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    • 1. 发明授权
    • Semiconductor integrated circuit device and flash EEPROM
    • 半导体集成电路器件和闪存EEPROM
    • US06972446B1
    • 2005-12-06
    • US09028276
    • 1998-02-24
    • Shigeru Atsumi
    • Shigeru Atsumi
    • H01L21/8247G11C16/26H01L21/8239H01L27/10H01L27/105H01L27/115H01L29/788H01L29/792
    • H01L27/105G11C16/26H01L27/1052
    • A number of transistors including gate oxide films of different thicknesses and an external terminal are formed on a semiconductor substrate. The transistor connected directly to the external terminal is a transistor other than the transistor having the thinnest gate oxide film. That is, a node which is in contact with an external power supply and thus requires a high breakdown voltage is formed of a thick gate oxide film transistor, while a node which is not in contact with the external power supply is formed of a thin gate oxide film transistor. With this structure, a number of transistors including gate oxide films of different thicknesses can be integrated in a single chip without deterioration of the transistor characteristics. Hence, the degree of freedom with which to design devices/circuits can be remarkably enhanced.
    • 在半导体衬底上形成包括不同厚度的栅极氧化物膜和外部端子的多个晶体管。 直接连接到外部端子的晶体管是具有最薄栅极氧化膜的晶体管以外的晶体管。 也就是说,与外部电源接触并且因此需要高的击穿电压的节点由厚栅极氧化物膜晶体管形成,而与外部电源不接触的节点由薄栅极形成 氧化膜晶体管。 利用这种结构,可以在单个芯片中集成多个不同厚度的栅极氧化膜的晶体管,而不会降低晶体管特性。 因此,可以显着提高设计装置/电路的自由度。
    • 5. 发明授权
    • Nonvolatile semiconductor memory device and method of retrieving faulty in the same
    • 非易失性半导体存储器件及其检测方法相同
    • US06850437B2
    • 2005-02-01
    • US10781921
    • 2004-02-20
    • Tadayuki TauraShigeru AtsumiToru Tanzawa
    • Tadayuki TauraShigeru AtsumiToru Tanzawa
    • G01R1/06G01R31/28G11C16/02G11C16/06G11C16/20G11C17/00G11C29/00G11C29/04G11C29/34
    • G11C29/846G11C16/20G11C2029/1208
    • A nonvolatile semiconductor memory device includes a first memory cell array including electrically re-programmable main memory cells, a second memory cell array including electrically data-programmable redundancy memory cells, a first storage configured to store a specified code, a first comparator configured to compare a selected code with the specified code to generate an activating signal, a faulty address latch circuit configured to be activated by the activating signal and controlled to temporarily latch a fault address corresponding to the fault, a second storage configured to store the faulty address latched by the faulty address latch circuit, a second comparator configured to compare an input address with the faulty address to generate a replacement control signal when the input address coincides with the faulty address, and a replacing circuit configured to replace an output of the first memory cell array with an output of the second memory cell array.
    • 非易失性半导体存储器件包括包括电可重新编程的主存储器单元的第一存储单元阵列,包括电数据可编程冗余存储器单元的第二存储单元阵列,被配置为存储指定代码的第一存储器,配置为比较的第一比较器 具有指定代码的选择代码以产生激活信号,故障地址锁存电路被配置为由激活信号激活并被控制以临时锁存与该故障相对应的故障地址;第二存储器,被配置为存储由该故障锁存的故障地址 故障地址锁存电路,第二比较器,被配置为当输入地址与故障地址一致时,将输入地址与故障地址进行比较,以产生替换控制信号;以及替换电路,被配置为替换第一存储单元阵列的输出 具有第二存储单元阵列的输出。
    • 7. 发明授权
    • Nonvolatile semiconductor memory device and method of retrieving faulty in the same
    • 非易失性半导体存储器件及其检测方法相同
    • US06711057B2
    • 2004-03-23
    • US10234704
    • 2002-09-05
    • Tadayuki TauraShigeru AtsumiToru Tanzawa
    • Tadayuki TauraShigeru AtsumiToru Tanzawa
    • G11C1606
    • G11C29/846G11C16/20G11C2029/1208
    • A nonvolatile semiconductor memory device comprises a first memory cell array including electrically re-programmable main memory cells, a second memory cell array including electrically data-programmable redundancy memory cells, a first storage configured to store a specified code, a first comparator configured to compare a selected code with the specified code to generate an activating signal, a faulty address latch circuit configured to be activated by the activating signal and controlled to temporarily latch a fault address corresponding to the fault, a second storage configured to store the faulty address latched by the faulty address latch circuit, a second comparator configured to compare an input address with the faulty address to generate a replacement control signal when the input address coincides with the faulty address, and a replacing circuit configured to replace an output of the first memory cell array with an output of the second memory cell array.
    • 非易失性半导体存储器件包括包括电可重新编程的主存储器单元的第一存储单元阵列,包括电数据可编程冗余存储器单元的第二存储单元阵列,被配置为存储指定代码的第一存储器,被配置为比较的第一比较器 具有指定代码的选择代码以产生激活信号,故障地址锁存电路被配置为由激活信号激活并被控制以临时锁存与该故障相对应的故障地址;第二存储器,被配置为存储由该故障锁存的故障地址 故障地址锁存电路,第二比较器,被配置为当输入地址与故障地址一致时,将输入地址与故障地址进行比较,以产生替换控制信号;以及替换电路,被配置为替换第一存储单元阵列的输出 具有第二存储单元阵列的输出。
    • 9. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US06560144B2
    • 2003-05-06
    • US10086869
    • 2002-03-04
    • Shigeru AtsumiHironori Banba
    • Shigeru AtsumiHironori Banba
    • G11C1604
    • G11C16/16G11C16/08
    • A nonvolatile semiconductor memory device includes a row decoder circuit having first and second N-channel MOS transistors and first and second P-channel MOS transistors which correspond to each of word lines. One end of a source-to-drain current path of the first N-channel MOS transistor is connected to the word line, and the other end thereof is connected to a corresponding one of output terminals of a predecoder circuit. One end of a source-to-drain current path of the second N-channel MOS transistor is connected to the word line, and the other end thereof is supplied with a voltage of OV or more in a data erase mode and is supplied with a low logical level signal in modes other than the data erase mode. A source-to-drain current path of the first P-channel MOS transistor is connected in parallel to the source-to-drain current path of the first N-channel MOS transistor, and a source-to-drain current path of the second P-channel MOS transistor is connected in parallel to the source-to-drain current path of the second N-channel MOS transistor.
    • 非易失性半导体存储器件包括具有第一和第二N沟道MOS晶体管的行解码器电路和对应于每条字线的第一和第二P沟道MOS晶体管。 第一N沟道MOS晶体管的源极 - 漏极电流路径的一端连接到字线,并且其另一端连接到预解码器电路的对应的一个输出端。 第二N沟道MOS晶体管的源极 - 漏极电流路径的一端连接到字线,并且其另一端在数据擦除模式下被提供0V以上的电压,并被提供有 低数据擦除模式以外的模式下的低逻辑电平信号。 第一P沟道MOS晶体管的源极 - 漏极电流路径并联连接到第一N沟道MOS晶体管的源极 - 漏极电流路径,并且第二P沟道MOS晶体管的源极 - 漏极电流路径 P沟道MOS晶体管与第二N沟道MOS晶体管的源极 - 漏极电流路径并联连接。