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1. 发明授权

US06662445B2 Method of connecting covered wires 失效
标题翻译：连接包线的方法
公开(公告)号：US06662445B2
公开(公告)日：2003-12-16
申请号：US09759526
申请日：2001-01-16
申请人： Satoshi Tanikawa , Takashi Ishii
发明人： Satoshi Tanikawa , Takashi Ishii
IPC分类号： H01R4300
CPC分类号： B23K20/10 , B23K2101/38 , H01R9/0512 , H01R43/0207 , H01R43/0228 , Y10T29/49194 , Y10T29/49201
摘要： In this method, a ground wire 2 is overlaid on a shield wire 1 in cross. Next, overlapping portions of the shield wire 1 and the ground wire 2 are interposed between an upper resin tip 13 and a lower resin tip 14. By executing a first ultrasonic oscillation while inserting a projection 7a of an ultrasonic horn 7 into a through hole 13b of the tip 13, outside rinds 1d, 2b of the wires 1, 2 are removed in the vicinity of the overlapping portions. Next, by arranging a low-melting metal 15 and a resin piece 16 on a contact between the braided wire 1c and the core line 2a and executing a second ultrasonic oscillation, the contact can be brazed with the mutual welding of the tips 13, 14.
摘要翻译：在该方法中，地线2交叉地覆盖在屏蔽线1上。接下来，屏蔽线1和接地线2的重叠部分插入在上树脂末端13和下树脂尖端14之间。通过在将超声波喇叭7的突起7a插入通孔13b中的同时执行第一超声波振荡在重叠部分附近除去导线1,2的外侧1d，2b的末端13的外侧。接下来，通过在编织线1c和芯线2a之间的接触处布置低熔点金属15和树脂片16并执行第二超声波振荡，可以通过尖端13,14的相互焊接钎焊接触。

2. 发明授权

US06226865B1 Method of connecting covered wires 有权
标题翻译：连接包线的方法
公开(公告)号：US06226865B1
公开(公告)日：2001-05-08
申请号：US09274975
申请日：1999-03-23
申请人： Satoshi Tanikawa , Takashi Ishii
发明人： Satoshi Tanikawa , Takashi Ishii
IPC分类号： H01R4300
CPC分类号： B23K20/10 , B23K2101/38 , H01R9/0512 , H01R43/0207 , H01R43/0228 , Y10T29/49194 , Y10T29/49201
摘要： In this method, a ground wire 2 is overlaid on a shield wire 1 in cross. Next, overlapping portions of the shield wire 1 and the ground wire 2 are interposed between an upper resin tip 13 and a lower resin tip 14. By executing a first ultrasonic oscillation while inserting a projection 7a of an ultrasonic horn 7 into a through hole 13b of the tip 13, outside rinds 1d, 2b of the wires 1, 2 are removed in the vicinity of the overlapping portions. Next, by arranging a low-melting metal 15 and a resin piece 16 on a contact between the braided wire 1c and the core line 2a and executing a second ultrasonic oscillation, the contact can be brazed with the mutual welding of the tips 13, 14.
摘要翻译：在该方法中，地线2交叉地覆盖在屏蔽线1上。接下来，屏蔽线1和接地线2的重叠部分插入在上树脂末端13和下树脂末端14之间。通过在将超声波喇叭7的突起7a插入通孔13b中的同时执行第一超声波振荡在重叠部分附近除去导线1,2的外侧1d，2b的末端13的外侧。接下来，通过在编织线1c和芯线2a之间的接触处布置低熔点金属15和树脂片16并执行第二超声波振荡，可以通过尖端13,14的相互焊接钎焊接触。

3. 发明授权

US6072123A Connecting structure for covered wires 有权
公开(公告)号：US6072123A
公开(公告)日：2000-06-06
申请号：US260470
申请日：1999-03-02
申请人： Tetsuro Ide , Satoshi Tanikawa
发明人： Tetsuro Ide , Satoshi Tanikawa
IPC分类号： H01R4/70 , B29C65/08 , H01R4/02 , H01R9/05 , H01R43/02 , H02G15/08 , H01R4/00
CPC分类号： H01R43/0207 , H01R4/021 , Y10T29/49194 , Y10T29/49201
摘要： A connecting structure for covered wires is provided. At first, a shield wire 1 and a ground wire 2 are prepared. After overlaying the ground wire 2 on the shield wire 1 cross each other, respective overlapping portions of the wires 1, 2 are interposed between an upper resin tip 13 and a lower resin tip 14. Next, the upper and lower resin tips 13, 14 are oscillated with ultrasonic waves while compressing the upper and lower resin tips 13, 14 from the outside. Consequently, respective outside rinds 1d, 2b of the wires 1, 2 are molten for removal, so that a braided wire 1c comes into electrical contact with a core line 2a. The upper and lower resin tips 13, 14 have wire receiving grooves 13a, 14a formed on their butt faces. Each of the groove 13a, 14a has a semi-circular cross section of a diameter corresponding to the diameter of the shield wire 1. The upper resin tip 13 is provided, at an intermediate portion of the wire receiving groove 13a in the longitudinal direction, with a press part 13b for urging the ground wire 2 against the shield wire 1.

