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1. 发明授权

US06343503B1 Module appearance inspection apparatus 失效
标题翻译：模块外观检查装置
公开(公告)号：US06343503B1
公开(公告)日：2002-02-05
申请号：US09455302
申请日：1999-12-06
申请人： Seok Goh
发明人： Seok Goh
IPC分类号： G01B1124
CPC分类号： H01L21/67271
摘要： A module appearance inspection apparatus includes a warpage checking unit, a visual checking unit, a first module transfer unit for unloading the module from a module tray, a second module transfer unit for transferring the module within the apparatus, and a third module transfer unit for loading the module to a module tray. The apparatus can replace the first and third module transfer units with a single module transfer unit. In this case, the apparatus includes: a warpage checking unit; a visual checking unit; a supply unit in which module trays are stacked; a storage unit in which module trays also can be stacked; a tray transfer unit which moves a module tray from the supply unit to the storage unit; a first module transfer unit which unloads and loads the module from and to the module tray on the tray transfer unit; and a second module transfer unit which transfers the module from the warpage checking unit or the visual checking unit.
摘要翻译：模块外观检查装置包括翘曲检查单元，视觉检查单元，用于从模块托盘卸载模块的第一模块传送单元，用于在该设备内传送模块的第二模块传送单元，以及用于将模块加载到模块托盘。该装置可以用单个模块传送单元替换第一和第三模块传送单元。在这种情况下，该装置包括：翘曲检查单元; 视觉检查单元; 堆叠模块托盘的供应单元; 存储单元，其中模块托盘也可以堆叠; 托盘传送单元，其将模块托盘从供给单元移动到存储单元; 第一模块传送单元，其从托盘传送单元上的模块托盘卸载和加载模块; 以及第二模块传送单元，其从所述翘曲检查单元或所述视觉检查单元传送所述模块。

2. 发明授权

US07485955B2 Semiconductor package having step type die and method for manufacturing the same 有权
标题翻译：具有步进式模具的半导体封装及其制造方法
公开(公告)号：US07485955B2
公开(公告)日：2009-02-03
申请号：US11077235
申请日：2005-03-11
申请人： In-Ku Kang , Seok Goh , Jin-Ho Kim , Tae-Gyeong Chung , Yong-Jae Lee
发明人： In-Ku Kang , Seok Goh , Jin-Ho Kim , Tae-Gyeong Chung , Yong-Jae Lee
IPC分类号： H01L23/12 , H01L23/053
CPC分类号： H01L24/32 , H01L21/78 , H01L23/3128 , H01L24/05 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/49175 , H01L2224/4945 , H01L2224/73204 , H01L2224/73265 , H01L2224/85051 , H01L2224/85191 , H01L2224/85399 , H01L2224/85986 , H01L2224/92247 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06582 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01051 , H01L2924/01057 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10158 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2224/85186 , H01L2224/45099 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/4554
摘要： A variety of non-rectangular IC chips having a stepped or modified periphery or edge profile including one or more recessed or indented peripheral regions are provided for incorporation in modified package configurations, single chip packages and multi-chip assemblies, both stacked and/or planar. In the planar configurations, the recessed regions may be utilized, in cooperation with another appropriately sized IC chip, to increase the packing density of the resulting device. Similarly, in the stacked configuration, the recessed regions may be utilized to provide access to bond pads of lower chips and thereby reduce the need for spacers or peripheral thinning techniques and thereby improve the strength of the resulting assembly and/or reduce the overall height of the stacked structure.
摘要翻译：提供了具有包括一个或多个凹陷或凹入周边区域的阶梯状或改进的周边或边缘轮廓的各种非矩形IC芯片，用于结合到改进的封装结构，单个芯片封装和多芯片组件中，堆叠和/或平面。在平面构造中，可以与另一适当尺寸的IC芯片配合使用凹陷区域，以增加所得器件的封装密度。类似地，在堆叠构造中，凹陷区域可以用于提供对下部芯片的接合焊盘的访问，从而减少对间隔件或外围变薄技术的需要，从而提高所得组件的强度和/或降低总体高度堆叠结构。

