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1. 发明申请

WO2011053540A1 BRAZING OF CERAMIC TO METAL COMPONENTS 审中-公开
标题翻译：陶瓷对金属部件的制动
公开(公告)号：WO2011053540A1
公开(公告)日：2011-05-05
申请号：PCT/US2010/053896
申请日：2010-10-25
申请人： MEDTRONIC, INC. , REITERER, Markus W. , THOM, Andrew J.
发明人： REITERER, Markus W. , THOM, Andrew J.
IPC分类号： H01G4/35 , A61N1/375 , H01B17/30
CPC分类号： H01G4/35 , A61N1/3754
摘要： A method for making a feedthrough assembly (10) for an implantable electronic medical device (102) comprises providing a metallic ferrule (11) having an outer surface (12) and an aperture (13) defined by an inner lumen surface (14); providing an insulator (20), the insulator having a first surface and a second surface (18, 22). At least one of the first surface and the second surface (18, 22) of the insulator (20) includes a brazing region disposed thereon. The braze material (30) is applied to the brazing region and the insulator (20) is positioned within or around the metallic ferrule (11) such that the positioned insulator (20) brazing region and the metallic ferrule outer surface (12) or inner lumen surface (14) defines a braze gap (16, 24). The braze gap has a width ranging between 10 μm to 50 μm. The feedthrough assembly (10) is then heated at a temperature conducive to melt the braze material (30) in the braze gap (24, 16) thereby forming a hermetic seal between the ferrule (11) and said insulator (20).
摘要翻译：一种用于制造用于可植入电子医疗装置（102）的馈通组件（10）的方法包括提供具有由内腔表面（14）限定的外表面（12）和孔（13）的金属套圈（11）。提供绝缘体（20），所述绝缘体具有第一表面和第二表面（18,22）。绝缘体（20）的第一表面和第二表面（18,22）中的至少一个包括布置在其上的钎焊区域。将钎焊材料（30）施加到钎焊区域，并且绝缘体（20）位于金属套圈（11）内或周围，使得定位的绝缘体（20）钎焊区域和金属套圈外表面（12）或内部管腔表面（14）限定钎焊间隙（16,24）。钎焊间隙的宽度范围在10μm至50μm之间。然后，该馈通组件（10）在有助于将钎焊材料（30）熔化在钎焊间隙（24,16）中的温度下加热，从而在套圈（11）和所述绝缘体（20）之间形成气密密封。

2. 发明申请

WO2010104622A1 OPTICAL FEEDTHROUGH FOR JOINING MODULAR MEDICAL DEVICES THROUGH THE USE OF A RADIANT ENERGY SOURCE 审中-公开
标题翻译：通过使用辐射能源来接合模块化医疗设备的光学
公开(公告)号：WO2010104622A1
公开(公告)日：2010-09-16
申请号：PCT/US2010/022685
申请日：2010-02-01
申请人： MEDTRONIC, INC. , ROBINSON, Reginald D. , DIFFERDING, David D. , JOHNSON, James A. , LI, Bernard Q. , LINDNER, Gerald G. , TISCHENDORF, Brad C. , THOM, Andrew J.
发明人： ROBINSON, Reginald D. , DIFFERDING, David D. , JOHNSON, James A. , LI, Bernard Q. , LINDNER, Gerald G. , TISCHENDORF, Brad C. , THOM, Andrew J.
IPC分类号： A61N1/375 , B29C65/00
CPC分类号： B23K26/206 , A61N1/375 , B23K26/21 , B29C65/14 , B29C65/1406 , B29C65/16 , B29C65/4845 , B29C66/54 , B29C2035/0827 , G02B6/3897 , G02B6/4248
摘要： In general, the disclosure is directed toward transmitting radiant energy across a boundary of a medical device via an optical feedthrough. A system for transmitting radiant energy across a boundary of a medical device includes a first functional module (30) of a medical device, a second functional module (32) of the medical device, an optical feedthrough assembly (40) coupled to the first functional module, and a radiant energy source (60) that emits a beam (62) through the optical feedthrough assembly to perform a manufacturing process on the first functional module and the second functional module.
摘要翻译：通常，本公开涉及经由光学馈通穿过医疗装置的边界发射辐射能。用于在医疗装置的边界上传送辐射能的系统包括医疗装置的第一功能模块（30），医疗装置的第二功能模块（32），耦合到第一功能模块模块和辐射能源（60），其通过光学馈通组件发射光束（62），以在第一功能模块和第二功能模块上执行制造过程。

