专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2009291087A Bush cutter 审中-公开
标题翻译：布什切割机
公开(公告)号：JP2009291087A
公开(公告)日：2009-12-17
申请号：JP2008145874
申请日：2008-06-03
申请人： Shunsaku Hoshi , 俊作星
发明人： HOSHI SHUNSAKU
IPC分类号： A01D34/73 , A01D34/68 , A01D34/83
摘要： PROBLEM TO BE SOLVED: To provide a bush cutter not only causing no trouble of twining on the bush cutter even when the bush cutting of grass and ivy is carried out, but also can carry out the bush cutting so that the cut grass and ivy may be swept out to a prescribed side direction without being dispersed to all sides.
SOLUTION: The bush cutter is constituted as follows. A controlling plate 5 having crossing angles to a rod 2 and a circular saw 4 is stood, and the edge at the upper surface of the controlling plate 5 is slightly separated from the upper surface of the circular saw 4 and protruded from the position of a saw blade 15 of the circular saw 4. An orbiting driven gear 12 rotated by receiving a rotary driving force is attached to a rotary shaft, and a damper 6 for interfering and controlling the force in a direction perpendicular to the controlling plate 5 is installed. An orbiting following gear 9 is suitable for the chip from the damper 6, and a following shaft 8 is hung onto the upper surface of the circular saw 4 in a contact state. An orbiting chain 10 having cut teeth 11 formed on the periphery is hung between the orbiting driven gear 12 and the orbiting following gear 9.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种灌木切割机，即使进行草坪和常春藤的灌木切割也不会在灌木切割机上产生缠绕的麻烦，而且还可以进行切割，以便切割草并且常春藤可能被扫除到规定的侧向，而不会分散到所有方面。
解决方案：铣刀如下构成。具有与杆2和圆锯4交叉的控制板5，并且控制板5的上表面的边缘与圆锯4的上表面稍微分开并从通过接受旋转驱动力旋转的旋转从动齿轮12安装在旋转轴上，并安装有用于干涉和控制与控制板5垂直的方向上的力的阻尼器6。旋转的跟随齿轮9适合于来自阻尼器6的芯片，并且随动轴8以接触状态悬挂在圆锯4的上表面上。具有形成在周边上的切齿11的轨道链10悬挂在绕动从动齿轮12和绕动齿轮9之间。（C）2010，JPO＆INPIT

2. 发明专利

JP2009044980A Bush cutter 有权
标题翻译：布什切割机
公开(公告)号：JP2009044980A
公开(公告)日：2009-03-05
申请号：JP2007212557
申请日：2007-08-17
申请人： Shunsaku Hoshi , 俊作星
发明人： HOSHI SHUNSAKU
IPC分类号： A01D34/68 , A01D34/73
摘要： PROBLEM TO BE SOLVED: To provide a bush cutter which does not cause a trouble of twisting cut grasses and ivies on the bush cutter, and can cut away the grasses and the ivies in a desired side direction without scattering the cut grasses and the ivies in all directions.
SOLUTION: This bush cutter is provided with a rising inhibiting plate 5 having the cross angle of a rod body 2 to a round saw 4 from the lower end portion of the rod body 2 to the upper portion of the rod body 2, slightly separates the round saw 4 upper side end of the inhibiting plate 5 from the upper side of the round saw 4, extends the round saw 4 upper side end from the cutting teeth 12 position of the round saw 4, bends the round saw 4 upper side end to form an end edge 6, and fixes a cutting blade 7 to the end edge 6.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种不会在切割机上扭曲剪草和常春藤的麻烦的切割机，并且可以在所需的侧向方向上切割草和常春藤，而不会分散切草和四面八方的常春藤。解决方案：该衬套切割器具有从棒体2的下端部到杆体2的上部具有杆体2与圆锯4的交叉角度的上升抑制板5，将止动板5的圆锯4的上侧稍微从圆锯4的上侧分开，将圆锯4的上侧端从圆锯4的切割齿12的位置延伸，将圆锯4上方侧端部以形成端缘6，并将切割刀片7固定到端部边缘6.版权所有（C）2009，JPO＆INPIT

