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    • 8. 发明授权
    • Electronic packages and method to enhance the passive thermal management
of electronic packages
    • 电子封装和方法来增强电子封装的被动热管理
    • US5912800A
    • 1999-06-15
    • US923007
    • 1997-09-03
    • Bahgat Ghaleb SammakiaSanjeev Balwant Sathe
    • Bahgat Ghaleb SammakiaSanjeev Balwant Sathe
    • H01L23/467H05K7/20
    • H01L23/467H01L2924/0002
    • A method of enhancing the passive thermal management of electronic packages, and an electronic package consisting of a vertically-oriented substrate, such as a printed circuit board or the like, a heat-generating electronic module, for example, containing at least one chip which is positioned on a substrate, and a cover plate located adjacent to the module at a predetermined spaced relationship therefrom. The cover plate includes at least one opening located adjacent the module at a predetermined location relative thereto so as to ensure a maximum cooling air flow impinging on the module, and which air flow thereafter passes upwardly between the substrate and the cover plate. The cover plate may be equipped with a heat-sink structure, such as fins, for cooling the module, which structure is adapted to project through the opening formed in the cover plate or to lie flush therewith.
    • 一种增强电子封装的被动热管理的方法,以及由诸如印刷电路板等的垂直取向的基板组成的电子封装件,例如包含至少一个芯片的发热电子模块 被定位在基板上,并且盖板以与其成预定间隔的关系定位在模块附近。 盖板包括在相对于其的预定位置处邻近模块定位的至少一个开口,以便确保撞击在模块上的最大冷却空气流,并且此后的空气流在基板和盖板之间向上通过。 盖板可以配备有用于冷却模块的诸如翅片的散热结构,该结构适于突出通过形成在盖板中的开口或与其平齐。