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    • 1. 发明授权
    • Wafer scrubbing brush core
    • 晶圆洗刷刷芯
    • US06240588B1
    • 2001-06-05
    • US09454698
    • 1999-12-03
    • Tanlin DickeyJulia S. SvirchevskiDonald E. AndersonMike RavkinHelmuth W. TreichelRoy Winston PascalDouglas S. Gardner
    • Tanlin DickeyJulia S. SvirchevskiDonald E. AndersonMike RavkinHelmuth W. TreichelRoy Winston PascalDouglas S. Gardner
    • B05C108
    • H01L21/67046B08B1/04
    • A brush core and the method for making a brush core for use in substrate scrubbing are provided. The substrate can be any substrate that may need to undergo a scrubbing operation to complete a cleaning operation, etching operation, or other preparation. For instance, the substrate can be a semiconductor wafer, a disk, or any other type of work piece that will benefit from a brush core that can deliver uniform controlled amounts of fluid through the brush along an entire length of the brush core. The brush core is defined by a tubular core having a length that extends between a first end and a second end. The first end has an opening into a bore that is defined through a middle of the tubular core and extends along an inner length of the tubular core. A first plurality of holes are oriented along a plurality of first lines that extend in the direction of the length of the tubular core, and each of the first plurality of holes define paths to the bore of the tubular core. A second plurality of holes are oriented along a plurality of second lines that extend in the direction of the length of the tubular core, and each of the second plurality of holes define paths to the core of the tubular core. The plurality of first lines and the plurality of second lines alternate and the holes of the first and second plurality of holes are equally spaced apart. The holes of the second plurality of holes are offset relative to the holes of the first plurality of holes.
    • 提供了刷芯和用于制造用于衬底洗涤的刷芯的方法。 衬底可以是可能需要进行擦洗操作以完成清洁操作,蚀刻操作或其它制备的任何衬底。 例如,衬底可以是半导体晶片,盘或任何其它类型的工件,其将受益于可以沿着刷芯的整个长度输送均匀的受控量的流体通过刷子的刷芯。 刷芯由具有在第一端和第二端之间延伸的长度的管状芯限定。 第一端具有通过管状芯的中间限定并沿着管状芯的内部长度延伸的孔的开口。 第一多个孔沿着沿着管状芯的长度方向延伸的多个第一线定向,并且第一多个孔中的每一个限定到管状芯的孔的通路。 第二多个孔沿着沿着管状芯的长度方向延伸的多个第二线定向,并且第二多个孔中的每一个限定到管状芯的芯的路径。 多个第一线和多个第二线交替,并且第一和第二多个孔的孔等间隔开。 第二多个孔中的孔相对于第一多个孔的孔偏移。
    • 2. 发明授权
    • Wafer scrubbing brush core
    • 晶圆洗刷刷芯
    • US06543084B2
    • 2003-04-08
    • US09863781
    • 2001-05-22
    • Tanlin DickeyJulia S. SvirchevskiDonald E. AndersonMike RavkinHelmuth W. TreichelRoy Winston PascalDouglas S. Gardner
    • Tanlin DickeyJulia S. SvirchevskiDonald E. AndersonMike RavkinHelmuth W. TreichelRoy Winston PascalDouglas S. Gardner
    • A46B1106
    • H01L21/67046B08B1/04
    • A brush core and the method for making a brush core for use in substrate scrubbing are provided. The substrate can be any substrate that may need to undergo a scrubbing operation to complete a cleaning operation, etching operation, or other preparation. For instance, the substrate can be a semiconductor wafer, a disk, or any other type of work piece that will benefit from a brush core that can deliver uniform controlled amounts of fluid through the brush along an entire length of the brush core. The brush core is defined by a tubular core having a length that extends between a first end and a second end. The first end has an opening into a bore that is defined through a middle of the tubular core and extends along an inner length of the tubular core. A first plurality of holes are oriented along a plurality of first lines that extend in the direction of the length of the tubular core, and each of the first plurality of holes define paths to the bore of the tubular core. A second plurality of holes are oriented along a plurality of second lines that extend in the direction of the length of the tubular core, and each of the second plurality of holes define paths to the core of the tubular core. The plurality of first lines and the plurality of second lines alternate and the holes of the first and second plurality of holes are equally spaced apart. The holes of the second plurality of holes are offset relative to the holes of the first plurality of holes.
    • 提供了刷芯和用于制造用于衬底洗涤的刷芯的方法。 衬底可以是可能需要进行擦洗操作以完成清洁操作,蚀刻操作或其它制备的任何衬底。 例如,衬底可以是半导体晶片,盘或任何其它类型的工件,其将受益于可以沿着刷芯的整个长度输送均匀的受控量的流体通过刷子的刷芯。 刷芯由具有在第一端和第二端之间延伸的长度的管状芯限定。 第一端具有通过管状芯的中间限定并沿着管状芯的内部长度延伸的孔的开口。 第一多个孔沿着沿着管状芯的长度方向延伸的多个第一线定向,并且第一多个孔中的每一个限定到管状芯的孔的通路。 第二多个孔沿着沿着管状芯的长度方向延伸的多个第二线定向,并且第二多个孔中的每一个限定到管状芯的芯的路径。 多个第一线和多个第二线交替,并且第一和第二多个孔的孔等间隔开。 第二多个孔中的孔相对于第一多个孔的孔偏移。