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1. 发明申请

WO2010108011A3 PLANAR CONTACT WITH SOLDER 审中-公开
标题翻译：平面与焊接接触
公开(公告)号：WO2010108011A3
公开(公告)日：2011-01-27
申请号：PCT/US2010027827
申请日：2010-03-18
申请人： INTERPLEX IND INC , SEIDLER JACK
发明人： SEIDLER JACK
IPC分类号： H01R33/76 , G01R31/26 , H01R4/24
CPC分类号： H05K3/00 , B23K35/0244 , H01R12/57 , H01R12/707 , H01R43/0235 , H05K3/3426 , H05K3/3478 , H05K3/3489 , H05K2201/0311 , H05K2201/10704 , H05K2201/10795 , H05K2201/1084 , H05K2201/10924 , H05K2201/10984 , H05K2203/0405 , H05K2203/0415 , Y02P70/613 , Y10T29/49147
摘要： A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.
摘要翻译：将可回流元件固定在电触点上的方法。该方法包括提供具有多个电触点的条带，每个触点包括接触体和远离接触体延伸的尾部。然后将触头的尾部设置在细长的可回流构件附近。细长的可回流构件被推到多个触点的尾部上。随后，细长可回流构件被切割成多个单独的可回流元件，每个可回流元件对应于尾部中的一个。与附接到其上的可回流元件的电接触与条分离。

2. 发明申请

WO2010108011A8 PLANAR CONTACT WITH SOLDER 审中-公开
标题翻译：平面与焊接接触
公开(公告)号：WO2010108011A8
公开(公告)日：2010-12-09
申请号：PCT/US2010027827
申请日：2010-03-18
申请人： INTERPLEX IND INC , SEIDLER JACK
发明人： SEIDLER JACK
IPC分类号： H01R33/76 , G01R31/26 , H01R4/24
CPC分类号： H05K3/00 , B23K35/0244 , H01R12/57 , H01R12/707 , H01R43/0235 , H05K3/3426 , H05K3/3478 , H05K3/3489 , H05K2201/0311 , H05K2201/10704 , H05K2201/10795 , H05K2201/1084 , H05K2201/10924 , H05K2201/10984 , H05K2203/0405 , H05K2203/0415 , Y02P70/613 , Y10T29/49147
摘要： A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.
摘要翻译：将可回流元件固定在电触点上的方法。该方法包括提供具有多个电触点的条带，每个触点包括接触体和远离接触体延伸的尾部。然后将触头的尾部设置在细长的可回流构件附近。细长的可回流构件被推到多个触点的尾部上。随后，细长可回流构件被切割成多个单独的可回流元件，每个可回流元件对应于尾部中的一个。与附接到其上的可回流元件的电接触与条分离。

3. 发明公开

EP1147573A4 COLLAPSIBLE ELECTRICAL LEADS FOR ENGAGING A SUBSTRATE 有权
标题翻译：可压缩电气电缆基材接触
公开(公告)号：EP1147573A4
公开(公告)日：2002-08-14
申请号：EP99966192
申请日：1999-12-10
申请人： NAS INTERPLEX IND INC
发明人： SEIDLER JACK
IPC分类号： H01R4/18 , H01R12/55 , H01R4/02 , H01R12/32
CPC分类号： H01R12/57 , H01R4/187
摘要： An electrical lead includes a substrate-receiving section which has a collapsible rear plate (22) and a plurality of outwardly projecting prongs or arms (24, 26). The prongs are spaced apart to define a gap (30) having an opening slightly larger than the width of the substrate to be engaged. A substrate is inserted into the gap between the prongs so that the prongs are spaced on either side of the substrate. The rear plate of the lead is then compressed so that the prongs engage and tightly grip the substrate from opposite sides. Alternatively, the prongs may pivot upon the application of force to engage the substrate.

4. 发明专利

DE69928444T2 未知
公开(公告)号：DE69928444T2
公开(公告)日：2006-07-27
申请号：DE69928444
申请日：1999-12-10
申请人： NAS INTERPLEX IND INC
发明人： SEIDLER JACK
IPC分类号： H01R4/02 , H01R4/18 , H01R12/55

5. 发明申请

WO2014107507A2 CONTAINER LID AND VALVE 审中-公开
标题翻译：集装箱盖和阀
公开(公告)号：WO2014107507A2
公开(公告)日：2014-07-10
申请号：PCT/US2014010067
申请日：2014-01-02
申请人： COLONERI ANTONIO F , SEIDLER JACK
发明人： COLONERI ANTONIO F , SEIDLER JACK
IPC分类号： B65D51/16
CPC分类号： B65D51/1672 , A47G19/2272 , B65D51/1683 , B65D2543/00046
摘要： A lid configured for use with a fluid container is provided. The lid includes a body member including an outer periphery configured to couple to a rim of a fluid container. The body member includes a pair of apertures extending therethrough. A valve operably coupled to the body member includes a pair of protuberances configured to selectively engage the pair of apertures. The pair of protuberances configured such that depression of one protuberances moves the pair of protuberances out of sealed engagement with the pair of apertures for dispensing a fluid contained within the fluid container.
摘要翻译：提供了构造成与流体容器一起使用的盖子。所述盖包括主体构件，所述本体构件包括构造成联接到流体容器的边缘的外周边。主体构件包括延伸穿过其中的一对孔。可操作地联接到主体构件的阀包括构造成选择性地接合所述一对孔的一对突起。一对突起被构造成使得一个突起的凹陷将一对突起移出与该对孔的密封接合，用于分配容纳在流体容器内的流体。

