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    • 2. 发明授权
    • Method and system for enhancing yield of semiconductor integrated circuit devices using systematic fault rate of hole
    • 使用系统故障率提高半导体集成电路器件产量的方法和系统
    • US07703055B2
    • 2010-04-20
    • US11698029
    • 2007-01-26
    • Choel-hwyi BaeSang-deok KwonMin-geon ChoGwang-hyeon Baek
    • Choel-hwyi BaeSang-deok KwonMin-geon ChoGwang-hyeon Baek
    • G06F17/50
    • G06F17/5081G06F2217/12Y02P90/265
    • A method of enhancing yield of semiconductor integrated circuit includes determining multiple experimental values, each experimental value corresponding to a distance from a side of a hole to an opposing side of a shape surrounding the hole, forming test patterns representing each of the experimental values on a wafer and calculating experimental value-based systematic fault rates from the test patterns; converting the experimental value-based systematic fault rates of the hole into the experimental value-based systematic fault rates, calculating a length of a side of the hole for which a distance between the side of the hole and the opposing side of the shape corresponds to each of experimental values, and calculating a systematic fault rate of the hole using the experimental value-based systematic fault rates per unit hole length and the length of the sides of the hole calculated for the respective experimental values in the desired layout.
    • 提高半导体集成电路的产量的方法包括确定多个实验值,每个实验值对应于从孔的一侧到围绕孔的形状的相对侧的距离,形成表示每个实验值的测试图案 并从测试模式中计算基于实验值的系统故障率; 将孔的实验值系统故障率转换为基于实验值的系统故障率,计算孔的侧面与形状的相对侧之间的距离对应于孔的一侧的长度 每个实验值,并且使用每个单位孔长度的实验值系统故障率和针对所需布局中的各个实验值计算的孔的边的长度来计算孔的系统故障率。
    • 3. 发明授权
    • Structure and method for failure analysis in a semiconductor device
    • 半导体器件故障分析的结构和方法
    • US07468530B2
    • 2008-12-23
    • US11291242
    • 2005-11-30
    • Ki-Am LeeSang-Deok KwonJong-Hyun Lee
    • Ki-Am LeeSang-Deok KwonJong-Hyun Lee
    • H01L29/74
    • G01R31/2884
    • In a method and structure for semiconductor failure analysis, the structure comprises: a plurality of analytic fields disposed on a predetermined area of a semiconductor device; semiconductor transistors arranged in each of the analytic fields, the semiconductor transistors arranged in an array; wordlines arranged on each of the plurality of the analytic fields, connecting the semiconductor transistors with each other in a first direction; and bitline structures on each of the plurality of the analytic fields, connecting the semiconductor transistors with each other in a second direction, wherein the bitline structures are configured in different patterns in each of the plurality of analytic fields.
    • 在半导体故障分析的方法和结构中,该结构包括:设置在半导体器件的预定区域上的多个分析场; 布置在每个分析场中的半导体晶体管,排列成阵列的半导体晶体管; 布置在多个分析场中的每一个上的字线,在第一方向上将半导体晶体管彼此连接; 以及在所述多个分析场中的每一个上的位线结构,在第二方向上将所述半导体晶体管彼此连接,其中所述位线结构在所述多个分析场中的每一个中被配置为不同的图案。
    • 6. 发明申请
    • Structure and method for failure analysis in a semiconductor device
    • 半导体器件故障分析的结构和方法
    • US20060118784A1
    • 2006-06-08
    • US11291242
    • 2005-11-30
    • Ki-Am LeeSang-Deok KwonJong-Hyun Lee
    • Ki-Am LeeSang-Deok KwonJong-Hyun Lee
    • H01L23/58
    • G01R31/2884
    • In a method and structure for semiconductor failure analysis, the structure comprises: a plurality of analytic fields disposed on a predetermined area of a semiconductor device; semiconductor transistors arranged in each of the analytic fields, the semiconductor transistors arranged in an array; wordlines arranged on each of the plurality of the analytic fields, connecting the semiconductor transistors with each other in a first direction; and bitline structures on each of the plurality of the analytic fields, connecting the semiconductor transistors with each other in a second direction, wherein the bitline structures are configured in different patterns in each of the plurality of analytic fields.
    • 在半导体故障分析的方法和结构中,该结构包括:设置在半导体器件的预定区域上的多个分析场; 布置在每个分析场中的半导体晶体管,排列成阵列的半导体晶体管; 布置在多个分析场中的每一个上的字线,在第一方向上将半导体晶体管彼此连接; 以及在所述多个分析场中的每一个上的位线结构,在第二方向上将所述半导体晶体管彼此连接,其中所述位线结构在所述多个分析场中的每一个中被配置为不同的图案。