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    • 2. 发明申请
    • LIGHT EMITTING DIODE PACKAGE
    • 发光二极管封装
    • US20090108271A1
    • 2009-04-30
    • US12194117
    • 2008-08-19
    • Wei-Jen CHOUSheng-Min WANGChiao-Chih YANG
    • Wei-Jen CHOUSheng-Min WANGChiao-Chih YANG
    • H01L33/00
    • H01L25/0753H01L33/56H01L33/60H01L2924/0002H01L2924/00
    • A light emitting diode package includes a mount, a plurality of LED chips, and a first and a second sealants made of different materials. The mount has an accommodation space and at least one partition member to divide the accommodation space into a plurality of separate cavities. The LED chips are placed in the cavities, and emitting beams of the LED chips exiting through the cavities include a first emission with a first wavelength band and a second emission with a second wavelength band, and the second wavelength band is different to the first one. The first and the second sealants are respectively used for sealing at least one of the LED chips placed in at least one of the cavities through which the first or the second emission exits. The first and the second sealants are separate from each other by the partition member.
    • 发光二极管封装包括安装件,多个LED芯片以及由不同材料制成的第一和第二密封剂。 安装座具有容纳空间和至少一个分隔构件,以将容纳空间分成多个单独的空腔。 LED芯片被放置在空腔中,并且通过空腔排出的LED芯片的发射光束包括具有第一波长带和第二波长带的第二发射的第一发射,并且第二波长带与第一波长带不同 。 第一密封剂和第二密封剂分别用于密封放置在第一或第二排放物通过的至少一个空腔中的至少一个LED芯片。 第一密封剂和第二密封剂通过分隔构件彼此分开。
    • 6. 发明授权
    • Light emitting diode package
    • 发光二极管封装
    • US08344411B2
    • 2013-01-01
    • US12194117
    • 2008-08-19
    • Wei-Jen ChouSheng-Min WangChiao-Chih Yang
    • Wei-Jen ChouSheng-Min WangChiao-Chih Yang
    • H01L29/207
    • H01L25/0753H01L33/56H01L33/60H01L2924/0002H01L2924/00
    • A light emitting diode package includes a mount, a plurality of LED chips, and a first and a second sealants made of different materials. The mount has an accommodation space and at least one partition member to divide the accommodation space into a plurality of separate cavities. The LED chips are placed in the cavities, and emitting beams of the LED chips exiting through the cavities include a first emission with a first wavelength band and a second emission with a second wavelength band, and the second wavelength band is different to the first one. The first and the second sealants are respectively used for sealing at least one of the LED chips placed in at least one of the cavities through which the first or the second emission exits. The first and the second sealants are separate from each other by the partition member.
    • 发光二极管封装包括安装件,多个LED芯片以及由不同材料制成的第一和第二密封剂。 安装座具有容纳空间和至少一个分隔构件,以将容纳空间分成多个单独的空腔。 将LED芯片放置在空腔中,并且通过空腔排出的LED芯片的发射光束包括具有第一波长带和第二波长带的第二发射的第一发射,并且第二波长带与第一波长带不同 。 第一密封剂和第二密封剂分别用于密封放置在第一或第二排放物通过的至少一个空腔中的至少一个LED芯片。 第一密封剂和第二密封剂通过分隔构件彼此分开。