3. 发明申请

WO2010104623A1 SYSTEM AND METHOD FOR RELEASING A MATERIAL WITHIN A MEDICAL DEVICE BY IRRADIATING A SEAL THROUGH AN OPTICAL FEEDTHROUGH 审中-公开
标题翻译：通过照射光学辐射密封而在医疗装置中释放材料的系统和方法
公开(公告)号：WO2010104623A1
公开(公告)日：2010-09-16
申请号：PCT/US2010/022686
申请日：2010-02-01
申请人： MEDTRONIC, INC. , ROBINSON, Reginald D. , DIFFERDING, David D. , JOHNSON, James A. , LI, Bernard Q. , LINDNER, Gerald G. , TISCHENDORF, Brad C. , THOM, Andrew J.
发明人： ROBINSON, Reginald D. , DIFFERDING, David D. , JOHNSON, James A. , LI, Bernard Q. , LINDNER, Gerald G. , TISCHENDORF, Brad C. , THOM, Andrew J.
IPC分类号： A61J1/20 , A61M39/14
CPC分类号： A61M5/14276 , A61M5/1407 , A61M39/04 , A61M2205/368
摘要： In general, the disclosure is directed toward releasing material (61) within a medical device via an optical feedthrough (44). A system (30) for releasing material with a medical device comprises a cup (40) that holds a material, wherein the cup includes a discharge port (46), a seal disc (42) that seals the material within the cup, an optical feedthrough assembly coupled to the cup, a shell (38) that defines a chamber within a medical device, wherein the optical feedthrough assembly is coupled to the shell, and a radiant energy source (50) that shines a beam (52) through the optical feedthrough assembly to puncture the seal disc to allow the material to enter the chamber via the discharge port.
摘要翻译：通常，本公开涉及经由光学馈通（44）在医疗装置内释放材料（61）。用于用医疗装置释放材料的系统（30）包括保持材料的杯（40），其中所述杯包括排出口（46），密封所述杯内的材料的密封盘（42），光学耦合到所述杯的馈通组件，限定医疗装置内的腔室的壳体（38），其中所述光学馈通组件耦合到所述壳体，以及辐射能量源（50），其将光束（52）照射通过所述光学器件馈通组件以刺穿密封盘以允许材料经由排出口进入腔室。

4. 发明申请

WO2020005743A1 SEALED PACKAGE AND METHOD OF FORMING SAME 审中-公开
公开(公告)号：WO2020005743A1
公开(公告)日：2020-01-02
申请号：PCT/US2019/038395
申请日：2019-06-21
申请人： MEDTRONIC, INC.
发明人： THOM, Andrew J. , IYER, Rajesh V. , MUNNS, Gordon O. , NIELSEN, Christian S. , RIES, Andrew J.
IPC分类号： A61N1/372 , A61N1/375 , A61N1/39 , A61N1/378 , A61M37/00 , H04B5/00 , H02J50/00
摘要： Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.

5. 发明申请

WO2020167709A1 A FEEDTHROUGH ASSEMBLY 审中-公开
公开(公告)号：WO2020167709A1
公开(公告)日：2020-08-20
申请号：PCT/US2020/017585
申请日：2020-02-11
申请人： MEDTRONIC, INC.
发明人： TISCHENDORF, Brad C. , THOM, Andrew J.
IPC分类号： A61N1/375 , C03C14/00 , C03C8/24
摘要： A feedthrough assembly includes: a ferrule; an insulating structure; and a seal fixedly securing the insulating structure within the ferrule, the seal comprising a glass and single-phase particulate dispersed therein; wherein the glass includes: 25% to 40% B2O3; 0 to 25% CaO; 0 to 25% MgO; 0 to 25% SrO; 0 to 10% La2O3; 5% to 15% SiO2; and 10% to 20% Al2O3; wherein all percentages are mole percentages of the glass.

