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1. 发明申请

WO2004107374A2 OPENABLE ONE-PIECE ELECTRICAL RF SHIELD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：可开发的一体式电气射频屏蔽及其制造方法
公开(公告)号：WO2004107374A2
公开(公告)日：2004-12-09
申请号：PCT/US2004/016993
申请日：2004-05-28
申请人： INTERPLEX NAS, INC. , SEIDLER, Jack
发明人： SEIDLER, Jack
IPC分类号： H01H
CPC分类号： H05K9/0026
摘要： An easily openable one-piece RF interference shield and method of manufacturing the same is cost efficient and easily adapted for use with existing substantially open bottom region, and a hingeably connected top cover portion, having a top cover latch and disposed along the top edge of one of the sidewalls. The top cover portion of the shield is adapted to hinge toward another one of the sidewalls such that the top cover latch engages a hole disposed on the other sidewall being engaged and completing a protective enclosure about electrical components and preventing those components from causing electromagnetic interferences. The RF shield of the present invention allows for easy opening of the top cover portion to provide access to the enclosure for rework or repair of the electrical components covered by the shield, without having to unsolder the unit from a substrate containing the electrical components. The plurality of sidewalls include a first mating sidewall that is connected to a first intermediate sidewall, the first intermediate sidewall being connected to a second intermediate sidewall, and the second intermediate sidewall being connected to a second mating sidewall.
摘要翻译：易于打开的单件式RF干涉屏蔽及其制造方法具有成本效益并且易于适用于现有的基本上开放的底部区域，以及铰链式连接的顶盖部分，其具有顶盖闩锁并沿着一个侧壁。护罩的顶盖部分适于朝向另一个侧壁铰接，使得顶盖闩锁接合设置在另一个侧壁上的孔，并接合并围绕电气部件完成保护外壳，并防止这些部件引起电磁干扰。本发明的RF屏蔽件允许容易地打开顶盖部分以提供对外壳的通路，以便对由屏蔽件覆盖的电气部件进行返修或修复，而不必将该单元从包含电气部件的基板去除。多个侧壁包括连接到第一中间侧壁的第一配合侧壁，第一中间侧壁连接到第二中间侧壁，第二中间侧壁连接到第二配合侧壁。

2. 发明申请

WO1996010279A1 SOLDER-BEARING LEAD AND METHOD OF PRODUCING AND USING SAME 审中-公开
标题翻译：焊接轴承及其生产和使用方法
公开(公告)号：WO1996010279A1
公开(公告)日：1996-04-04
申请号：PCT/US1995013109
申请日：1995-09-28
申请人： NORTH AMERICAN SPECIALTIES CORPORATION , SEIDLER, Jack , POLLOCK, Leonard, J.
发明人： NORTH AMERICAN SPECIALTIES CORPORATION
IPC分类号： H01R09/09
CPC分类号： H01R12/57 , H01R4/02 , H01R43/0256 , H05K3/3405 , H05K3/3426 , H05K3/3478 , H05K2201/10386 , H05K2201/10772 , H05K2201/10984 , Y02P70/613
摘要： A solder-bearing metallic (114), and methods of fabricating and using it, where the lead is formed with a solder-retaining portion (125) having a cross-sectional profile with undercuts, which may be in a V-shape or flat, where solder (133) surrounds said solder-retaining portion and undercuts, and extends outwardly from the lead while leaving a portion of the lead uncovered by solder to permit the lead metal to form direct contact with a susbstrate or other conductive pad.
摘要翻译：一种含有焊料的金属（114）及其制造和使用方法，其中所述引线形成有具有截面轮廓的焊料保持部分（125），所述焊接保持部分具有底切部，所述焊盘保持部分可具有V形或扁平其中焊料（133）围绕所述焊料保持部分和底切，并且从引线向外延伸，同时留下未被焊料覆盖的引线的一部分，以允许引线金属与阻挡层或其它导电焊盘形成直接接触。

