一种功率半导体模块，包括：功率半导体元件; 用于接收功率半导体元件的壳体; 连接到所述功率半导体元件的控制电极的控制端子，所述控制端子被安装在从所述壳体的上表面突出的状态下; 以及导电弹簧，其插入到控制端子中，使得弹簧的内表面与控制端子的侧表面的至少一部分接触，导电弹簧电连接到与通过与印刷基板进行加压接触来使外壳的上表面。

4. 发明授权

US07663252B2 Electric power semiconductor device 有权
标题翻译：电力半导体装置
公开(公告)号：US07663252B2
公开(公告)日：2010-02-16
申请号：US11873030
申请日：2007-10-16
申请人： Junji Yamada , Seiji Saiki
发明人： Junji Yamada , Seiji Saiki
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/49 , H01L24/45 , H01L24/48 , H01L25/072 , H01L2224/451 , H01L2224/48091 , H01L2224/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/014 , H01L2924/14 , H01L2924/19107 , H01L2924/30107 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： An electric power semiconductor device including first and second circuit patterns formed on main surfaces of first and second insulating substrates, respectively, first and second semiconductor chips mounted on the first and second circuit patterns, respectively, a multilayer electrode plate assembly disposed between the first and second insulating substrates, having first, second and third electrode terminals provided with a distance from each other, a first connecting conductor made by wire bonding for connecting the first and second semiconductor chips to the first and second electrode terminals, and a second connecting conductor having an extending portion extended from a part of the third electrode terminal to be connected to the second circuit pattern, and the connection between the extending portion of the third electrode terminal and the second circuit pattern is implemented by a solder.
摘要翻译：一种功率半导体器件，包括分别形成在第一绝缘基板和第二绝缘基板的主表面上的第一和第二电路图案，分别安装在第一和第二电路图案上的第一和第二半导体芯片，分别设置在第一和第二绝缘基板之间的多层电极板组件，第二绝缘基板，具有彼此间隔开的距离的第一，第二和第三电极端子，通过引线接合制成的第一连接导体，用于将第一和第二半导体芯片连接到第一和第二电极端子;以及第二连接导体，从所述第三电极端子的一部分延伸以连接到所述第二电路图案的延伸部分，并且通过焊料实现所述第三电极端子的延伸部分与所述第二电路图案之间的连接。

5. 发明申请

US20090212411A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090212411A1
公开(公告)日：2009-08-27
申请号：US12247515
申请日：2008-10-08
申请人： Masafumi MATSUMOTO , Tatsuya IWASA , Junji YAMADA , Masaru FURUKAWA
发明人： Masafumi MATSUMOTO , Tatsuya IWASA , Junji YAMADA , Masaru FURUKAWA
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L24/43 , H01L23/053 , H01L24/48 , H01L24/85 , H01L2224/43 , H01L2224/451 , H01L2224/48091 , H01L2224/85205 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2224/78 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.
摘要翻译：半导体器件包括热塑性树脂壳体，安装在热塑性树脂壳体内的半导体芯片，具有引线接合表面和相对接触表面的金属端子，以及连接在引线接合表面和半导体芯片之间的线。金属端子的接触表面在与热塑性树脂外壳的内侧的区域热塑性地结合。

6. 发明授权

US07531905B2 Stacked semiconductor device 有权
标题翻译：堆叠半导体器件
公开(公告)号：US07531905B2
公开(公告)日：2009-05-12
申请号：US11651517
申请日：2007-01-10
申请人： Masakzau Ishino , Hiroaki Ikeda , Junji Yamada
发明人： Masakzau Ishino , Hiroaki Ikeda , Junji Yamada
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/02
CPC分类号： H01L25/0657 , H01L24/73 , H01L2224/05573 , H01L2224/05647 , H01L2224/13025 , H01L2224/14181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16235 , H01L2224/17181 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/15184 , H01L2924/15192 , H01L2924/15311 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A stacked semiconductor device includes an interposer substrate having external power supply terminals, and semiconductor chips stacked on the interposer substrate. A power supply wiring arranged in the semiconductor chip located in the bottom layer is connected to the external power supply terminal via a bump electrode, the power supply wiring arranged in the semiconductor chip located in the top layer is connected to the external power supply terminal via a bonding wire, and the power supply wirings each arranged in adjacent semiconductor chips are mutually connected via the through electrode. Such a loop structure can solve a problem such that the higher the semiconductor chip, the larger its voltage drop.
摘要翻译：叠层半导体器件包括具有外部电源端子的内插基板和堆叠在插入器基板上的半导体芯片。布置在位于底层的半导体芯片中的电源布线通过凸块电极连接到外部电源端子，布置在位于顶层的半导体芯片中的电源布线通过外部电源端子经由接合线，并且各自布置在相邻的半导体芯片中的电源布线经由通孔相互连接。这种环路结构可以解决半导体芯片越高电压下降的问题。

