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1. 发明授权

US5960866A Method for manufacturing cooling unit comprising heat pipes and cooling unit 失效
标题翻译：制造包括热管和冷却单元的冷却单元的方法
公开(公告)号：US5960866A
公开(公告)日：1999-10-05
申请号：US970439
申请日：1997-11-14
申请人： Yuichi Kimura , Masaaki Yamamoto , Suemi Tanaka
发明人： Yuichi Kimura , Masaaki Yamamoto , Suemi Tanaka
IPC分类号： F28D15/02 , H01L23/427 , F28D15/00
CPC分类号： F28D15/0233 , F28D15/0275 , H01L23/427 , F28F2275/02 , H01L2924/0002 , Y10T29/4935 , Y10T29/49359 , Y10T29/49913
摘要： The present invention relates to a cooling unit for electronic devices wherein the manufacturing method comprises the steps of: (a) preparing a plate-type metal block for removing heat generated from an electronic component, the metal block having holes in the thickness part of the metal block and having convex portions formed on one main surface or both main surfaces of the metal block; (b) inserting heat pipes into the holes; and (c) applying a local and two-dimensional force from the surface of the metal block to the convex portions to make the surface flat bringing the outer surface of each heat pipe into close contact with the inner wall of each hole in the metal block.
摘要翻译：本发明涉及一种用于电子设备的冷却单元，其中制造方法包括以下步骤：（a）制备用于去除由电子部件产生的热量的板式金属块，所述金属块在所述厚度部分中具有孔金属块，并且具有形成在所述金属块的一个主表面或两个主表面上的凸部; （b）将热管插入孔中; 和（c）将金属块表面的局部和二维力施加到凸部，使得表面平坦，使得每个热管的外表面与金属块中每个孔的内壁紧密接触。

2. 发明授权

US5409055A Heat pipe type radiation for electronic apparatus 失效
标题翻译：电子仪器用热管式辐射
公开(公告)号：US5409055A
公开(公告)日：1995-04-25
申请号：US35376
申请日：1993-03-22
申请人： Suemi Tanaka , Junji Sotani , Kenichi Nanba
发明人： Suemi Tanaka , Junji Sotani , Kenichi Nanba
IPC分类号： F28D15/02 , F28F3/02 , H01L23/427 , H05K7/20 , F28D15/00
CPC分类号： F28D15/0233 , F28F3/025 , H01L23/427 , H01L2924/0002
摘要： A heat pipe type radiator is formed with a cooling plate mounted on an evaporative section of a heat pipe and a flat heat conductive plate mounted on a condenser section. Heat-generating electronic components are brought into contact with the cooling plate and a radiation fin molded from a thin plate in a wave form is mounted on both surfaces of the heat conductive plate. Other embodiments of the radiation fin include a skived fin formed by skiving a flat plate in an arch form, a pin fin and a wire fin which are composed of and so forth. Since each of these fins has the large surface area for heat radiation per unit volume and is small in weight, it is suitable to use for a heat pipe type radiator for an electronic apparatus. The heat generated in the electronic components transported to the heat conductive plate through the cooling plate and the heat pipe is radiated from the entire surface of the radiation fin to the ambient air. The heat conductive plate is molded in a flat form and, therefore, the heat generated in the electronic components can conduct to the portion most remote from the heat pipe. Further, since the radiation fin has a large surface area for heat radiation per unit volume, the heat radiation capability is improved.
摘要翻译：热管式散热器形成有安装在热管的蒸发部分上的冷却板和安装在冷凝器部分上的平坦的导热板。发热电子部件与冷却板接触，并且将由波形薄板成型的散热片安装在导热板的两个表面上。辐射翅片的其它实施例包括通过以弓形形式平展平板，销翅片和线翅片等形成的刮刀翅片。由于这些翅片中的每一个具有用于每单位体积的热辐射的大的表面积并且重量轻，因此适合用于电子设备的热管式散热器。通过冷却板和热管输送到导热板的电子部件产生的热量从辐射翅片的整个表面辐射到周围空气。导热板被模制成平坦的形式，因此，电子部件中产生的热可以传导到最远离热管的部分。此外，由于辐射翅片具有用于每单位体积的热辐射的大的表面积，因此散热能力得到改善。

3. 发明授权

US4982274A Heat pipe type cooling apparatus for semiconductor 失效
标题翻译：半导体热管式冷却装置
公开(公告)号：US4982274A
公开(公告)日：1991-01-01
申请号：US284072
申请日：1988-12-14
申请人： Takashi Murase , Suemi Tanaka
发明人： Takashi Murase , Suemi Tanaka
IPC分类号： H01L23/427
CPC分类号： F28D15/0275 , F28D15/046 , H01L23/427 , F28F1/32 , F28F2265/30 , H01L2924/0002 , H01L2924/09701
摘要： A heat pipe type cooling apparatus for a semiconductor, comprises a plurality of first copper pipes, each of the first pipes having a plurality of V-shaped grooves formed in an inner surface thereof and arranged in a circumferential direction thereof, and a plurality of second copper pipes, each of the second pipes having a plurality of second grooves formed in an inner surface thereof, each of the second grooves having an opening narrower than an inner part thereof. A plurality of ceramic pipes connect the first pipes and the second pipes, through intermediate pipes made of a nickel-iron alloy. One end of each of the second pipes is inserted in a metal block on which a semiconductor is mounted.
摘要翻译：一种用于半导体的热管式冷却装置，包括多个第一铜管，所述第一管中的每一个在其内表面中形成有多个V形槽，并且沿其周向布置多个第二铜管，铜管，每个第二管具有形成在其内表面中的多个第二槽，每个第二槽具有比其内部窄的开口。多个陶瓷管通过由镍 - 铁合金制成的中间管连接第一管和第二管。每个第二管的一端插入安装半导体的金属块中。

4. 发明授权

US06189213B1 Method for manufacturing cooling unit comprising heat pipes and cooling unit 有权
标题翻译：制造包括热管和冷却单元的冷却单元的方法
公开(公告)号：US06189213B1
公开(公告)日：2001-02-20
申请号：US09356180
申请日：1999-07-16
申请人： Yuichi Kimura , Masaaki Yamamoto , Suemi Tanaka
发明人： Yuichi Kimura , Masaaki Yamamoto , Suemi Tanaka
IPC分类号： B23P1500
CPC分类号： F28D15/0233 , F28D15/0275 , F28F2275/02 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , Y10T29/49359 , Y10T29/49913 , H01L2924/00
摘要： The present invention relates to a cooling unit for electronic devices wherein the manufacturing method comprises the steps of: (a) preparing a plate-type metal block for removing heat generated from an electronic component, the metal block having holes in the thickness part of the metal block and having convex portions formed on one main surface or both main surfaces of the metal block; (b) inserting heat pipes into the holes; and (c) applying a local and two-dimensional force from the surface of the metal block to the convex portions to make the surface flat bringing the outer surface of each heat pipe into close contact with the inner wall of each hole in the metal block.
摘要翻译：本发明涉及一种用于电子设备的冷却单元，其中制造方法包括以下步骤：（a）制备用于去除由电子部件产生的热量的板式金属块，所述金属块在所述厚度部分中具有孔金属块，并且具有形成在所述金属块的一个主表面或两个主表面上的凸部; （b）将热管插入孔中; 和（c）将金属块表面的局部和二维力施加到凸部，使得表面平坦，使得每个热管的外表面与金属块中每个孔的内壁紧密接触。

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