3. 发明申请

US20130074447A1 CARRIER TAPE WINDING UNIT AND APPARATUS OF PACKING SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：载体带卷绕单元和包装半导体封装的装置
公开(公告)号：US20130074447A1
公开(公告)日：2013-03-28
申请号：US13546536
申请日：2012-07-11
申请人： Ki-hun Kim , Seok Goh , Byoungjun Min , Poom-Seong Park , Donghae Son
发明人： Ki-hun Kim , Seok Goh , Byoungjun Min , Poom-Seong Park , Donghae Son
IPC分类号： B65H19/28 , B65H19/29 , B65B9/04 , B65H19/26
CPC分类号： B65H19/286 , B65B9/045 , B65H19/29 , B65H2701/1942 , H01L21/6835 , H01L2221/68313
摘要： Carrier tape winding units and apparatuses of packing semiconductor package are provided. An exemplary carrier tape winding unit may include a carrier tape adhesion member attaching a front end of a carrier tape before winding or a cut back end of the carrier tape after a completion of winding the carrier tape to a winding reel. The exemplary carrier tape winding unit may further include a reel replacement member that automatically replaces the winding reel with another one after the completion of winding the carrier tape to the winding reel on a rotation axis by movement of a rotation axis and an axis support member in a direction. This direction is perpendicular to a transfer direction of the carrier tape toward the winding reel.
摘要翻译：提供了载带卷绕单元和包装半导体封装的装置。示例性的载带缠绕单元可以包括载带附着构件，该载带附着构件在将载带卷绕到卷绕卷轴之后，在卷绕之前附接载带的前端或载带的切回端。示例性载带缠绕单元还可以包括一个卷轴更换部件，其在通过旋转轴线和轴支撑部件的运动完成将载带卷绕到卷绕卷轴上之后自动替换卷绕卷轴一个方向该方向垂直于载带朝向卷绕卷轴的传送方向。

4. 发明申请

US20120205795A1 STACKED PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：堆叠包装及其制造方法
公开(公告)号：US20120205795A1
公开(公告)日：2012-08-16
申请号：US13311681
申请日：2011-12-06
申请人： Sang-Geun KIM , Dong-Chul HAN , Seok GOH , Jeong-Hoon KIM
发明人： Sang-Geun KIM , Dong-Chul HAN , Seok GOH , Jeong-Hoon KIM
IPC分类号： H01L23/498 , H01L21/50
CPC分类号： H01L23/49811 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/85 , H01L25/105 , H01L25/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2224/85 , H01L2224/92247 , H01L2225/1023 , H01L2225/1052 , H01L2225/1058 , H01L2924/00014 , H01L2924/15159 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0401
摘要： A stacked package and method of manufacture are provided. The stacked package may include a first semiconductor package, a second semiconductor package, plugs and spacers. The second semiconductor package may be stacked on the first semiconductor package. The plugs may electrically connect the first semiconductor to the second semiconductor package. The spacer may be interposed between the first semiconductor package and the second semiconductor package to form a gap between the first semiconductor package and the second semiconductor package, thereby preventing an electrical short between the plugs.
摘要翻译：提供堆叠的包装和制造方法。堆叠封装可以包括第一半导体封装，第二半导体封装，插头和间隔件。第二半导体封装可以堆叠在第一半导体封装上。插头可以将第一半导体电连接到第二半导体封装。间隔件可以插入在第一半导体封装和第二半导体封装之间以在第一半导体封装和第二半导体封装之间形成间隙，从而防止插头之间的电短路。

