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1. 发明申请

US20110209984A1 Physical Vapor Deposition With Multi-Point Clamp 有权
标题翻译：物理气相沉积与多点夹
公开(公告)号：US20110209984A1
公开(公告)日：2011-09-01
申请号：US12714409
申请日：2010-02-26
申请人： Jeffrey Birkmeyer , Youming Li , Steve Deming , Mats G. Ottosson
发明人： Jeffrey Birkmeyer , Youming Li , Steve Deming , Mats G. Ottosson
IPC分类号： C23C14/34
CPC分类号： C23C14/3407 , C23C14/50 , H01J37/32495 , H01J37/32697 , H01J37/32715 , H01J37/32724 , H01J37/34 , H01J37/3405
摘要： A physical vapor deposition apparatus includes a vacuum chamber having side walls, a cathode inside the vacuum chamber, wherein the cathode is configured to include a sputtering target, a radio frequency power supply configured to apply power to the cathode, an anode inside and electrically connected to the side walls of the vacuum chamber, a chuck inside and electrically isolated from the side walls of the vacuum chamber, the chuck configured to support a substrate, a clamp configured to hold the substrate to the chuck, wherein the clamp is electrically conductive, and a plurality of conductive electrodes attached to the clamp, each electrode configured to compress when contacted by the substrate.
摘要翻译：物理气相沉积装置包括具有侧壁的真空室，真空室内部的阴极，其中阴极被配置为包括溅射靶，配置为向阴极施加电力的射频电源，内部并电连接的阳极到真空室的侧壁，卡盘位于真空室的侧壁内并与真空室的侧壁电隔离，卡盘被配置为支撑基板，夹具被配置为将基板保持在卡盘上，其中夹具是导电的，以及附接到所述夹具的多个导电电极，每个电极构造成当与所述基板接触时被压缩。

2. 发明申请

US20110168317A1 Controlled Bond Wave Over Patterned Wafer 审中-公开
标题翻译：受控结合波形图案化晶圆
公开(公告)号：US20110168317A1
公开(公告)日：2011-07-14
申请号：US12686278
申请日：2010-01-12
申请人： Steve Deming , Zhenfang Chen , Micheal Rocchio , Hugo J. Miller
发明人： Steve Deming , Zhenfang Chen , Micheal Rocchio , Hugo J. Miller
IPC分类号： B29C65/00
CPC分类号： H01L21/67092
摘要： A method of bonding two substrates includes placing a separating member between a first substrate and a second substrate, applying pressure to the first substrate to initiate a bond wave between the first substrate and the second substrates with the separating member between the first substrate and the second substrate, and controlling movement of the bond wave by translating the separating member away from a center of the first substrate or the second substrate.
摘要翻译：接合两个基板的方法包括将分离构件放置在第一基板和第二基板之间，向第一基板施加压力，以在第一基板和第二基板之间的分离构件在第一基板和第二基板之间引发接合波，并且通过将分离构件平移离开第一基板或第二基板的中心来控制键合波的移动。

3. 发明授权

US08240817B2 Bonded housing and fluid ejector 有权
标题翻译：粘合外壳和流体喷射器
公开(公告)号：US08240817B2
公开(公告)日：2012-08-14
申请号：US12616108
申请日：2009-11-10
申请人： Steve Deming
发明人： Steve Deming
IPC分类号： B41J2/04
CPC分类号： B41J2/14 , B29C65/342 , B29C65/346 , B29C65/3476 , B29C65/3484 , B29C65/4835 , B29C66/71 , B29C66/91214 , B29C66/91221 , B29C66/91317 , B29C66/91411 , B29C66/91655 , B29C66/919 , B29C66/949 , B29K2083/00 , B29K2105/0079 , B29L2031/767 , B41J2/16 , B41J2/1623 , B41J2002/14491 , B41J2202/19 , B41J2202/20 , B29K2079/08
摘要： A method of forming a fluid ejector includes positioning a fluid ejection module such that it is adjacent to a mounting frame, applying heat to a thermohardening glue that is between the fluid ejection module and the mounting frame, and curing the glue to secure the fluid ejection module to the mounting frame. The heat is applied with a heating element at least partially embedded in the glue.
摘要翻译：形成流体喷射器的方法包括定位流体喷射模块，使得其与安装框架相邻，向位于流体喷射模块和安装框架之间的热硬化胶施加热量，并固化胶水以固定流体喷射模块到安装框架。加热至少部分地嵌入胶中的加热元件。

