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1. 发明授权

US06731853B2 Multiple fiber chip clamp 失效
标题翻译：多纤芯片夹
公开(公告)号：US06731853B2
公开(公告)日：2004-05-04
申请号：US09928656
申请日：2001-08-14
申请人： Robert A. Boudreau , Chris P. Brophy , Lawrence Charles Hughes, Jr. , Mark F. Krol , Deepukumar M. Nair , Songsheng Tan , Aniruddha S. Weling
发明人： Robert A. Boudreau , Chris P. Brophy , Lawrence Charles Hughes, Jr. , Mark F. Krol , Deepukumar M. Nair , Songsheng Tan , Aniruddha S. Weling
IPC分类号： G02B600
CPC分类号： G02B6/3636 , G02B6/3644 , G02B6/3652 , G02B6/3672 , G02B6/3839
摘要： An optical fiber clamp that precisely aligns and clamps multiple optical fibers in multi-channel freespace optical systems, eliminates multiple parts and simplifies assembly. Multiple wafers each having an array of holes passing therethrough, are aligned with respect to each other. Optical fibers are passed through the holes, and at least one of the wafers is moved laterally with respect to the other wafers, so that sidewalls of the holes clamp the optical fibers into a desired location.
摘要翻译：在多通道自由空间光学系统中精确对准和夹紧多根光纤的光纤夹具消除了多个部件并简化了组装。每个具有穿过其中的孔阵列的多个晶片相对于彼此对准。光纤通过孔，并且至少一个晶片相对于其它晶片横向移动，使得孔的侧壁将光纤夹紧到期望的位置。

2. 发明授权

US06490379B2 Electrical transmission frequency of SiOB 有权
标题翻译： SiOB的电传输频率
公开(公告)号：US06490379B2
公开(公告)日：2002-12-03
申请号：US09850359
申请日：2001-05-07
申请人： Robert A. Boudreau , Songsheng Tan , Christopher L. Henning , Karen I. Matthews
发明人： Robert A. Boudreau , Songsheng Tan , Christopher L. Henning , Karen I. Matthews
IPC分类号： G02B636
CPC分类号： G02B6/12004 , G02B6/4202 , G02B6/4243 , G02B6/4257 , H01S5/02248 , H01S5/02276
摘要： An opto-electronic packaged platform (300) includes a high resistivity substrate (10) having an optical waveguide mounting portion (301), an optical device mounting portion (302), and an electrical waveguide portion (303) having a conductor pattern (312) and an underlying capacitance (330,230, and/or 30) forming a transmission line (340) for propagating high frequency signals.
摘要翻译：光电式封装平台（300）包括具有光波导安装部分（301）的高电阻率基板（10），光学装置安装部分（302）和具有导体图案（312）的电波导部分）和形成用于传播高频信号的传输线（340）的底层电容（330,230和/或30）。

3. 发明授权

US5533158A Electrostatic bonding of optical fibers to substrates 失效
标题翻译：将光纤静电粘合到基板上
公开(公告)号：US5533158A
公开(公告)日：1996-07-02
申请号：US269302
申请日：1994-09-12
申请人： Hongtao Han , Songsheng Tan
发明人： Hongtao Han , Songsheng Tan
IPC分类号： G02B6/36
CPC分类号： G02B6/3636 , G02B6/3628 , G02B6/3652 , G02B6/3692
摘要： An optical interconnect comprises a metallized optical fiber electrostatically bonded to a thin film of an alkali-containing glass which is itself bonded to a planar surface of a semiconductive or conductive substrate. Another optical interconnect comprises an optical fiber having a thin film of an alkali-containing glass deposited thereon, wherein the fiber is electrostatically bonded to a planar surface of a semiconductive or conductive substrate. A process of bonding an optical fiber to a semiconductive or conductive substrate includes contacting the fiber with the substrate, applying a DC potential to the fiber-substrate combination, slowly heating the combination to a maximum temperature between 180.degree.-500.degree. C., maintaining the combination at the maximum temperature for a few minutes, cooling the combination to room temperature, and removing the DC potential.
摘要翻译：光学互连包括静电粘合到含碱玻璃的薄膜上的金属化光纤，其本身结合到半导体或导电基底的平坦表面。另一种光学互连件包括具有沉积在其上的含有碱的玻璃的薄膜的光纤，其中该光纤与静电结合到半导体或导电基底的平面表面。将光纤连接到半导体或导电基板的过程包括使纤维与基底接触，向纤维 - 基底组合施加DC电位，将组合缓慢加热到180℃-500℃之间的最高温度，保持在最高温度下组合数分钟，将组合冷却至室温，并除去DC电位。

4. 发明授权

US5880525A Anodic aluminum oxide passive alignment structures 失效
标题翻译：阳极氧化铝被动对准结构
公开(公告)号：US5880525A
公开(公告)日：1999-03-09
申请号：US379778
申请日：1995-01-27
申请人： Robert Addison Boudreau , Terry Patrick Bowen , Hongtao Han , Songsheng Tan , John Robert Rowlette, Sr.
发明人： Robert Addison Boudreau , Terry Patrick Bowen , Hongtao Han , Songsheng Tan , John Robert Rowlette, Sr.
IPC分类号： G02B6/42 , H01L23/06 , H01L23/10 , H01L23/15 , C01L2/02
CPC分类号： G02B6/4233 , G02B6/4228 , G02B6/4249
摘要： A passive alignment structure for a substantially planar substrate, which is an anodic aluminum oxide structure having a vertical profile with respect to a horizontal surface of said substantially planar substrate.
摘要翻译：一种用于基本平坦的基底的无源对准结构，其是具有相对于所述基本上平坦的基底的水平表面的垂直分布的阳极氧化铝结构。