5. 发明申请

US20110079361A1 APPARATUS FOR SEMICONDUCTOR DIE BONDING 审中-公开
标题翻译：用于半导体DIE结合的装置
公开(公告)号：US20110079361A1
公开(公告)日：2011-04-07
申请号：US12850027
申请日：2010-08-04
申请人： Byeong-kuk Park , Seok Goh , Kyoung-bok Cho , Dong-soo Lee , Jung-hwan Woo
发明人： Byeong-kuk Park , Seok Goh , Kyoung-bok Cho , Dong-soo Lee , Jung-hwan Woo
IPC分类号： B32B37/02
CPC分类号： H01L24/83 , H01L24/75 , H01L2224/83 , H01L2224/838 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , Y10T156/1707 , Y10T156/1744
摘要： An apparatus for semiconductor die bonding includes a first bonding head and a second bonding head configured to respectively pickup a first semiconductor chip and a second semiconductor chip located at a pickup point. The apparatus for semiconductor die bonding may also include a first transfer device configured to transfer the first bonding head from the pickup point to a bonding point located on a substrate along a transfer path. The first transfer device may further be configured to return to the pickup point along a first return path after the first semiconductor chip is bonded to the substrate. Also, the apparatus for semiconductor die bonding may include a second transfer device configured to transfer the second bonding head from the pickup point to the bonding point located on the substrate along the transfer path. The second transfer device may further be configured to return to the pickup point along a second return path after the second semiconductor chip is bonded to the substrate. Additionally, the apparatus for semiconductor die bonding may include a controller configured to alternately apply a transfer signal and a return signal to the first transfer device and the second transfer device so the first bonding head and the second bonding head do not collide with each other.
摘要翻译：一种用于半导体管芯接合的设备包括：第一接合头和第二接合头，其被配置为分别拾取位于拾取点处的第一半导体芯片和第二半导体芯片。用于半导体管芯接合的设备还可以包括第一传送设备，其被配置为沿着传送路径将第一接合头从拾取点传送到位于衬底上的接合点。第一传送装置还可以被配置为在第一半导体芯片被接合到基板之后沿着第一返回路径返回到拾取点。此外，用于半导体管芯接合的装置可以包括第二传送装置，其被配置为沿着传送路径将第二接合头从拾取点传送到位于衬底上的接合点。第二传送装置还可以被配置为在第二半导体芯片被接合到基板之后沿着第二返回路径返回到拾取点。另外，用于半导体管芯接合的装置可以包括控制器，其被配置为交替地将传递信号和返回信号施加到第一传送装置和第二传送装置，使得第一接合头和第二接合头不会彼此碰撞。

6. 发明申请

US20050205975A1 Semiconductor package having step type die and method for manufacturing the same 有权
标题翻译：具有步进式模具的半导体封装及其制造方法
公开(公告)号：US20050205975A1
公开(公告)日：2005-09-22
申请号：US11077235
申请日：2005-03-11
申请人： In-Ku Kang , Seok Goh , Jin-Ho Kim , Tae-Gyeong Chung , Yong-Jae Lee
发明人： In-Ku Kang , Seok Goh , Jin-Ho Kim , Tae-Gyeong Chung , Yong-Jae Lee
IPC分类号： H01L25/18 , H01L21/301 , H01L21/50 , H01L21/60 , H01L21/78 , H01L21/98 , H01L23/02 , H01L23/12 , H01L23/31 , H01L25/065 , H01L25/07 , H01L29/06
CPC分类号： H01L24/32 , H01L21/78 , H01L23/3128 , H01L24/05 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/49175 , H01L2224/4945 , H01L2224/73204 , H01L2224/73265 , H01L2224/85051 , H01L2224/85191 , H01L2224/85399 , H01L2224/85986 , H01L2224/92247 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06582 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01051 , H01L2924/01057 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10158 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2224/85186 , H01L2224/45099 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/4554
摘要： A variety of non-rectangular IC chips having a stepped or modified periphery or edge profile including one or more recessed or indented peripheral regions are provided for incorporation in modified package configurations, single chip packages and multi-chip assemblies, both stacked and/or planar. In the planar configurations, the recessed regions may be utilized, in cooperation with another appropriately sized IC chip, to increase the packing density of the resulting device. Similarly, in the stacked configuration, the recessed regions may be utilized to provide access to bond pads of lower chips and thereby reduce the need for spacers or peripheral thinning techniques and thereby improve the strength of the resulting assembly and/or reduce the overall height of the stacked structure.
摘要翻译：提供了具有包括一个或多个凹陷或凹入周边区域的阶梯状或改进的周边或边缘轮廓的各种非矩形IC芯片，用于结合到改进的封装结构，单个芯片封装和多芯片组件中，堆叠和/或平面。在平面构造中，可以与另一适当尺寸的IC芯片配合使用凹陷区域，以增加所得器件的封装密度。类似地，在堆叠构造中，凹陷区域可以用于提供对下部芯片的接合焊盘的访问，从而减少对间隔件或外围变薄技术的需要，从而提高所得组件的强度和/或降低总体高度堆叠结构。

