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1. 发明公开

EP2841155A1 IMPLANTABLE DEVICE WITH CHASSIS ELEMENT 有权转让
标题翻译：底盘元可植入装置
公开(公告)号：EP2841155A1
公开(公告)日：2015-03-04
申请号：EP13712440.0
申请日：2013-03-12
申请人： Medtronic Inc. , Janzig, Darren A. , Lindner, Gerald G. , Paidosh, Chris J. , Thom, Andrew J. , Tischendorf, Brad C.
发明人： JANZIG, Darren, A. , LINDNER, Gerald, G. , PAIDOSH, Chris, J. , THOM, Andrew, J. , TISCHENDORF, Brad, C.
IPC分类号： A61N1/375
摘要： A implantable active medical device includes a chassis plate having a first major surface and an opposing second major surface, an elongate lead connector fixed to the first major surface and extending orthogonally away from the first major surface and a circuit board fixed to the first major surface and extending orthogonally away from the first major surface. A hermetic housing defines a sealed housing cavity. The hermetic housing is fixed to the first major surface. The elongate lead connector and the circuit board are disposed within the sealed housing cavity.

2. 发明申请

WO2012087370A1 MULTI-ELECTRODE IMPLANTABLE SYSTEMS AND ASSEMBLIES THEREOF 审中-公开
标题翻译：多电极可植入系统及其组合
公开(公告)号：WO2012087370A1
公开(公告)日：2012-06-28
申请号：PCT/US2011/034455
申请日：2011-04-29
申请人： MEDTRONIC, INC. , SOMMER, John, Louis , D'SA, Joseph, Michael , YAMAMOTO, Joyce, K. , TISCHENDORF, Brad, C. , REINKE, James, D. , THOM, Andrew, J. , MILTICH, Thomas, P. , TAYLOR, William, John , GARDESKI, Kenneth, C. , TYLER, Larry, Earl , YORK, Jeffrey, O. , MUNNS, Gordon, O.
发明人： SOMMER, John, Louis , D'SA, Joseph, Michael , YAMAMOTO, Joyce, K. , TISCHENDORF, Brad, C. , REINKE, James, D. , THOM, Andrew, J. , MILTICH, Thomas, P. , TAYLOR, William, John , GARDESKI, Kenneth, C. , TYLER, Larry, Earl , YORK, Jeffrey, O. , MUNNS, Gordon, O.
IPC分类号： A61N1/05
CPC分类号： A61N1/362 , A61N1/05 , A61N1/056 , A61N1/372
摘要： Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi- electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.
摘要翻译：例如，包括IC芯片的密封组件被配置为并入可植入医疗电线的连接器端子内，优选地在端子的接触构件内。组件可以包括焊接到接触构件的任一端的两个馈通子组件，以形成封闭IC芯片的密封胶囊，以及允许内腔沿着端子的长度延伸穿过的管状构件。多电极引线可以包括多路复用器电路，优选地是开关矩阵元件和通信，控制和电源元件，其电耦合到接触构件和端子的另一接触构件。每对开关矩阵开关允许选择任何两个电极，以便通过来自连接器端子连接到的装置/脉冲发生器的刺激脉冲传送刺激矢量。

3. 发明申请

WO2010104622A1 OPTICAL FEEDTHROUGH FOR JOINING MODULAR MEDICAL DEVICES THROUGH THE USE OF A RADIANT ENERGY SOURCE 审中-公开
标题翻译：通过使用辐射能源来接合模块化医疗设备的光学
公开(公告)号：WO2010104622A1
公开(公告)日：2010-09-16
申请号：PCT/US2010/022685
申请日：2010-02-01
申请人： MEDTRONIC, INC. , ROBINSON, Reginald D. , DIFFERDING, David D. , JOHNSON, James A. , LI, Bernard Q. , LINDNER, Gerald G. , TISCHENDORF, Brad C. , THOM, Andrew J.
发明人： ROBINSON, Reginald D. , DIFFERDING, David D. , JOHNSON, James A. , LI, Bernard Q. , LINDNER, Gerald G. , TISCHENDORF, Brad C. , THOM, Andrew J.
IPC分类号： A61N1/375 , B29C65/00
CPC分类号： B23K26/206 , A61N1/375 , B23K26/21 , B29C65/14 , B29C65/1406 , B29C65/16 , B29C65/4845 , B29C66/54 , B29C2035/0827 , G02B6/3897 , G02B6/4248
摘要： In general, the disclosure is directed toward transmitting radiant energy across a boundary of a medical device via an optical feedthrough. A system for transmitting radiant energy across a boundary of a medical device includes a first functional module (30) of a medical device, a second functional module (32) of the medical device, an optical feedthrough assembly (40) coupled to the first functional module, and a radiant energy source (60) that emits a beam (62) through the optical feedthrough assembly to perform a manufacturing process on the first functional module and the second functional module.
摘要翻译：通常，本公开涉及经由光学馈通穿过医疗装置的边界发射辐射能。用于在医疗装置的边界上传送辐射能的系统包括医疗装置的第一功能模块（30），医疗装置的第二功能模块（32），耦合到第一功能模块模块和辐射能源（60），其通过光学馈通组件发射光束（62），以在第一功能模块和第二功能模块上执行制造过程。