4. 发明申请

US20110109697A1 Bonded Housing and Fluid Ejector 有权
标题翻译：粘合外壳和流体喷射器
公开(公告)号：US20110109697A1
公开(公告)日：2011-05-12
申请号：US12616108
申请日：2009-11-10
申请人： Steve Deming
发明人： Steve Deming
IPC分类号： B41J2/04 , B29C65/02
CPC分类号： B41J2/14 , B29C65/342 , B29C65/346 , B29C65/3476 , B29C65/3484 , B29C65/4835 , B29C66/71 , B29C66/91214 , B29C66/91221 , B29C66/91317 , B29C66/91411 , B29C66/91655 , B29C66/919 , B29C66/949 , B29K2083/00 , B29K2105/0079 , B29L2031/767 , B41J2/16 , B41J2/1623 , B41J2002/14491 , B41J2202/19 , B41J2202/20 , B29K2079/08
摘要： A method of forming a fluid ejector includes positioning a fluid ejection module such that it is adjacent to a mounting frame, applying heat to a thermohardening glue that is between the fluid ejection module and the mounting frame, and curing the glue to secure the fluid ejection module to the mounting frame. The heat is applied with a heating element at least partially embedded in the glue.
摘要翻译：形成流体喷射器的方法包括定位流体喷射模块，使得其与安装框架相邻，向位于流体喷射模块和安装框架之间的热硬化胶施加热量，并固化胶水以固定流体喷射模块到安装框架。加热至少部分地嵌入胶中的加热元件。

5. 发明申请

US20110006135A1 FLUID EJECTOR HOUSING INSERT 有权
标题翻译：流体喷射器外壳插件
公开(公告)号：US20110006135A1
公开(公告)日：2011-01-13
申请号：US12500557
申请日：2009-07-09
申请人： Kevin Von Essen , Andreas Bibl , John A. Higginson , Steve Deming , Mats G. Ottosson
发明人： Kevin Von Essen , Andreas Bibl , John A. Higginson , Steve Deming , Mats G. Ottosson
IPC分类号： B05B1/14
CPC分类号： B41J25/34
摘要： A fluid ejector includes a fluid ejection assembly, a housing, and an insert. The fluid ejection assembly includes one or more silicon bodies and a plurality of actuators. The one or more silicon bodies includes a silicon body having a plurality of fluid passages for fluid flow and a plurality of nozzles fluidically connected to the plurality of fluid passages. The plurality of actuators cause fluid in the plurality of fluid passages to be ejected from the plurality of nozzles. The housing assembly includes one or more plastic bodies, at least one plastic body attached to at least one silicon body to form a sealed volume on a side of the fluid ejection assembly opposite the nozzles. The insert is embedded in the at least one plastic body in proximity to the at least one silicon body, the insert having a coefficient of thermal expansion of less than 9 ppm/° C.
摘要翻译：流体喷射器包括流体喷射组件，壳体和插入件。流体喷射组件包括一个或多个硅体和多个致动器。一个或多个硅体包括具有多个用于流体流动的流体通道的硅体和与多个流体通道流体连接的多个喷嘴。多个致动器使多个流体通道中的流体从多个喷嘴喷出。壳体组件包括一个或多个塑料体，至少一个塑料体附接到至少一个硅体，以在流体喷射组件的与喷嘴相对的一侧上形成密封体积。插入件嵌入在至少一个硅体附近的至少一个塑料体中，插入件的热膨胀系数小于9ppm /℃。

6. 发明授权

US06941980B2 Apparatus and method for filling a receptacle with powder 失效
标题翻译：用粉末填充容器的装置和方法
公开(公告)号：US06941980B2
公开(公告)日：2005-09-13
申请号：US10430692
申请日：2003-05-05
申请人： Michael J. Rocchio , Gordon Stout , Steve Deming , Diane Brannigan , Derrick J. Parks , Dale Ploeger
发明人： Michael J. Rocchio , Gordon Stout , Steve Deming , Diane Brannigan , Derrick J. Parks , Dale Ploeger
IPC分类号： A61J3/07 , B65B1/24 , B65B1/04
CPC分类号： A61J3/074 , B65B1/24
摘要： An apparatus for filling a receptacle comprises a reservoir adapted to contain a supply of powder pharmaceutical formulation, a holder adapted to hold a receptacle in a position where it may receive powder from the reservoir, an extension extending above the receptacle, and a plunger moveable within the extension, whereby powder from the supply may fill the receptacle and at least a portion of the extension and the plunger may force the powder in the extension into the receptacle. In one version, the plunger may be a portion of the receptacle or may be adapted to install a portion of the receptacle. Alternatively, vibrational or other energy may be used to cause powder in the extension to be filled in the receptacle.
摘要翻译：用于填充容器的装置包括适于容纳粉末药物制剂供应的储存器，适于将容器保持在其中可从容器接收粉末的位置的保持器，在容器上方延伸的延伸部，以及可在内部移动的柱塞延伸部分，由此来自供应的粉末可以填充容器，并且延伸部分的至少一部分和柱塞可以将延伸部分中的粉末强制进入容器。在一个版本中，柱塞可以是插座的一部分，或者可以适于安装容器的一部分。或者，可以使用振动或其他能量使得延伸部中的粉末填充在容器中。