7. 发明授权

US08546938B2 Stacked package including spacers and method of manufacturing the same 有权
标题翻译：堆叠包装，包括垫片及其制造方法
公开(公告)号：US08546938B2
公开(公告)日：2013-10-01
申请号：US13311681
申请日：2011-12-06
申请人： Sang-Geun Kim , Dong-Chul Han , Seok Goh , Jeong-Hoon Kim
发明人： Sang-Geun Kim , Dong-Chul Han , Seok Goh , Jeong-Hoon Kim
IPC分类号： H01L23/34
CPC分类号： H01L23/49811 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/85 , H01L25/105 , H01L25/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2224/85 , H01L2224/92247 , H01L2225/1023 , H01L2225/1052 , H01L2225/1058 , H01L2924/00014 , H01L2924/15159 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0401
摘要： A stacked package and method of manufacture are provided. The stacked package may include a first semiconductor package, a second semiconductor package, plugs and spacers. The second semiconductor package may be stacked on the first semiconductor package. The plugs may electrically connect the first semiconductor to the second semiconductor package. The spacer may be interposed between the first semiconductor package and the second semiconductor package to form a gap between the first semiconductor package and the second semiconductor package, thereby preventing an electrical short between the plugs.
摘要翻译：提供堆叠的包装和制造方法。堆叠封装可以包括第一半导体封装，第二半导体封装，插头和间隔件。第二半导体封装可以堆叠在第一半导体封装上。插头可以将第一半导体电连接到第二半导体封装。间隔件可以插入在第一半导体封装和第二半导体封装之间以在第一半导体封装和第二半导体封装之间形成间隙，从而防止插头之间的电短路。

8. 发明申请

US20110232082A1 APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICE 有权
标题翻译：安装半导体器件的装置
公开(公告)号：US20110232082A1
公开(公告)日：2011-09-29
申请号：US13071640
申请日：2011-03-25
申请人： TAEHYUN KIM , Dongsoo Lee , Seok Goh , Kyoungbok Cho
发明人： TAEHYUN KIM , Dongsoo Lee , Seok Goh , Kyoungbok Cho
IPC分类号： H01L21/58
CPC分类号： H01L24/75 , H01L21/67144 , H01L21/6836 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/95 , H01L2221/68336 , H01L2221/68381 , H01L2224/131 , H01L2224/7501 , H01L2224/75251 , H01L2224/7565 , H01L2224/75651 , H01L2224/75744 , H01L2224/75745 , H01L2224/75801 , H01L2224/75821 , H01L2224/759 , H01L2224/7598 , H01L2224/81011 , H01L2224/81191 , H01L2224/81815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/014 , H05K1/0269 , H05K13/046 , Y10T29/53178
摘要： An apparatus for mounting a semiconductor device includes a mounting component and a loading component. The mounting component is configured to mount the semiconductor device onto a circuit board. The loading component is disposed adjacent to the mounting component, and is configured to supply the semiconductor device and the circuit board to the mounting component.
摘要翻译：一种用于安装半导体器件的装置包括安装部件和装载部件。安装部件被配置为将半导体器件安装到电路板上。装载部件邻近安装部件设置，并且构造成将半导体器件和电路板提供给安装部件。

