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1. 发明授权

US6099702A Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability 失效
标题翻译：具有旋转晶片保持器和预润湿和冲洗能力的电镀室
公开(公告)号：US6099702A
公开(公告)日：2000-08-08
申请号：US96015
申请日：1998-06-10
申请人： Jonathan D. Reid , Steven W. Taatjes , Robert J. Contolini , Evan E. Patton
发明人： Jonathan D. Reid , Steven W. Taatjes , Robert J. Contolini , Evan E. Patton
IPC分类号： C25D7/12 , C25D17/06 , C25D21/00 , C25D21/08 , H01L21/00
CPC分类号： H01L21/67034 , C25D17/06 , C25D21/00 , C25D21/08 , C25D21/18 , C25D21/20 , C25D7/123
摘要： A plating cell has an inner plating bath container for performing electroplating on a work piece (e.g., a wafer) submerged in a solution contained by the inner plating bath container. A reclaim inlet funnels any solution overflowing the inner plating bath container back into a reservoir container to be circulated back into the inner plating bath container. A waste channel is also provided having an inlet at a different height than the inlet of the reclaim channel. After electroplating, the wafer is lifted to a position and spun. While spinning, the wafer is thoroughly rinse with, for example, ultra pure water. The spin rate and height of the wafer determine whether the water and solution are reclaimed through the reclaim channel or disposed through the waste channel.
摘要翻译：电镀槽具有内浸镀液容器，用于在浸没在由内镀浴容器所包含的溶液中的工件（例如，晶片）上进行电镀。回收入口将任何溢出内部镀浴容器的溶液漏回到储存容器中，以循环回内部镀浴容器。还提供废物通道，其具有与回收通道的入口不同的高度的入口。电镀后，将晶片提升到一个位置并旋转。在旋转的同时，将晶片用例如超纯水彻底冲洗。晶圆的旋转速度和高度决定了水和溶液是通过回收通道还是通过废物通道进行回收。

2. 发明授权

US3940906A Method of and apparatus for forming packages 失效
标题翻译：用于形成包装的方法和装置
公开(公告)号：US3940906A
公开(公告)日：1976-03-02
申请号：US520681
申请日：1974-11-04
申请人： Lee M. Leckband , Steven W. Taatjes
发明人： Lee M. Leckband , Steven W. Taatjes
IPC分类号： B65B9/13 , B65B57/14 , B65B9/16
CPC分类号： B65B9/13 , B65B57/14
摘要： A supply of hose-shaped wrapping material is pleated axially and fits telescopically about the outer surface of a forming tube. A portion of the wrapping material extends over the upper rim of the tube and downwardly through the tube bore to a position below the lower rim of the tube where it is fastened in a tightly gathered together manner. A gate, positioned below the lower rim of the tube, supports articles fed into the wrapping material in the tube bore. This gate is movable to a position which allows the articles and wrapping material to drop downwardly through the bore to a position below the gate. Such downward movement of the wrapping material draws another portion of wrapping material into the bore of the forming tube. By supporting the wrapping material and accumulated articles at a position above the fastened end of the wrapping material, the lowermost article within the wrapping material will drop from the position of support to the fastened end of the wrapping material upon removal of the support. This results in a downward pull on the wrapping material to break up any bridging of articles in the tube. After one batch of articles in the wrapping material has dropped below the gate, the gate returns to a position underlying the forming tube for supporting another batch of articles while the wrapping material below the gate and above the first batch of articles is being fastened and severed to provide the completed article package.
摘要翻译：软管形包装材料的供应物轴向地打褶并围绕成形管的外表面可伸缩地配合。包裹材料的一部分在管的上边缘上延伸并向下延伸通过管孔到位于管的下边缘下方的紧固在一起的方式的位置。位于管的下边缘下方的门支撑进入管孔中的包装材料的物品。该门可移动到允许物品和包裹材料通过孔向下落到位于门下方的位置的位置。包装材料的这种向下运动将另一部分包装材料吸入成形管的孔中。通过在包装材料的紧固端的上方的位置支撑包裹材料和积聚的物品，包装材料中的最下面的物品在移除支撑件时将从支撑件的位置下降到包裹材料的紧固端。这导致包裹材料向下拉，以破坏管中物品的任何桥接。在包装材料中的一批物品落在浇口下方之后，浇口返回到成形管下方的一个位置，用于支撑另一批物品，同时门下方的包装材料和第一批物品上方的包装材料被固定和切断提供完整的文章包。