5. 发明授权

US07902414B2 Para-xylene production process employing in-situ catalyst selectivation 有权
标题翻译：使用原位催化剂选择的对二甲苯生产工艺
公开(公告)号：US07902414B2
公开(公告)日：2011-03-08
申请号：US11866847
申请日：2007-10-03
申请人： John D. Y. Ou , Zongxuan Hong , Songsheng Tan , Timothy E. McMinn
发明人： John D. Y. Ou , Zongxuan Hong , Songsheng Tan , Timothy E. McMinn
IPC分类号： C07C2/66 , C07C2/86
CPC分类号： B01J29/48 , B01J29/06 , B01J2229/12 , B01J2229/34 , C07C2/862 , C07C2523/652 , C07C2529/40 , Y02P20/52 , C07C15/08
摘要： A catalytic process for the selective production of para-xylene comprises the step of reacting an aromatic hydrocarbon selected from the group consisting of toluene, benzene and mixtures thereof with a feed comprising carbon monoxide and hydrogen in the presence of a selectivated catalyst. The process includes a catalyst selectivation phase and a para-xylene production phase. In the catalyst selectivation phase, the aromatic hydrocarbon and the feed are contacted with the catalyst under a first set of conditions effective to increase the para-selectivity of said catalyst. In the para-xylene production phase, the aromatic hydrocarbon and said feed are contacted with the catalyst under a second set of conditions different from the first set of conditions effective to selectively produce para-xylene.
摘要翻译：用于选择性生产对二甲苯的催化方法包括在选择性催化剂存在下使选自甲苯，苯及其混合物的芳族烃与包含一氧化碳和氢的进料反应的步骤。该方法包括催化剂选择阶段和对二甲苯生产阶段。在催化剂选择阶段，芳族烃和进料在有效提高所述催化剂对位选择性的第一组条件下与催化剂接触。在对二甲苯生产阶段中，芳族烃和所述进料在不同于有效选择性地产生对二甲苯的第一组条件的第二组条件下与催化剂接触。

6. 发明申请

US20080033067A1 Para-Xylene Production Process Employing In-Situ Catalyst Selectivation 有权
标题翻译：使用原位催化剂选择的对二甲苯生产过程
公开(公告)号：US20080033067A1
公开(公告)日：2008-02-07
申请号：US11866847
申请日：2007-10-03
申请人： John Ou , Zongxuan Hong , Songsheng Tan , Timothy McMinn
发明人： John Ou , Zongxuan Hong , Songsheng Tan , Timothy McMinn
IPC分类号： C07C27/00
CPC分类号： B01J29/48 , B01J29/06 , B01J2229/12 , B01J2229/34 , C07C2/862 , C07C2523/652 , C07C2529/40 , Y02P20/52 , C07C15/08
摘要： A catalytic process for the selective production of para-xylene comprises the step of reacting an aromatic hydrocarbon selected from the group consisting of toluene, benzene and mixtures thereof with a feed comprising carbon monoxide and hydrogen in the presence of a selectivated catalyst. The process includes a catalyst selectivation phase and a para-xylene production phase. In the catalyst selectivation phase, the aromatic hydrocarbon and the feed are contacted with the catalyst under a first set of conditions effective to increase the para-selectivity of said catalyst. In the para-xylene production phase, the aromatic hydrocarbon and said feed are contacted with the catalyst under a second set of conditions different from the first set of conditions effective to selectively produce para-xylene.
摘要翻译：用于选择性生产对二甲苯的催化方法包括在选择性催化剂存在下使选自甲苯，苯及其混合物的芳族烃与包含一氧化碳和氢的进料反应的步骤。该方法包括催化剂选择阶段和对二甲苯生产阶段。在催化剂选择阶段，芳族烃和进料在有效提高所述催化剂对位选择性的第一组条件下与催化剂接触。在对二甲苯生产阶段中，芳族烃和所述进料在不同于有效选择性地产生对二甲苯的第一组条件的第二组条件下与催化剂接触。

7. 发明授权

US06574399B2 Ceramic waferboard for integration of optical/optoelectronic/electronic components 有权
标题翻译：用于光学/光电子/电子元件集成的陶瓷片
公开(公告)号：US06574399B2
公开(公告)日：2003-06-03
申请号：US10015914
申请日：2001-11-02
申请人： Robert A. Boudreau , Songsheng Tan
发明人： Robert A. Boudreau , Songsheng Tan
IPC分类号： G02B630
CPC分类号： G02B6/423 , G02B6/3636 , G02B6/3652 , G02B6/3692 , G02B6/3696
摘要： An optoelectronic module includes a ceramic waferboard having a groove configured to passively position an optical fiber. The ceramic waferboard includes an alignment feature configured to passively position an optical component. An optical device is secured to the ceramic waferboard in contact with the alignment feature to thereby position the optical device. An optical fiber is positioned in the groove with an end of the optical fiber positioned adjacent the optical device to thereby optically couple the optical fiber to the optical device. The optoelectronic module also includes an integrated circuit chip secured to the ceramic waferboard, and a conductive material disposed on the ceramic waferboard and electrically coupling the integrated circuit chip to the optical device.
摘要翻译：光电模块包括具有被配置为被动地定位光纤的凹槽的陶瓷晶片板。陶瓷晶片板包括被配置为被动地定位光学部件的对准特征。光学装置固定到与对准特征接触的陶瓷片板上，从而定位光学装置。光纤定位在槽中，其中光纤的端部位于光学器件附近，从而将光纤光耦合到光学器件。光电子模块还包括固定到陶瓷晶片板上的集成电路芯片和设置在陶瓷晶片板上并将集成电路芯片电耦合到光学器件的导电材料。

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