3. 发明申请

WO1995020250A1 SMART CARD CONNECTOR 审中-公开
标题翻译：智能卡连接器
公开(公告)号：WO1995020250A1
公开(公告)日：1995-07-27
申请号：PCT/US1995001350
申请日：1995-01-25
申请人： NORTH AMERICAN SPECIALTIES CORPORATION , SEIDLER, Jack
发明人： NORTH AMERICAN SPECIALTIES CORPORATION
IPC分类号： H01R04/02
CPC分类号： H01R12/57 , H01R13/11 , H01R43/0256
摘要： A connector (10) for substrates such as smart cards has a housing (12) containing two parallel rows of spring contacts (34), each of which is held in a respective channel of the housing. Integral with each of the spring contacts and extending outside of one end of the housing is a lead (14) for connection to a substrate. The lead has a solder mass (16) adjacent its end. The two parallel rows of solder-bearing leads will straddle and resiliently hold a substrate between them to improve accuracy in soldering during solder re-flow. The other end of the housing is provided with entry apertures (28) for pins of a multi-pin connector, so that each pin will enter a respective housing channel to contact the spring contact therein. The entry apertures may accommodate a substrate with contact pads.
摘要翻译：用于诸如智能卡的基板的连接器（10）具有包含两排平行的弹簧触头（34）的壳体（12），每个弹簧触头（34）保持在壳体的相应通道中。与每个弹簧触点一体并且延伸到壳体的一端的外部是用于连接到基板的引线（14）。引线在其端部附近具有焊料块（16）。两排平行的焊锡导线将跨越它们并弹性地保持基板，以提高焊料重新流动期间的焊接精度。壳体的另一端设置有用于多针连接器的销的入口孔（28），使得每个销将进入相应的壳体通道以与其中的弹簧接触件接触。入口孔可以容纳具有接触垫的基底。

4. 发明申请

WO1991016736A1 SOLDER-BEARING LEAD 审中-公开
标题翻译：焊接轴承
公开(公告)号：WO1991016736A1
公开(公告)日：1991-10-31
申请号：PCT/US1991002489
申请日：1991-04-11
申请人： NORTH AMERICAN SPECIALTIES CORPORATION , SEIDLER, Jack
发明人： NORTH AMERICAN SPECIALTIES CORPORATION
IPC分类号： H01R04/02
CPC分类号： H01R12/57 , H01R4/02 , H05K3/3405 , H05K3/341 , H05K3/3457 , H05K3/403 , H05K2201/10386 , H05K2201/10984 , Y10T29/49155 , Y10T29/49204
摘要： A solder-bearing lead (310) adapted to be soldered to a conductive surface comprising an elongated body portion (320) having a solder bearing portion (327), a terminal portion (321), and a middle portion disposed between said solder-bearing portion and said terminal portion. The solder-bearing portion carries a solder mass either on a pair of projections (328) extending from one edge of said body portion and forming a gap therebetween dimensioned to receive a solder mass, or on the opposed faces of said solder-bearing portion. A region (319) of the middle portion is twisted so that the solder-bearing portion lies in a plane substantially perpendicular to the plane of the terminal portion. The solder-bearing lead can be used as an edge clip for mounting a substrate such as a printed circuit board, or as a surface-mounted lead for a substrate.

5. 发明申请

WO2003061894A1 SOLDER-BEARING COMPONENTS INCLUDING A SOLDER-BEARING ELECTROMAGNETIC SHIELD AND METHOD OF RETAINING A SOLDER MASS THEREIN 审中-公开
标题翻译：包括焊接电磁屏蔽的焊接轴承部件及其保持焊料质量的方法
公开(公告)号：WO2003061894A1
公开(公告)日：2003-07-31
申请号：PCT/US2003/002270
申请日：2003-01-24
申请人： NAS INTERPLEX INDUSTRIES, INC. , SEIDLER, Jack
发明人： SEIDLER, Jack
IPC分类号： B23K9/235
CPC分类号： B23K37/06 , B23K1/0016 , B23K35/0222 , B23K2201/40 , H05K3/341 , H05K3/3426 , H05K9/0022 , H05K2201/10371 , H05K2201/1084 , H05K2201/10984 , H05K2203/0415 , Y02P70/613
摘要： A method of retaining a solder mass within a solder-bearing component is provided and includes the steps of: (a) forming a plurality of fingers in the solder-bearing component at one edge thereof, with each finger being defined by a pair of slots formed in the solder-bearing component; and (b) interleaving a solder mass between the fingers such that the solder mass is securely held by the fingers. The solder-bearing component includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.
摘要翻译：提供了一种在焊料支承部件内保持焊料质量的方法，包括以下步骤：（a）在其一个边缘处在焊料支承部件中形成多个指状物，每个手指由一对槽限定形成在焊接轴承部件中; 和（b）在指状物之间插入焊料块，使得焊料质量被手指牢固地保持。焊料支承部件包括任何数量的不同类型的部件，其中由此保持焊料质量，例如引线，端子，连接器，电磁屏蔽等。