3. 发明申请

US20110089044A1 COPPER ELECTROLYTIC PLATING BATH AND COPPER ELECTROLYTIC PLATING METHOD 审中-公开
标题翻译：铜电解镀锌浴和铜电镀法
公开(公告)号：US20110089044A1
公开(公告)日：2011-04-21
申请号：US12903555
申请日：2010-10-13
申请人： Toshihisa Isono , Shinji Tachibana , Naoyuki Omura , Shunsaku Hoshi
发明人： Toshihisa Isono , Shinji Tachibana , Naoyuki Omura , Shunsaku Hoshi
IPC分类号： C25D3/38
CPC分类号： C25D3/38 , H05K3/423
摘要： Disclosed herein is a copper electrolytic plating bath including copper sulfate used in an amount of 50 to 250 g/liter calculated as copper sulfate pentahydrate, 20 to 200 g/liter of sulfuric acid, and 20 to 150 mg/liter of a chloride ion, and a sulfur atom-containing organic compound and a nitrogen atom-containing organic compound serving as organic additives. The nitrogen atom-containing organic compound includes a nitrogen atom-containing polymer compound obtained by a two-stage reaction including reacting one mole of morpholine with two moles of epichlorohydrin in an acidic aqueous solution to obtain a reaction product and further reacting one to two moles, relative to one mole of the morpholine, of imidazole with the reaction product.
摘要翻译：本发明公开了一种铜电解电镀浴，包括硫酸铜的使用量为50-250g / l，硫酸铜五水合物，20-200g / l硫酸和20-150mg /升氯离子，和含硫原子的有机化合物和作为有机添加剂的含氮原子的有机化合物。含氮原子的有机化合物包括通过两步反应获得的含氮原子的聚合物化合物，包括在酸性水溶液中使1摩尔吗啉与2摩尔表氯醇反应，得到反应产物，并进一步使1至2摩尔相对于1摩尔的吗啉，与反应产物相比。

4. 发明申请

US20110056840A1 ELECTROLYTIC PLATING EQUIPMENT AND ELECTROLYTIC PLATING METHOD 审中-公开
标题翻译：电镀设备和电镀法
公开(公告)号：US20110056840A1
公开(公告)日：2011-03-10
申请号：US12876723
申请日：2010-09-07
申请人： Toshihisa Isono , Shinji Tachibana , Naoyuki Omura , Shunsaku Hoshi , Kanako Matsuda , Koji Shimizu
发明人： Toshihisa Isono , Shinji Tachibana , Naoyuki Omura , Shunsaku Hoshi , Kanako Matsuda , Koji Shimizu
IPC分类号： C25D3/38 , C25D17/00 , C25D5/00
CPC分类号： C25D21/04 , C25D17/02 , C25D21/10 , C25D21/18
摘要： An electrolytic plating equipment includes: a plating tank for holding plating solution; and a separate tank apart from the plating tank, for holding the plating solution circulating between the plating tank and the separate tank. The separate tank contains a first space and a second space located downstream from the first space. The plating solution in the first space in an amount exceeding a specific height flows from the first space into the second space, and the plating solution falls through air in the second space.
摘要翻译：电解电镀设备包括：用于保持电镀液的电镀槽; 以及与电镀槽分开的用于保持镀液在电镀槽和分离槽之间循环的单独的罐。分离的容器包含位于第一空间下游的第一空间和第二空间。第一空间中的镀液以超过特定高度的量从第一空间流入第二空间，电镀液在第二空间中流经空气。

