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1. 发明申请

US20110079361A1 APPARATUS FOR SEMICONDUCTOR DIE BONDING 审中-公开
标题翻译：用于半导体DIE结合的装置
公开(公告)号：US20110079361A1
公开(公告)日：2011-04-07
申请号：US12850027
申请日：2010-08-04
申请人： Byeong-kuk Park , Seok Goh , Kyoung-bok Cho , Dong-soo Lee , Jung-hwan Woo
发明人： Byeong-kuk Park , Seok Goh , Kyoung-bok Cho , Dong-soo Lee , Jung-hwan Woo
IPC分类号： B32B37/02
CPC分类号： H01L24/83 , H01L24/75 , H01L2224/83 , H01L2224/838 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , Y10T156/1707 , Y10T156/1744
摘要： An apparatus for semiconductor die bonding includes a first bonding head and a second bonding head configured to respectively pickup a first semiconductor chip and a second semiconductor chip located at a pickup point. The apparatus for semiconductor die bonding may also include a first transfer device configured to transfer the first bonding head from the pickup point to a bonding point located on a substrate along a transfer path. The first transfer device may further be configured to return to the pickup point along a first return path after the first semiconductor chip is bonded to the substrate. Also, the apparatus for semiconductor die bonding may include a second transfer device configured to transfer the second bonding head from the pickup point to the bonding point located on the substrate along the transfer path. The second transfer device may further be configured to return to the pickup point along a second return path after the second semiconductor chip is bonded to the substrate. Additionally, the apparatus for semiconductor die bonding may include a controller configured to alternately apply a transfer signal and a return signal to the first transfer device and the second transfer device so the first bonding head and the second bonding head do not collide with each other.
摘要翻译：一种用于半导体管芯接合的设备包括：第一接合头和第二接合头，其被配置为分别拾取位于拾取点处的第一半导体芯片和第二半导体芯片。用于半导体管芯接合的设备还可以包括第一传送设备，其被配置为沿着传送路径将第一接合头从拾取点传送到位于衬底上的接合点。第一传送装置还可以被配置为在第一半导体芯片被接合到基板之后沿着第一返回路径返回到拾取点。此外，用于半导体管芯接合的装置可以包括第二传送装置，其被配置为沿着传送路径将第二接合头从拾取点传送到位于衬底上的接合点。第二传送装置还可以被配置为在第二半导体芯片被接合到基板之后沿着第二返回路径返回到拾取点。另外，用于半导体管芯接合的装置可以包括控制器，其被配置为交替地将传递信号和返回信号施加到第一传送装置和第二传送装置，使得第一接合头和第二接合头不会彼此碰撞。

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