7. 发明申请

US20090085188A1 POWER SEMICONDUCTOR MODULE 有权
标题翻译：功率半导体模块
公开(公告)号：US20090085188A1
公开(公告)日：2009-04-02
申请号：US12046046
申请日：2008-03-11
申请人： Junji YAMADA
发明人： Junji YAMADA
IPC分类号： H01L23/48
CPC分类号： H05K3/325 , H01L24/48 , H01L25/072 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/01068 , H01L2924/01078 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H05K2201/10265 , H05K2201/10295 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A power semiconductor module comprising: a power semiconductor element; a case for receiving the power semiconductor element; a control terminal which is connected to a control electrode of the power semiconductor element, the control terminal is installed in a state of protruding from an upper surface of the case; and a conductive spring which is inserted into the control terminal so that an inner surface of the spring makes contact with at least a part of the side surface of the control terminal, the conductive spring is electrically connected to a printed substrate placed as opposed to the upper surface of the case by making pressurization contact with the printed substrate.
摘要翻译：一种功率半导体模块，包括：功率半导体元件; 用于接收功率半导体元件的壳体; 连接到所述功率半导体元件的控制电极的控制端子，所述控制端子被安装在从所述壳体的上表面突出的状态下; 以及导电弹簧，其插入到控制端子中，使得弹簧的内表面与控制端子的侧表面的至少一部分接触，导电弹簧电连接到与通过与印刷基板进行加压接触来使外壳的上表面。

8. 发明申请

US20080150359A1 Semiconductor device and power supply for the same 审中-公开
标题翻译：半导体器件和电源相同
公开(公告)号：US20080150359A1
公开(公告)日：2008-06-26
申请号：US12000884
申请日：2007-12-18
申请人： Junji Yamada
发明人： Junji Yamada
IPC分类号： H02J1/00 , H02J3/00
CPC分类号： H01L23/5286 , H01L23/481 , H01L23/642 , H01L25/0657 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2924/00014 , Y10T307/305 , Y10T307/383 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Low-potential side power supply lines and high-potential side power supply lines of n internal components making up a semiconductor device are sequentially connected in series between a ground voltage GND and a power supply VD. Voltage of a value obtained by adding values of predetermined operating voltage of the components is supplied as power supply for the entire device such that a differential voltage between the low-potential side and high-potential side wiring lines of each component is the predetermined operating voltage. Electric current flowing through the semiconductor device is reduced to 1/n, enabling reduction of voltage drop in the wiring lines.
摘要翻译：构成半导体器件的n个内部部件的低电位侧电源线和高电位侧电源线依次串联连接在接地电压GND和电源VD之间。作为用于整个装置的电源提供通过加上分量的预定工作电压的值而获得的值的电压，使得每个部件的低电位侧和高电位侧布线之间的差分电压是预定的工作电压。流过半导体器件的电流降低到1 / n，能够减少布线中的电压降。

9. 发明授权

US07291928B2 Electric power semiconductor device 有权
标题翻译：电力半导体装置
公开(公告)号：US07291928B2
公开(公告)日：2007-11-06
申请号：US10648347
申请日：2003-08-27
申请人： Junji Yamada , Seiji Saiki
发明人： Junji Yamada , Seiji Saiki
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/49 , H01L24/45 , H01L24/48 , H01L25/072 , H01L2224/451 , H01L2224/48091 , H01L2224/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/014 , H01L2924/14 , H01L2924/19107 , H01L2924/30107 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： Semiconductor chips are connected to electrode terminals (6a, 6b) by wire bonding, and connecting conductors connect extending portions (60b, 60c) extending from a part of the electrode terminals (6b, 6c) to the circuit patterns (3a, 3b) by soldering, and thus the wire bonding points of the electrode terminals are reduced to thereby reduce an electric resistance and suppress heat generation and voltage drop.
摘要翻译：半导体芯片通过引线接合连接到电极端子（6a，6b），连接导体连接从电极端子（6b，6c）的一部分延伸到电路图案的延伸部分（60b，60c）（3a，3b），因此电极端子的引线接合点减小，从而降低电阻并抑制发热和电压降。

10. 发明申请

US20070228456A1 LAMINATED MEMORY HAVING AUTONOMICALLY AND SEQUENTIALLY ACTIVATING OPERATION 失效
标题翻译：具有自动和顺序激活操作的层压记忆体
公开(公告)号：US20070228456A1
公开(公告)日：2007-10-04
申请号：US11690032
申请日：2007-03-22
申请人： Hiroaki Ikeda , Junji Yamada
发明人： Hiroaki Ikeda , Junji Yamada
IPC分类号： H01L29/792
CPC分类号： G11C5/04 , G11C5/02 , G11C5/063 , G11C8/18 , H01L25/0657 , H01L27/0688 , H01L27/105 , H01L2924/0002 , H01L2924/00
摘要： In a laminated memory, each of memory core layers includes a delay circuit having a period of delay time corresponding to a period of operation time of an internal memory circuit portion thereof. A memory core layer, which is input with a simultaneous operation signal, operates in response to the input operation signal. The delay circuit includes an autonomically and sequentially activating function for sending an operation signal to a next stage after the period of delay time passes.
摘要翻译：在层叠存储器中，每个存储核心层包括具有对应于其内部存储器电路部分的操作时间周期的延迟时间的延迟电路。输入同时操作信号的存储核心层响应于输入操作信号而工作。延迟电路包括在延迟时间过去之后将操作信号发送到下一级的自动和顺序启动功能。

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