5. 发明授权

US08801912B2 Continuous copper electroplating method 有权
标题翻译：连续铜电镀方法
公开(公告)号：US08801912B2
公开(公告)日：2014-08-12
申请号：US12401113
申请日：2009-03-10
申请人： Naoyuki Omura , Toshihisa Isono , Koji Shimizu , Shinji Tachibana , Tomohiro Kawase , Shunsaku Hoshi
发明人： Naoyuki Omura , Toshihisa Isono , Koji Shimizu , Shinji Tachibana , Tomohiro Kawase , Shunsaku Hoshi
IPC分类号： C25D21/18 , C25D17/00 , C25D3/38 , H05K3/24
CPC分类号： C25D17/00 , C25D3/38 , C25D7/123 , C25D17/001 , C25D17/002 , C25D21/18 , H05K3/241
摘要： Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to transfer between the anode side and the cathode side, and the plating bath is returned to vicinity of the anode in the return of the plating bath from the copper dissolution vessel to the plating vessel. Plating performance impairing components, which are produced when the copper ion supplying salt is dissolved in the plating bath for replenishing the copper ions, are oxidized and decomposed, whereby defective plating due to the presence of the plating performance impairing components can be prevented.
摘要翻译：公开了一种通过在容纳硫酸铜电镀浴的电镀槽中使用不溶性阳极来重复电镀作为阴极的工件的方法，其中提供了不同于电镀槽的铜溶解容器，电镀浴是转移到铜溶解容器中，并从铜溶解容器返回到电镀槽，用于使电镀槽和铜溶解容器之间的电镀槽循环，将铜离子供应盐装入铜溶解容器中并溶解在镀浴中使得可以补充由电镀消耗的铜离子，并且将被镀工件连续电镀，其特征在于允许电镀液在阳极侧和阴极侧之间转移，电镀浴返回到阳极将电镀液从铜溶解容器返回到电镀槽中。当铜离子供应盐溶解在用于补充铜离子的镀浴中时产生的电镀性能损害部件被氧化分解，从而可以防止由于存在电镀性能损害部件而导致的不良电镀。

6. 发明申请

US20090229986A1 CONTINUOUS COPPER ELECTROPLATING METHOD 有权
标题翻译：连续电镀方法
公开(公告)号：US20090229986A1
公开(公告)日：2009-09-17
申请号：US12401113
申请日：2009-03-10
申请人： Naoyuki OMURA , Toshihisa ISONO , Koji SHIMIZU , Shinji TACHIBANA , Tomohiro KAWASE , Shunsaku HOSHI
发明人： Naoyuki OMURA , Toshihisa ISONO , Koji SHIMIZU , Shinji TACHIBANA , Tomohiro KAWASE , Shunsaku HOSHI
IPC分类号： C25D21/18
CPC分类号： C25D17/00 , C25D3/38 , C25D7/123 , C25D17/001 , C25D17/002 , C25D21/18 , H05K3/241
摘要： Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to transfer between the anode side and the cathode side, and the plating bath is returned to vicinity of the anode in the return of the plating bath from the copper dissolution vessel to the plating vessel. Plating performance impairing components, which are produced when the copper ion supplying salt is dissolved in the plating bath for replenishing the copper ions, are oxidized and decomposed, whereby defective plating due to the presence of the plating performance impairing components can be prevented.
摘要翻译：公开了一种通过在容纳硫酸铜电镀浴的电镀槽中使用不溶性阳极来重复电镀作为阴极的工件的方法，其中提供了不同于电镀槽的铜溶解容器，电镀浴是转移到铜溶解容器中，并从铜溶解容器返回到电镀槽，用于使电镀槽和铜溶解容器之间的电镀槽循环，将铜离子供应盐装入铜溶解容器中并溶解在镀浴中使得可以补充由电镀消耗的铜离子，并且将被镀工件连续电镀，其特征在于允许电镀液在阳极侧和阴极侧之间转移，电镀浴返回到阳极将电镀液从铜溶解容器返回到电镀槽中。当铜离子供应盐溶解在用于补充铜离子的镀浴中时产生的电镀性能损害部件被氧化分解，从而可以防止由于存在电镀性能损害部件而导致的不良电镀。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式