6. 发明申请

WO2020086541A1 SEALED PACKAGE AND METHOD OF FORMING SAME 审中-公开
公开(公告)号：WO2020086541A1
公开(公告)日：2020-04-30
申请号：PCT/US2019/057374
申请日：2019-10-22
申请人： MEDTRONIC, INC.
发明人： NIELSEN, Christian S. , IYER, Rajesh V. , MUNNS, Gordon O. , RIES, Andrew J. , THOM, Andrew J.
IPC分类号： A61N1/375 , H01L25/00 , H01L25/16 , H01L25/10
摘要： Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing having an inner surface and an outer surface, a dielectric substrate having a first major surface and a second major surface, and a dielectric bonding ring disposed between the first major surface of the dielectric substrate and the housing, where the dielectric bonding ring is hermetically sealed to both the first major surface of the dielectric substrate and the housing. The package further includes an electronic device disposed on the first major surface of the dielectric substrate, and a power source disposed at least partially within the housing and electrically connected to the electronic device.

7. 发明申请

WO2018194770A3 TOOLLESS LEAD CONNECTOR ASSEMBLY 审中-公开
公开(公告)号：WO2018194770A3
公开(公告)日：2018-10-25
申请号：PCT/US2018/022431
申请日：2018-03-14
申请人： MEDTRONIC, INC.
发明人： IYER, Rajesh V. , ROLES, Randy S. , SCOTT, Erik R. , THOM, Andrew J.
IPC分类号： A61N1/375 , H01R13/59 , H01R13/52
摘要： A lead connector assembly includes a lead receptacle, a sleeve, and a handle for coupling to a medical lead. The lead receptacle has an inner surface and an opening configured to receive the lead. The sleeve is deflectable by the inner surface of the lead receptacle. The sleeve has a distal end portion defining a first outer diameter to engage the lead in a locked position and a second outer diameter greater than the first diameter in an unlocked position. The handle is coupled to the lead receptacle and a proximal end portion of the sleeve to move the sleeve axially in both directions along the longitudinal axis relative to the lead receptacle. The lead connector assembly retains the lead in the locked position. The lead receptacle is couplable to a medical device housing.

8. 发明申请

WO2018194770A2 TOOLLESS LEAD CONNECTOR ASSEMBLY 审中-公开
公开(公告)号：WO2018194770A2
公开(公告)日：2018-10-25
申请号：PCT/US2018/022431
申请日：2018-03-14
申请人： MEDTRONIC, INC.
发明人： IYER, Rajesh V. , ROLES, Randy S. , SCOTT, Erik R. , THOM, Andrew J.
IPC分类号： A61N1/375 , H01R13/59 , H01R13/52
摘要： A lead connector assembly includes a lead receptacle, a sleeve, and a handle for coupling to a medical lead. The lead receptacle has an inner surface and an opening configured to receive the lead. The sleeve is deflectable by the inner surface of the lead receptacle. The sleeve has a distal end portion defining a first outer diameter to engage the lead in a locked position and a second outer diameter greater than the first diameter in an unlocked position. The handle is coupled to the lead receptacle and a proximal end portion of the sleeve to move the sleeve axially in both directions along the longitudinal axis relative to the lead receptacle. The lead connector assembly retains the lead in the locked position. The lead receptacle is couplable to a medical device housing.

9. 发明公开

EP3924043A1 A FEEDTHROUGH ASSEMBLY 有权
公开(公告)号：EP3924043A1
公开(公告)日：2021-12-22
申请号：EP20709984.7
申请日：2020-02-11
申请人： Medtronic, Inc.
发明人： TISCHENDORF, Brad C. , THOM, Andrew J.
IPC分类号： A61N1/375 , C03C14/00 , C03C8/24

10. 发明公开

EP3870277A1 SEALED PACKAGE AND METHOD OF FORMING SAME 审中-公开
公开(公告)号：EP3870277A1
公开(公告)日：2021-09-01
申请号：EP19802379.8
申请日：2019-10-22
申请人： Medtronic Inc.
发明人： NIELSEN, Christian S. , IYER, Rajesh V. , MUNNS, Gordon O. , RIES, Andrew J. , THOM, Andrew J.
IPC分类号： A61N1/375 , H01L25/00 , H01L25/16 , H01L25/10

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