9. 发明申请

US20100164525A1 TEST SOCKET, TEST APPARATUS WITH TEST SOCKET 有权
标题翻译：测试插座，带测试插座的测试装置
公开(公告)号：US20100164525A1
公开(公告)日：2010-07-01
申请号：US12719267
申请日：2010-03-08
申请人： Jongwong HAN , Sangsik Lee , Seok Goh , Byoungjun Min , Jongpil Park , Jaemuk Oh , JungHyeon Kim
发明人： Jongwong HAN , Sangsik Lee , Seok Goh , Byoungjun Min , Jongpil Park , Jaemuk Oh , JungHyeon Kim
IPC分类号： G01R31/02
CPC分类号： G01R1/0458 , G01R31/2863 , G01R31/2875
摘要： A test socket is provided that includes a socket body to receive an object to be tested, a lid disposed on the socket body, one or more pushers coupled to a first surface of lid to apply force to a first surface of the object toward the socket body, and a temperature controlling member to provide a temperature to the object. A semiconductor package may be tested in a test apparatus that includes the test socket, the methods of testing including receiving a semiconductor package in a socket in a test chamber, applying a first temperature to the test chamber to test the semiconductor package at a first test temperature, and applying a second temperature to the semiconductor package to test the semiconductor package at a second test temperature by controlling the application of the second temperature with the socket.
摘要翻译：提供了一种测试插座，其包括用于接收被测试对象的插座主体，设置在插座主体上的盖子，一个或多个连接到盖的第一表面的推动器，以向该插座的第一表面施加力主体和温度控制构件以向对象提供温度。可以在包括测试插座的测试设备中测试半导体封装，测试方法包括在测试室中的插座中接收半导体封装，将第一温度施加到测试室以在第一测试中测试半导体封装温度，并且向半导体封装施加第二温度以通过控制第二温度与插座的应用来在第二测试温度下测试半导体封装。

10. 发明授权

US06698486B2 Apparatus for removing wafer ring tape 失效
标题翻译：去除晶圆环带的装置
公开(公告)号：US06698486B2
公开(公告)日：2004-03-02
申请号：US10008703
申请日：2001-12-06
申请人： Seok Goh
发明人： Seok Goh
IPC分类号： B32B3500
CPC分类号： H01L21/67132 , Y10S156/941 , Y10T29/49819 , Y10T29/49822 , Y10T156/1051 , Y10T156/19
摘要： An apparatus for removing a wafer ring tape, on which defective chips remain, from a wafer ring after normal chips are detached from the wafer ring tape, is provided. The apparatus comprises a ring table for supporting a tape-adhered wafer ring in which the wafer ring tape is attached to the wafer ring; a detaching head positionable above the ring table and movable for detaching the wafer ring tape from the wafer ring; a blocking pin disposed under the ring table to support the wafer ring tape detached from the wafer ring; and a pair of compressing plates disposed under the ring table to compress the wafer ring tape supported by the blocking pin.
摘要翻译：提供了一种用于从正常芯片从晶片环带上拆下之后，从晶片环上去除有缺陷的芯片的晶片环带的装置。该装置包括一个环形台，用于支撑带状粘结的晶圆环，其中晶片环带附着到晶圆环上; 分离头，其可定位在所述环台上方并且可移动以将所述晶片环带从所述晶片环分离; 设置在所述环台下方以支撑从所述晶片环分离的所述晶片环带的阻塞销; 以及设置在环台下方的一对压缩板，以压缩由阻塞销支撑的晶片环带。

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