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    • 7. 发明授权
    • Semiconductor power integrated circuit
    • 半导体电源集成电路
    • US06404011B2
    • 2002-06-11
    • US09865004
    • 2001-05-23
    • Jong-Dae KimSang-Gi KimJin-Gun KooDae-Yong Kim
    • Jong-Dae KimSang-Gi KimJin-Gun KooDae-Yong Kim
    • H01L2976
    • H01L21/84H01L21/76264H01L21/76283H01L27/1203
    • A method for fabricating a semiconductor power integrated circuit includes the steps of forming a semiconductor structure having at least one active region, wherein an active region includes a well region for forming a source and a drift region for forming a drain region, forming a trench for isolation of the active regions, wherein the trench has a predetermined depth from a surface of the semiconductor structure, forming a first TEOS-oxide layer inside the trench and above the semiconductor structure, wherein the first TEOS-oxide layer has a predetermined thickness from the surface of the semiconductor device, forming a second TEOS-oxide layer on the first TEOS-oxide layer, wherein a thickness of the second TEOS-oxide layer is smaller than that of the first TEOS-oxide layer, and performing a selective etching to the first and second TEOS-oxide layers, to thereby simultaneously form a field oxide layer pattern, a diode insulating layer pattern and a gate oxide layer pattern, to thereby reduce processing steps and obtain a low on-resistance.
    • 一种制造半导体功率集成电路的方法包括以下步骤:形成具有至少一个有源区的半导体结构,其中有源区包括用于形成源的阱区和用于形成漏极区的漂移区,形成用于 有源区的隔离,其中沟槽具有来自半导体结构的表面的预定深度,在沟槽内部和半导体结构之上形成第一TEOS氧化物层,其中第一TEOS氧化物层具有来自该半导体结构的预定厚度 在所述第一TEOS氧化物层上形成第二TEOS氧化物层,其中所述第二TEOS氧化物层的厚度小于所述第一TEOS氧化物层的厚度,并且对所述第一TEOS氧化物层进行选择性蚀刻 第一和第二TEOS氧化物层,从而同时形成场氧化物层图案,二极管绝缘层图案和栅极氧化物层图案 y减少加工步骤并获得低导通电阻。
    • 8. 发明授权
    • Method for fabricating high density trench gate type power device
    • 高密度沟槽栅型功率器件的制造方法
    • US06211018B1
    • 2001-04-03
    • US09475281
    • 1999-12-30
    • Kee Soo NamSang Gi KimTae Moon RohJin Gun Koo
    • Kee Soo NamSang Gi KimTae Moon RohJin Gun Koo
    • H01L21336
    • H01L29/66727H01L29/66348
    • A semiconductor technique is disclosed. Particularly a low voltage high current power device for use in a lithium ion secondary battery protecting circuit, a DC-DC converter and a motor is disclosed. Further, a method for fabricating a high density trench gate type power device is disclosed. That is, in the present invention, a trench gate mask is used for forming the well and/or source, and for this purpose, a side wall spacer is introduced. In this manner, the well and/or source is defined by using the trench gate mask, and therefore, 1 or 2 masking processes are skipped unlike the conventional process in which the well mask and the source mask are separately used. The decrease in the use of the masking process decreases the mask align errors, and therefore, the realization of a high density is rendered possible. Consequently, the on-resistance which is an important factor for the power device can be lowered.
    • 公开了半导体技术。 特别地,公开了一种用于锂离子二次电池保护电路,DC-DC转换器和电动机的低压大电流功率器件。 此外,公开了一种制造高密度沟槽栅型功率器件的方法。 也就是说,在本发明中,沟槽栅极掩模用于形成阱和/或源,为此,引入了侧壁间隔物。 以这种方式,通过使用沟槽栅极掩模来定义阱和/或源,因此与分开使用阱掩模和源掩模的常规工艺不同,跳过1或2个屏蔽处理。 掩蔽过程的使用减少会降低掩模对准误差,因此可以实现高密度。 因此,作为功率器件的重要因素的导通电阻可以降低。