4. 发明授权

US06327777B1 Connecting structure for covered wires 有权
标题翻译：包线连接结构
公开(公告)号：US06327777B1
公开(公告)日：2001-12-11
申请号：US09413542
申请日：1999-10-06
申请人： Tetsuro Ide , Satoshi Tanikawa
发明人： Tetsuro Ide , Satoshi Tanikawa
IPC分类号： H01R4304
CPC分类号： H01R43/0207 , H01R4/021 , Y10T29/49194 , Y10T29/49201
摘要： A connecting structure for covered wires is provided. At first, a shield wire 1 and a ground wire 2 are prepared. After overlaying the ground wire 2 on the shield wire 1 cross each other, respective overlapping portions of the wires 1, 2 are interposed between an upper resin tip 13 and a lower resin tip 14. Next, the upper and lower resin tips 13, 14 are oscillated with ultrasonic waves while compressing the upper and lower resin tips 13, 14 from the outside. Consequently, respective outside rinds 1d, 2b of the wires 1, 2 are molten for removal, so that a braided wire 1c comes into electrical contact with a core line 2a. The upper and lower resin tips 13, 14 have wire receiving grooves 13a, 14a formed on their butt faces. Each of the groove 13a, 14a has a semi-circular cross section of a diameter corresponding to the diameter of the shield wire 1. The upper resin tip 13 is provided, at an intermediate portion of the wire receiving groove 13a in the longitudinal direction, with a press part 13b for urging the ground wire 2 against the shield wire 1.
摘要翻译：提供了一种用于包线的连接结构。首先，准备了屏蔽线1和接地线2。将接地线2覆盖在屏蔽线1上交叉时，线1,2的各重叠部分插入在上树脂末端13和下树脂末端14之间。接下来，上，下树脂尖端13,14 在从外部压缩上部和下部树脂尖端13,14的同时用超声波振荡。因此，电线1,2的各个外侧皮带1d，2b被熔融除去，使得编织线1c与芯线2a电接触。上下树脂顶端13,14具有形成在其对接面上的线容纳槽13a，14a。每个槽13a，14a具有与屏蔽线1的直径相对应的直径的半圆形截面。上部树脂端头13设置在电线容纳槽13a的纵向方向的中间部分处，具有用于将接地线2推靠在屏蔽线1上的按压部分13b。

5. 发明授权

US06291771B1 Structure and method for connecting covered wires 有权
标题翻译：连接包线的结构和方法
公开(公告)号：US06291771B1
公开(公告)日：2001-09-18
申请号：US09274382
申请日：1999-03-23
申请人： Satoshi Tanikawa , Nobuyuki Asakura
发明人： Satoshi Tanikawa , Nobuyuki Asakura
IPC分类号： H01R400
CPC分类号： B23K20/10 , B23K20/106 , B23K2101/38 , H01R4/027 , H01R4/029 , H01R9/0512 , H01R43/0207 , Y10T29/49201
摘要： A connecting structure includes a shield wire 1, a ground wire 2, an upper resin tip 15, a lower resin tip 16, and a low-melting welding material 17. First, the ground wire 2 is overlaid on the shield wire 1 in cross. Next, overlapping portions of the shield wire 1 and the ground wire 2 are interposed between the resin tips 15 and 16. By oscillating the resin tips 15 and 16 with ultrasonic waves, respective outside rinds 1d, 2d of the wires 1,2 are removed in the vicinity of the overlapping portions. A braided wire 1c of the wire 1 is electrically connected with a core line 2a of the wire 2 and, simultaneously, the resin tips 15 and 16 are welded to each other to seal up the vicinity of a connecting part S1. With the ultrasonic oscillation, a low-melting materials 17 is molten to flow into the connecting part S1, so that the braided wire 1c of the wire 1 is joined to the core line 2a of the wire 2 through the molten material 17.
摘要翻译：连接结构包括屏蔽线1，接地线2，上树脂顶端15，下树脂尖端16和低熔点焊接材料17.首先，接地线2交叉地覆盖在屏蔽线1上。接下来，屏蔽线1和接地线2的重叠部分插入在树脂尖端15和16之间。通过用超声波振荡树脂尖端15和16，去除线1,2的各外围1d，2d 在重叠部分附近。导线1的编织线1c与导线2的芯线2a电连接，同时，将树脂顶端15,16彼此焊接以密封连接部S1附近。通过超声波振荡，熔融熔融材料17流入连接部S1，使得线1的编织线1c通过熔融材料17接合到线2的芯线2a。

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