专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08801912B2 Continuous copper electroplating method 有权
标题翻译：连续铜电镀方法
公开(公告)号：US08801912B2
公开(公告)日：2014-08-12
申请号：US12401113
申请日：2009-03-10
申请人： Naoyuki Omura , Toshihisa Isono , Koji Shimizu , Shinji Tachibana , Tomohiro Kawase , Shunsaku Hoshi
发明人： Naoyuki Omura , Toshihisa Isono , Koji Shimizu , Shinji Tachibana , Tomohiro Kawase , Shunsaku Hoshi
IPC分类号： C25D21/18 , C25D17/00 , C25D3/38 , H05K3/24
CPC分类号： C25D17/00 , C25D3/38 , C25D7/123 , C25D17/001 , C25D17/002 , C25D21/18 , H05K3/241
摘要： Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to transfer between the anode side and the cathode side, and the plating bath is returned to vicinity of the anode in the return of the plating bath from the copper dissolution vessel to the plating vessel. Plating performance impairing components, which are produced when the copper ion supplying salt is dissolved in the plating bath for replenishing the copper ions, are oxidized and decomposed, whereby defective plating due to the presence of the plating performance impairing components can be prevented.
摘要翻译：公开了一种通过在容纳硫酸铜电镀浴的电镀槽中使用不溶性阳极来重复电镀作为阴极的工件的方法，其中提供了不同于电镀槽的铜溶解容器，电镀浴是转移到铜溶解容器中，并从铜溶解容器返回到电镀槽，用于使电镀槽和铜溶解容器之间的电镀槽循环，将铜离子供应盐装入铜溶解容器中并溶解在镀浴中使得可以补充由电镀消耗的铜离子，并且将被镀工件连续电镀，其特征在于允许电镀液在阳极侧和阴极侧之间转移，电镀浴返回到阳极将电镀液从铜溶解容器返回到电镀槽中。当铜离子供应盐溶解在用于补充铜离子的镀浴中时产生的电镀性能损害部件被氧化分解，从而可以防止由于存在电镀性能损害部件而导致的不良电镀。

2. 发明申请

US20110089044A1 COPPER ELECTROLYTIC PLATING BATH AND COPPER ELECTROLYTIC PLATING METHOD 审中-公开
标题翻译：铜电解镀锌浴和铜电镀法
公开(公告)号：US20110089044A1
公开(公告)日：2011-04-21
申请号：US12903555
申请日：2010-10-13
申请人： Toshihisa Isono , Shinji Tachibana , Naoyuki Omura , Shunsaku Hoshi
发明人： Toshihisa Isono , Shinji Tachibana , Naoyuki Omura , Shunsaku Hoshi
IPC分类号： C25D3/38
CPC分类号： C25D3/38 , H05K3/423
摘要： Disclosed herein is a copper electrolytic plating bath including copper sulfate used in an amount of 50 to 250 g/liter calculated as copper sulfate pentahydrate, 20 to 200 g/liter of sulfuric acid, and 20 to 150 mg/liter of a chloride ion, and a sulfur atom-containing organic compound and a nitrogen atom-containing organic compound serving as organic additives. The nitrogen atom-containing organic compound includes a nitrogen atom-containing polymer compound obtained by a two-stage reaction including reacting one mole of morpholine with two moles of epichlorohydrin in an acidic aqueous solution to obtain a reaction product and further reacting one to two moles, relative to one mole of the morpholine, of imidazole with the reaction product.
摘要翻译：本发明公开了一种铜电解电镀浴，包括硫酸铜的使用量为50-250g / l，硫酸铜五水合物，20-200g / l硫酸和20-150mg /升氯离子，和含硫原子的有机化合物和作为有机添加剂的含氮原子的有机化合物。含氮原子的有机化合物包括通过两步反应获得的含氮原子的聚合物化合物，包括在酸性水溶液中使1摩尔吗啉与2摩尔表氯醇反应，得到反应产物，并进一步使1至2摩尔相对于1摩尔的吗啉，与反应产物相比。

3. 发明申请

US20110056840A1 ELECTROLYTIC PLATING EQUIPMENT AND ELECTROLYTIC PLATING METHOD 审中-公开
标题翻译：电镀设备和电镀法
公开(公告)号：US20110056840A1
公开(公告)日：2011-03-10
申请号：US12876723
申请日：2010-09-07
申请人： Toshihisa Isono , Shinji Tachibana , Naoyuki Omura , Shunsaku Hoshi , Kanako Matsuda , Koji Shimizu
发明人： Toshihisa Isono , Shinji Tachibana , Naoyuki Omura , Shunsaku Hoshi , Kanako Matsuda , Koji Shimizu
IPC分类号： C25D3/38 , C25D17/00 , C25D5/00
CPC分类号： C25D21/04 , C25D17/02 , C25D21/10 , C25D21/18
摘要： An electrolytic plating equipment includes: a plating tank for holding plating solution; and a separate tank apart from the plating tank, for holding the plating solution circulating between the plating tank and the separate tank. The separate tank contains a first space and a second space located downstream from the first space. The plating solution in the first space in an amount exceeding a specific height flows from the first space into the second space, and the plating solution falls through air in the second space.
摘要翻译：电解电镀设备包括：用于保持电镀液的电镀槽; 以及与电镀槽分开的用于保持镀液在电镀槽和分离槽之间循环的单独的罐。分离的容器包含位于第一空间下游的第一空间和第二空间。第一空间中的镀液以超过特定高度的量从第一空间流入第二空间，电镀液在第二空间中流经空气。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式