4. 发明申请

WO2011053540A1 BRAZING OF CERAMIC TO METAL COMPONENTS 审中-公开
标题翻译：陶瓷对金属部件的制动
公开(公告)号：WO2011053540A1
公开(公告)日：2011-05-05
申请号：PCT/US2010/053896
申请日：2010-10-25
申请人： MEDTRONIC, INC. , REITERER, Markus W. , THOM, Andrew J.
发明人： REITERER, Markus W. , THOM, Andrew J.
IPC分类号： H01G4/35 , A61N1/375 , H01B17/30
CPC分类号： H01G4/35 , A61N1/3754
摘要： A method for making a feedthrough assembly (10) for an implantable electronic medical device (102) comprises providing a metallic ferrule (11) having an outer surface (12) and an aperture (13) defined by an inner lumen surface (14); providing an insulator (20), the insulator having a first surface and a second surface (18, 22). At least one of the first surface and the second surface (18, 22) of the insulator (20) includes a brazing region disposed thereon. The braze material (30) is applied to the brazing region and the insulator (20) is positioned within or around the metallic ferrule (11) such that the positioned insulator (20) brazing region and the metallic ferrule outer surface (12) or inner lumen surface (14) defines a braze gap (16, 24). The braze gap has a width ranging between 10 μm to 50 μm. The feedthrough assembly (10) is then heated at a temperature conducive to melt the braze material (30) in the braze gap (24, 16) thereby forming a hermetic seal between the ferrule (11) and said insulator (20).
摘要翻译：一种用于制造用于可植入电子医疗装置（102）的馈通组件（10）的方法包括提供具有由内腔表面（14）限定的外表面（12）和孔（13）的金属套圈（11）。提供绝缘体（20），所述绝缘体具有第一表面和第二表面（18,22）。绝缘体（20）的第一表面和第二表面（18,22）中的至少一个包括布置在其上的钎焊区域。将钎焊材料（30）施加到钎焊区域，并且绝缘体（20）位于金属套圈（11）内或周围，使得定位的绝缘体（20）钎焊区域和金属套圈外表面（12）或内部管腔表面（14）限定钎焊间隙（16,24）。钎焊间隙的宽度范围在10μm至50μm之间。然后，该馈通组件（10）在有助于将钎焊材料（30）熔化在钎焊间隙（24,16）中的温度下加热，从而在套圈（11）和所述绝缘体（20）之间形成气密密封。

5. 发明申请

WO2011053539A1 CERAMIC COMPONENTS FOR BRAZED FEEDTHROUGHS USED IN IMPLANTABLE MEDICAL DEVICES 审中-公开
标题翻译：用于可植入医疗器械的烧烤饲料的陶瓷组件
公开(公告)号：WO2011053539A1
公开(公告)日：2011-05-05
申请号：PCT/US2010/053889
申请日：2010-10-25
申请人： MEDTRONIC, INC. , REITERER, Markus, W. , THOM, Andrew, J. , NYGREN, Lea, A. , WOLF, Willam, D.
发明人： REITERER, Markus, W. , THOM, Andrew, J. , NYGREN, Lea, A. , WOLF, Willam, D.
IPC分类号： H01G4/35 , A61N1/375 , H01B17/30
CPC分类号： H01G4/35 , A61N1/3754
摘要： A feedthrough assembly, as well as a method of forming a feedthrough assembly, including a metallic ferrule, and a biocompatible, non-conductive, high-temperature, co-fired insulator engaged with the metallic ferrule at an interface between the ferrule and the insulator. The insulator includes a first surface at the interface and a second surface internal to the insulator. At least one conductive member may be disposed at the second surface, wherein at least the first surface of the insulator is devoid of surface cracks greater than 30 µm. The first surface of the insulator may also be devoid of a surface roughness greater than 0.5 µm.
摘要翻译：馈通组件以及形成馈通组件的方法，该馈通组件包括金属套圈以及在金属套圈和绝缘体之间的界面处与金属套圈接合的生物相容，非导电，高温共烧绝缘体。绝缘体包括界面处的第一表面和绝缘体内部的第二表面。至少一个导电构件可以设置在第二表面处，其中绝缘体的至少第一表面没有大于30μm的表面裂纹。绝缘体的第一表面也可以没有大于0.5μm的表面粗糙度。