6. 发明申请

WO2014107507A2 CONTAINER LID AND VALVE 审中-公开
标题翻译：集装箱盖和阀
公开(公告)号：WO2014107507A2
公开(公告)日：2014-07-10
申请号：PCT/US2014010067
申请日：2014-01-02
申请人： COLONERI ANTONIO F , SEIDLER JACK
发明人： COLONERI ANTONIO F , SEIDLER JACK
IPC分类号： B65D51/16
CPC分类号： B65D51/1672 , A47G19/2272 , B65D51/1683 , B65D2543/00046
摘要： A lid configured for use with a fluid container is provided. The lid includes a body member including an outer periphery configured to couple to a rim of a fluid container. The body member includes a pair of apertures extending therethrough. A valve operably coupled to the body member includes a pair of protuberances configured to selectively engage the pair of apertures. The pair of protuberances configured such that depression of one protuberances moves the pair of protuberances out of sealed engagement with the pair of apertures for dispensing a fluid contained within the fluid container.
摘要翻译：提供了构造成与流体容器一起使用的盖子。所述盖包括主体构件，所述本体构件包括构造成联接到流体容器的边缘的外周边。主体构件包括延伸穿过其中的一对孔。可操作地联接到主体构件的阀包括构造成选择性地接合所述一对孔的一对突起。一对突起被构造成使得一个突起的凹陷将一对突起移出与该对孔的密封接合，用于分配容纳在流体容器内的流体。

7. 发明申请

WO2010108011A8 PLANAR CONTACT WITH SOLDER 审中-公开
标题翻译：平面与焊接接触
公开(公告)号：WO2010108011A8
公开(公告)日：2010-12-09
申请号：PCT/US2010027827
申请日：2010-03-18
申请人： INTERPLEX IND INC , SEIDLER JACK
发明人： SEIDLER JACK
IPC分类号： H01R33/76 , G01R31/26 , H01R4/24
CPC分类号： H05K3/00 , B23K35/0244 , H01R12/57 , H01R12/707 , H01R43/0235 , H05K3/3426 , H05K3/3478 , H05K3/3489 , H05K2201/0311 , H05K2201/10704 , H05K2201/10795 , H05K2201/1084 , H05K2201/10924 , H05K2201/10984 , H05K2203/0405 , H05K2203/0415 , Y02P70/613 , Y10T29/49147
摘要： A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.
摘要翻译：将可回流元件固定在电触点上的方法。该方法包括提供具有多个电触点的条带，每个触点包括接触体和远离接触体延伸的尾部。然后将触头的尾部设置在细长的可回流构件附近。细长的可回流构件被推到多个触点的尾部上。随后，细长可回流构件被切割成多个单独的可回流元件，每个可回流元件对应于尾部中的一个。与附接到其上的可回流元件的电接触与条分离。