7. 发明授权

US08133362B2 Physical vapor deposition with multi-point clamp 有权
标题翻译：物理气相沉积与多点夹
公开(公告)号：US08133362B2
公开(公告)日：2012-03-13
申请号：US12714409
申请日：2010-02-26
申请人： Jeffrey Birkmeyer , Youming Li , Steve Deming , Mats G. Ottosson
发明人： Jeffrey Birkmeyer , Youming Li , Steve Deming , Mats G. Ottosson
IPC分类号： C23C14/34
CPC分类号： C23C14/3407 , C23C14/50 , H01J37/32495 , H01J37/32697 , H01J37/32715 , H01J37/32724 , H01J37/34 , H01J37/3405
摘要： A physical vapor deposition apparatus includes a vacuum chamber having side walls, a cathode inside the vacuum chamber, wherein the cathode is configured to include a sputtering target, a radio frequency power supply configured to apply power to the cathode, an anode inside and electrically connected to the side walls of the vacuum chamber, a chuck inside and electrically isolated from the side walls of the vacuum chamber, the chuck configured to support a substrate, a clamp configured to hold the substrate to the chuck, wherein the clamp is electrically conductive, and a plurality of conductive electrodes attached to the clamp, each electrode configured to compress when contacted by the substrate.
摘要翻译：物理气相沉积装置包括具有侧壁的真空室，真空室内部的阴极，其中阴极被配置为包括溅射靶，配置为向阴极施加电力的射频电源，内部并电连接的阳极到真空室的侧壁，卡盘位于真空室的侧壁内并与真空室的侧壁电隔离，卡盘被配置为支撑基板，夹具被配置为将基板保持在卡盘上，其中夹具是导电的，以及附接到所述夹具的多个导电电极，每个电极构造成当与所述基板接触时被压缩。

8. 发明授权

US08240796B2 Fluid ejector housing insert 有权
标题翻译：流体喷射器壳体插入
公开(公告)号：US08240796B2
公开(公告)日：2012-08-14
申请号：US12500557
申请日：2009-07-09
申请人： Kevin Von Essen , Andreas Bibl , John A. Higginson , Steve Deming , Mats G. Ottosson
发明人： Kevin Von Essen , Andreas Bibl , John A. Higginson , Steve Deming , Mats G. Ottosson
IPC分类号： B41J29/38
CPC分类号： B41J25/34
摘要： A fluid ejector includes a fluid ejection assembly, a housing, and an insert. The fluid ejection assembly includes one or more silicon bodies and a plurality of actuators. The one or more silicon bodies includes a silicon body having a plurality of fluid passages for fluid flow and a plurality of nozzles fluidically connected to the plurality of fluid passages. The plurality of actuators cause fluid in the plurality of fluid passages to be ejected from the plurality of nozzles. The housing assembly includes one or more plastic bodies, at least one plastic body attached to at least one silicon body to form a sealed volume on a side of the fluid ejection assembly opposite the nozzles. The insert is embedded in the at least one plastic body in proximity to the at least one silicon body, the insert having a coefficient of thermal expansion of less than 9 ppm/° C.
摘要翻译：流体喷射器包括流体喷射组件，壳体和插入件。流体喷射组件包括一个或多个硅体和多个致动器。一个或多个硅体包括具有多个用于流体流动的流体通道的硅体和与多个流体通道流体连接的多个喷嘴。多个致动器使多个流体通道中的流体从多个喷嘴喷出。壳体组件包括一个或多个塑料体，至少一个塑料体附接到至少一个硅体，以在流体喷射组件的与喷嘴相对的一侧上形成密封体积。插入件嵌入在至少一个硅体附近的至少一个塑料体中，插入件的热膨胀系数小于9ppm /℃。

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