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    • 2. 发明申请
    • Display device and method of fabricating the same
    • 显示装置及其制造方法
    • US20030071953A1
    • 2003-04-17
    • US10300226
    • 2002-11-19
    • Semiconductor Energy Laboratory Co., Ltd., a Japanese corporation
    • Shunpei YamazakiYasuhiko TakemuraSetsuo NakajimaYasuyuki Arai
    • G02F001/1345
    • G02F1/13452G02F1/1303G02F1/133305G02F1/1345G02F1/13454H01L21/67132H01L2221/68363H01L2224/16H01L2924/01079
    • A method of fabricating a driver circuit for use with a passive matrix or active matrix electrooptical display device such as a liquid crystal display. The driver circuit occupies less space than heretofore. A circuit (stick crystal) having a length substantially equal to the length of one side of the matrix of the display device is used as the driver circuit. The circuit is bonded to one substrate of the display device, and then the terminals of the circuit are connected with the terminals of the display device. Subsequently, the substrate of the driver circuit is removed. This makes the configuration of the circuit much simpler than the configuration of the circuit heretofore required by the TAB method or COG method, because conducting lines are not laid in a complex manner. The driver circuit can be formed on a large-area substrate such as a glass substrate. The display device can be formed on a lightweight material having a high shock resistance such as a plastic substrate. Hence, a display device having excellent portability can be obtained.
    • 一种制造用于无源矩阵或有源矩阵电光显示装置如液晶显示器的驱动电路的方法。 驱动电路占用的空间比以前少。 使用具有与显示装置的矩阵的一侧的长度大致相等的长度的电路(棒状晶体)作为驱动电路。 电路接合到显示装置的一个基板,然后电路的端子与显示装置的端子连接。 随后,驱动电路的基板被去除。 这使得电路的配置比TAB方法或COG方法所要求的电路的配置简单得多,因为导线不是以复杂的方式铺设。 驱动电路可以形成在诸如玻璃基板的大面积基板上。 显示装置可以形成在具有高抗冲击性的轻质材料上,例如塑料基板。 因此,可以获得具有优异便携性的显示装置。
    • 3. 发明申请
    • Semiconductor device and method of fabricating same
    • 半导体装置及其制造方法
    • US20030062565A1
    • 2003-04-03
    • US10202500
    • 2002-07-23
    • Semiconductor Energy Laboratory Co., Ltd., a Japanese corporation
    • Shunpei YamazakiYasuhiko Takemura
    • H01L029/788
    • H01L27/11556H01L27/115
    • The present invention relates to a nonvolatile semiconductor vertical channel semiconductor device and a method of fabricating the same. The method starts with forming an insulator for device isolating having a depth D in a semiconductor substrate. The semiconductor substrate is etched with an etch depth d so that elevated portions are formed. A first conductive film is formed covering the elevated portions. After selectively and isotropically etched, the first conductive film is anisotropically etched so as to form floating gates on the side surfaces of the elevated portions. Sequently, a device insulating may be performed by selective oxidation technology. Further, a second conductive film is formed and anisotropically etched so that control gates are fabricated on the side surfaces of the elevated portions. In this case, forming a mask on predetermined regions of the elevated portions, the second conductive film may be etched to form gates of planar transistors or wirings. Then, a nonvolatile memory device is completed. If the depth D of the insulator and the etch depth d satisfy the following equation: D>d, a NAND circuit can be fabricated. Furthermore, a NAND circuit comprising planar MOS transistors for selective transistors and vertical channel transistors for memory cells may be manufactured.
    • 非易失性半导体垂直沟道半导体器件及其制造方法技术领域本发明涉及一种非易失性半导体垂直沟道半导体器件及其制造方法。 该方法开始于在半导体衬底中形成具有深度D的器件隔离绝缘体。 用蚀刻深度d蚀刻半导体衬底,从而形成升高的部分。 形成覆盖升高部分的第一导电膜。 在选择性和各向同性蚀刻之后,第一导电膜被各向异性蚀刻,以便在升高部分的侧表面上形成浮栅。 接下来,可以通过选择性氧化技术进行绝缘的器件。 此外,形成第二导电膜并各向异性蚀刻,使得控制栅极制造在升高部分的侧表面上。 在这种情况下,在升高部分的预定区域上形成掩模,可以蚀刻第二导电膜以形成平面晶体管或布线的栅极。 然后,完成非易失性存储装置。 如果绝缘体的深度D和蚀刻深度d满足以下等式:D> d,则可以制造NAND电路。 此外,可以制造包括用于选择性晶体管的平面MOS晶体管和用于存储单元的垂直沟道晶体管的NAND电路。