6. 发明申请

WO2011025667A1 METHOD OF MANUFACTURING A COFIRED FEEDTHROUGH INCLUDING INJECTION MOLDING A FERRULE 审中-公开
标题翻译：通过包括注射成型制造的方法制造FERRULE
公开(公告)号：WO2011025667A1
公开(公告)日：2011-03-03
申请号：PCT/US2010/045331
申请日：2010-08-12
申请人： MEDTRONIC, INC. , REITERER, Markus , TISCHENDORF, Brad, C. , THOM, Andrew, J.
发明人： REITERER, Markus , TISCHENDORF, Brad, C. , THOM, Andrew, J.
IPC分类号： A61N1/375 , B22F7/06 , B22F3/22
CPC分类号： H01B19/00 , A61N1/3754 , B22F3/225 , B22F5/10 , B22F7/062 , B22F7/08 , C04B37/021 , C04B2237/343 , C04B2237/348 , C04B2237/365 , C04B2237/368 , C04B2237/403 , C04B2237/405 , C04B2237/406 , C04B2237/408 , C04B2237/62 , C22C14/00 , C22C19/007 , C22C19/03
摘要： Feedthrough assemblies (100) and methods of manufacturing feedthrough assemblies are provided. Methods include molding a ferrule (110) comprising titanium using metal injection molding and positioning the ferrule about at least a portion of an insulator (120), the insulator comprising alumina. Methods also include overmolding a ferrule about at least a portion of an insulator using metal injection molding, the ferrule comprising titanium and the insulator comprising alumina. Sintering densifies the ferrule and provides a hermetic seal between the ferrule and insulator. The insulator may be fired or unfired prior to sintering of the ferrule.
摘要翻译：提供馈通组件（100）和制造馈通组件的方法。方法包括使用金属注射成型模制包括钛的套圈（110），并且将套圈围绕绝缘体（120）的至少一部分定位，所述绝缘体包括氧化铝。方法还包括使用金属注射成型将套圈围绕绝缘体的至少一部分进行包覆模制，所述套圈包括钛，绝缘体包括氧化铝。烧结使套圈密实，并在套圈和绝缘体之间提供密封。绝缘体可以在烧结之前被烧制或未烧结。

7. 发明申请

WO2010104623A1 SYSTEM AND METHOD FOR RELEASING A MATERIAL WITHIN A MEDICAL DEVICE BY IRRADIATING A SEAL THROUGH AN OPTICAL FEEDTHROUGH 审中-公开
标题翻译：通过照射光学辐射密封而在医疗装置中释放材料的系统和方法
公开(公告)号：WO2010104623A1
公开(公告)日：2010-09-16
申请号：PCT/US2010/022686
申请日：2010-02-01
申请人： MEDTRONIC, INC. , ROBINSON, Reginald D. , DIFFERDING, David D. , JOHNSON, James A. , LI, Bernard Q. , LINDNER, Gerald G. , TISCHENDORF, Brad C. , THOM, Andrew J.
发明人： ROBINSON, Reginald D. , DIFFERDING, David D. , JOHNSON, James A. , LI, Bernard Q. , LINDNER, Gerald G. , TISCHENDORF, Brad C. , THOM, Andrew J.
IPC分类号： A61J1/20 , A61M39/14
CPC分类号： A61M5/14276 , A61M5/1407 , A61M39/04 , A61M2205/368
摘要： In general, the disclosure is directed toward releasing material (61) within a medical device via an optical feedthrough (44). A system (30) for releasing material with a medical device comprises a cup (40) that holds a material, wherein the cup includes a discharge port (46), a seal disc (42) that seals the material within the cup, an optical feedthrough assembly coupled to the cup, a shell (38) that defines a chamber within a medical device, wherein the optical feedthrough assembly is coupled to the shell, and a radiant energy source (50) that shines a beam (52) through the optical feedthrough assembly to puncture the seal disc to allow the material to enter the chamber via the discharge port.
摘要翻译：通常，本公开涉及经由光学馈通（44）在医疗装置内释放材料（61）。用于用医疗装置释放材料的系统（30）包括保持材料的杯（40），其中所述杯包括排出口（46），密封所述杯内的材料的密封盘（42），光学耦合到所述杯的馈通组件，限定医疗装置内的腔室的壳体（38），其中所述光学馈通组件耦合到所述壳体，以及辐射能量源（50），其将光束（52）照射通过所述光学器件馈通组件以刺穿密封盘以允许材料经由排出口进入腔室。