8. 发明申请

WO2010108011A2 PLANAR CONTACT WITH SOLDER 审中-公开
标题翻译：与SOLDER的平面接触
公开(公告)号：WO2010108011A2
公开(公告)日：2010-09-23
申请号：PCT/US2010/027827
申请日：2010-03-18
申请人： 1/2INTERPLEX INDUSTRIES, INC. , SEIDLER, Jack
发明人： SEIDLER, Jack
IPC分类号： H01R33/76 , H01R4/24 , G01R31/26
CPC分类号： H05K3/00 , B23K35/0244 , H01R12/57 , H01R12/707 , H01R43/0235 , H05K3/3426 , H05K3/3478 , H05K3/3489 , H05K2201/0311 , H05K2201/10704 , H05K2201/10795 , H05K2201/1084 , H05K2201/10924 , H05K2201/10984 , H05K2203/0405 , H05K2203/0415 , Y02P70/613 , Y10T29/49147
摘要： A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.
摘要翻译：
一种将可回流元件固定在电触点上的方法。该方法包括提供具有多个电触点的条，每个触点包括触点本体和远离触点本体延伸的尾部。接触件的尾部然后设置在细长的可回流焊构件附近。细长的可回流构件被推到多个触点的尾部上。随后，将细长的可回流构件切割成多个单独的可回流元件，每个可回流元件对应于其中一个尾部。与连接到其上的可回流元件的电触点与条分离。

9. 发明申请

WO2009086508A1 SOLDER WIRE CONSTRUCTION 审中-公开
标题翻译：焊丝结构
公开(公告)号：WO2009086508A1
公开(公告)日：2009-07-09
申请号：PCT/US2008/088422
申请日：2008-12-29
申请人： INTERPLEX NAS, INC. , SEIDLER, Jack , ZANOLLI, James, R. , CACHINA, Joseph, S.
发明人： SEIDLER, Jack , ZANOLLI, James, R. , CACHINA, Joseph, S.
IPC分类号： B23K31/02 , H01L23/52
CPC分类号： B23K3/087 , B23K2201/38 , H01L2224/48137 , H05K1/142 , H05K3/3405 , H05K3/3478 , H05K3/366 , H05K2201/10287 , H05K2201/10424 , H05K2203/0415 , Y10T29/49144
摘要： A solder construction carrier device for connecting electrical components including a carrier with a plurality of compartments and a solder construction disposed in each of the plurality of compartments. Each solder construction includes a conductive wire and a solder component disposed adjacent to the conductive wire.
摘要翻译：一种焊接构造载体装置，用于连接包括具有多个隔室的载体的电气部件和设置在多个隔室中的每个隔室中的焊接结构。每个焊料构造包括导电线和邻近导电线设置的焊料组分。

10. 发明申请

WO2004107374A3 OPENABLE ONE-PIECE ELECTRICAL RF SHIELD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：可开发的一体式电气射频屏蔽及其制造方法
公开(公告)号：WO2004107374A3
公开(公告)日：2005-12-29
申请号：PCT/US2004016993
申请日：2004-05-28
申请人： INTERPLEX NAS INC , SEIDLER JACK
发明人： SEIDLER JACK
IPC分类号： H05K9/00
CPC分类号： H05K9/0026
摘要： The RF shield (2) having a plurality of interconnected sidewalls (6, 8, 10, 12), substantially open bottom region, and a hingeably connected top cover portion (4), having a top cover latch (14) and disposed along the top edge of one of the sidewalls. The top cover portion (4) of the shield (2) is adapted to hinge toward another one of the sidewalls (6, 8, 10, 12) such that the top cover latch (14) engages a hole (20) disposed on the other sidewall being engaged and completing a protective enclosure about electrical components and preventing those components from causing electromagnetic interferences. The RF shield (2) of the present invention allows for easy opening of the top cover portion (4) to provide access to the enclosure for rework or repair of the electrical components covered by the shield, without having to unsolder the unit from a substrate containing the electrical components.
摘要翻译： RF屏蔽件（2）具有多个相互连接的侧壁（6,8,10,12），基本上开口的底部区域以及铰链连接的顶盖部分（4），具有顶盖闩锁（14）并且沿着一个侧壁的顶边。护罩（2）的顶盖部分（4）适于朝着另一个侧壁（6,8,10,12）铰接，使得顶盖闩锁（14）接合设置在该侧壁上的孔（20）其它侧壁被接合并且完成关于电气部件的保护外壳并且防止这些部件引起电磁干扰。本发明的RF屏蔽层（2）允许容易地打开顶盖部分（4），以提供对外壳的通路，用于返回或修复由屏蔽件覆盖的电气部件，而不必将该单元从基板上剥离包含电气元件。

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