3. 发明授权

US06716334B1 Electroplating process chamber and method with pre-wetting and rinsing capability 有权
标题翻译：电镀工艺室和预润湿和冲洗能力的方法
公开(公告)号：US06716334B1
公开(公告)日：2004-04-06
申请号：US09829848
申请日：2001-04-09
申请人： Jonathan D. Reid , Steven W. Taatjes , Robert J. Contolini , Evan E. Patton
发明人： Jonathan D. Reid , Steven W. Taatjes , Robert J. Contolini , Evan E. Patton
IPC分类号： C25D502
CPC分类号： H01L21/67034 , C25D7/123 , C25D17/001 , C25D17/06 , C25D21/00 , C25D21/08 , C25D21/18
摘要： A plating cell has an inner plating bath container for performing electroplating on a work piece (e.g., a wafer) submerged in a solution contained by the inner plating bath container. A reclaim inlet funnels any solution overflowing the inner plating bath container back into a reservoir container to be circulated back into the inner plating bath container. A waste channel is also provided having an inlet at a different height than the inlet of the reclaim channel. After electroplating, the wafer is lifted to a position and spun. While spinning, the wafer is thoroughly rinse with, for example, ultra pure water. The spin rate and height of the wafer determine whether the water and solution are reclaimed through the reclaim channel or disposed through the waste channel.
摘要翻译：电镀槽具有内浸镀液容器，用于在浸没在由内镀浴容器所包含的溶液中的工件（例如，晶片）上进行电镀。回收入口将任何溢出内部镀浴容器的溶液漏回到储存容器中，以循环回内部镀浴容器。还提供废物通道，其具有与回收通道的入口不同的高度的入口。电镀后，将晶片提升到一个位置并旋转。在旋转的同时，将晶片用例如超纯水彻底冲洗。晶圆的旋转速度和高度决定了水和溶液是通过回收通道还是通过废物通道进行回收。

4. 发明授权

US06214193B1 Electroplating process including pre-wetting and rinsing 有权
标题翻译：电镀工艺包括预润湿和冲洗
公开(公告)号：US06214193B1
公开(公告)日：2001-04-10
申请号：US09374253
申请日：1999-08-13
申请人： Jonathan D. Reid , Steven W. Taatjes , Robert J. Contolini , Evan E. Patton
发明人： Jonathan D. Reid , Steven W. Taatjes , Robert J. Contolini , Evan E. Patton
IPC分类号： C25D502
CPC分类号： H01L21/67034 , C25D7/123 , C25D17/06 , C25D21/00 , C25D21/08 , C25D21/18 , C25D21/20
摘要： A plating cell has an inner plating bath container for performing electroplating on a work piece (e.g., a wafer) submerged in a solution contained by the inner plating bath container. A reclaim inlet funnels any solution overflowing the inner plating bath container back into a reservoir container to be circulated back into the inner plating bath container. A waste channel is also provided having an inlet at a different height than the inlet of the reclaim channel. After electroplating, the wafer is lifted to a position and spun. While spinning, the wafer is thoroughly rinse with, for example, ultra pure water. The spin rate and height of the wafer determine whether the water and solution are reclaimed through the reclaim channel or disposed through the waste channel.
摘要翻译：电镀槽具有内浸镀液容器，用于在浸没在由内镀浴容器所包含的溶液中的工件（例如，晶片）上进行电镀。回收入口将任何溢出内部镀浴容器的溶液漏回到储存容器中，以循环回内部镀浴容器。还提供废物通道，其具有与回收通道的入口不同的高度的入口。电镀后，将晶片提升到一个位置并旋转。在旋转的同时，将晶片用例如超纯水彻底冲洗。晶圆的旋转速度和高度决定了水和溶液是通过回收通道还是通过废物通道进行回收。

5. 发明授权

US06167893A Dynamic chuck for semiconductor wafer or other substrate 有权
标题翻译：用于半导体晶片或其他基板的动态卡盘
公开(公告)号：US06167893A
公开(公告)日：2001-01-02
申请号：US09248169
申请日：1999-02-09
申请人： Steven W. Taatjes , John F. Ostrowski
发明人： Steven W. Taatjes , John F. Ostrowski
IPC分类号： B08B302
CPC分类号： H01L21/68728 , Y10S134/902 , Y10S414/141
摘要： A dynamic chuck for holding a semiconductor wafer or other substrate includes a plurality of clamping arms mounted radially about a central axis of rotation of the wafer or other substrate. Each of the arms is mounted such that it is free to pivot about a horizontal axis. As the chuck rotates the substrate, a centrifugal force acts on each of the arms, causing it to pivot about its axis of rotation and thereby forcing a holding surface of the arm against a peripheral edge of the substrate. The dynamic chuck is applicable to any type of device in which a semiconductor wafer or other substrate must be held in a centered positioned while it is being spun, including wafer cleaning and rinsing apparatus.
摘要翻译：用于保持半导体晶片或其它基板的动态卡盘包括围绕晶片或其他基板的中心旋转轴线径向安装的多个夹持臂。每个臂被安装成使得其可绕水平轴自由枢转。当卡盘旋转基板时，离心力作用在每个臂上，使得其绕其旋转轴线枢转，从而迫使臂的保持表面抵靠基板的周边边缘。动态卡盘适用于任何类型的装置，其中半导体晶片或其它基板必须在被旋转的同时保持在居中定位状态，包括晶片清洗和冲洗装置。

6. 发明授权

US4389296A Edge contacting plating electrode 失效
标题翻译：边缘接触电镀电极
公开(公告)号：US4389296A
公开(公告)日：1983-06-21
申请号：US360743
申请日：1982-03-22
申请人： Michael Seyffert , Steven W. Taatjes
发明人： Michael Seyffert , Steven W. Taatjes
IPC分类号： C25D17/00
CPC分类号： C25D17/005
摘要： A contact for making electrical connections to a moving strip of metal, so as to permit plating the strip, in which grooved members engage just the edges of the strip, thus avoiding scratches on the face of the strip.
摘要翻译：用于与移动的金属条形成电连接的接触件，以便允许电镀该条带，其中沟槽部件仅接合条带的边缘，从而避免在带材表面上划伤。

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