8. 发明申请

WO2013162726A1 IMPLANTABLE DEVICE WITH CHASSIS ELEMENT 审中-公开
标题翻译：具有基座元件的可植入装置
公开(公告)号：WO2013162726A1
公开(公告)日：2013-10-31
申请号：PCT/US2013/030369
申请日：2013-03-12
申请人： MEDTRONIC, INC. , JANZIG, Darren, A. , LINDNER, Gerald, G. , PAIDOSH, Chris, J. , THOM, Andrew, J. , TISCHENDORF, Brad, C.
发明人： JANZIG, Darren, A. , LINDNER, Gerald, G. , PAIDOSH, Chris, J. , THOM, Andrew, J. , TISCHENDORF, Brad, C.
IPC分类号： A61N1/375
CPC分类号： A61N1/3758 , A61N1/375 , A61N1/3752
摘要： A implantable active medical device includes a chassis plate having a first major surface and an opposing second major surface, an elongate lead connector fixed to the first major surface and extending orthogonally away from the first major surface and a circuit board fixed to the first major surface and extending orthogonally away from the first major surface. A hermetic housing defines a sealed housing cavity. The hermetic housing is fixed to the first major surface. The elongate lead connector and the circuit board are disposed within the sealed housing cavity.
摘要翻译：可植入有源医疗装置包括具有第一主表面和相对的第二主表面的底板，固定到第一主表面并且垂直于第一主表面延伸的细长引线连接器和固定到第一主表面的电路板并垂直于第一主表面延伸。密封壳体限定密封的壳体腔。密封壳体固定在第一主表面上。细长引线连接器和电路板设置在密封的壳体腔内。

9. 发明申请

WO2011059682A1 IMPLANTABLE CO-FIRED ELECTRICAL FEEDTHROUGHS 审中-公开
标题翻译：可植入式电动发电机
公开(公告)号：WO2011059682A1
公开(公告)日：2011-05-19
申请号：PCT/US2010/053905
申请日：2010-10-25
申请人： MEDTRONIC, INC. , MUNNS, Gordon, O. , HAUBRICH, Gregory, J. , ENGMARK, David, B. , YAMAMOTO, Joyce , GOLDMAN, Simon , BROSNAN, William M. , TISCHENDORF, Brad, C. , THOM, Andrew, J.
发明人： MUNNS, Gordon, O. , HAUBRICH, Gregory, J. , ENGMARK, David, B. , YAMAMOTO, Joyce , GOLDMAN, Simon , BROSNAN, William M. , TISCHENDORF, Brad, C. , THOM, Andrew, J.
IPC分类号： A61N1/375
CPC分类号： A61N1/3754
摘要： A multilayered feedthrough for an implantable medical device includes a substrate having a first edge, a second edge, and a substrate length. A plurality of traces is formed on the substrate and extends along the substrate length. The plurality of traces extends to the first and second edges of the substrate. An insulator layer is formed on the substrate and the plurality of traces. A ground plane layer is formed on the insulator layer.
摘要翻译：用于可植入医疗装置的多层馈通包括具有第一边缘，第二边缘和基底长度的基底。多个迹线形成在衬底上并且沿衬底长度延伸。多个迹线延伸到衬底的第一和第二边缘。在基板和多个迹线上形成绝缘体层。在绝缘体层上形成接地层。

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