6. 发明申请

WO2004107374A3 OPENABLE ONE-PIECE ELECTRICAL RF SHIELD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：可开发的一体式电气射频屏蔽及其制造方法
公开(公告)号：WO2004107374A3
公开(公告)日：2005-12-29
申请号：PCT/US2004016993
申请日：2004-05-28
申请人： INTERPLEX NAS INC , SEIDLER JACK
发明人： SEIDLER JACK
IPC分类号： H05K9/00
CPC分类号： H05K9/0026
摘要： The RF shield (2) having a plurality of interconnected sidewalls (6, 8, 10, 12), substantially open bottom region, and a hingeably connected top cover portion (4), having a top cover latch (14) and disposed along the top edge of one of the sidewalls. The top cover portion (4) of the shield (2) is adapted to hinge toward another one of the sidewalls (6, 8, 10, 12) such that the top cover latch (14) engages a hole (20) disposed on the other sidewall being engaged and completing a protective enclosure about electrical components and preventing those components from causing electromagnetic interferences. The RF shield (2) of the present invention allows for easy opening of the top cover portion (4) to provide access to the enclosure for rework or repair of the electrical components covered by the shield, without having to unsolder the unit from a substrate containing the electrical components.
摘要翻译： RF屏蔽件（2）具有多个相互连接的侧壁（6,8,10,12），基本上开口的底部区域以及铰链连接的顶盖部分（4），具有顶盖闩锁（14）并且沿着一个侧壁的顶边。护罩（2）的顶盖部分（4）适于朝着另一个侧壁（6,8,10,12）铰接，使得顶盖闩锁（14）接合设置在该侧壁上的孔（20）其它侧壁被接合并且完成关于电气部件的保护外壳并且防止这些部件引起电磁干扰。本发明的RF屏蔽层（2）允许容易地打开顶盖部分（4），以提供对外壳的通路，用于返回或修复由屏蔽件覆盖的电气部件，而不必将该单元从基板上剥离包含电气元件。

7. 发明申请

WO03085697A9 SOLDER-BEARING ARTICLES AND METHOD OF RETAINING A SOLDER MASS THEREON 审中-公开
标题翻译：焊料制品和保留焊料质量的方法
公开(公告)号：WO03085697A9
公开(公告)日：2004-12-02
申请号：PCT/US0310149
申请日：2003-04-01
申请人： INTERPLEX NAS INC , SEIDLER JACK , ZHITOMIRSKY ALEKSANDR
发明人： SEIDLER JACK , ZHITOMIRSKY ALEKSANDR
IPC分类号： B23K3/06 , H05K3/34 , H01R4/02
CPC分类号： B23K3/0607 , B23K3/0638 , B23K2201/40 , H01L2924/0002 , H05K3/3405 , H05K3/341 , H05K3/3426 , H05K2201/10371 , H05K2201/10386 , H05K2201/1084 , H05K2201/10984 , H05K2203/0195 , H05K2203/0405 , Y02P70/613 , H01L2924/00
摘要： A method of retaining a solder mass (40) to a solder-bearing article (20) is provided and includes the steps of: (a) disposing a length of solder mass over at least some of the plurality of openings (30); and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.
摘要翻译：提供了一种将焊料块（40）保持到含焊料物品（20）的方法，并且该方法包括以下步骤：（a）在多个开口（30）中的至少一些上设置一段焊料块; 以及沿着焊料块的长度形成多个焊料铆钉。焊接铆钉用于保持焊料承载物品的焊料块的长度。含焊料制品包括任何数量的不同类型的部件，其中由此保持焊料块，例如引线，端子，连接器，电磁屏蔽等

8. 发明申请

WO03085697A3 SOLDER-BEARING ARTICLES AND METHOD OF RETAINING A SOLDER MASS THEREON 审中-公开
标题翻译：焊接轴承和保持焊接质量的方法
公开(公告)号：WO03085697A3
公开(公告)日：2004-06-10
申请号：PCT/US0310149
申请日：2003-04-01
申请人： INTERPLEX NAS INC , SEIDLER JACK , ZHITOMIRSKY ALEKSANDR
发明人： SEIDLER JACK , ZHITOMIRSKY ALEKSANDR
IPC分类号： B23K3/06 , H05K3/34 , H01R4/02
CPC分类号： B23K3/0607 , B23K3/0638 , B23K2201/40 , H01L2924/0002 , H05K3/3405 , H05K3/341 , H05K3/3426 , H05K2201/10371 , H05K2201/10386 , H05K2201/1084 , H05K2201/10984 , H05K2203/0195 , H05K2203/0405 , Y02P70/613 , H01L2924/00
摘要： A method of retaining a solder mass (40) to a solder-bearing article (20) is provided and includes the steps of: (a) disposing a length of solder mass over at least some of the plurality of openings (30); and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.
摘要翻译：提供了一种将焊料块（40）保持到焊料支承制品（20）的方法，其包括以下步骤：（a）在多个开口（30）中的至少一些开口上设置一定长度的焊料块; 以及沿焊料块的长度形成多个焊接铆钉。焊接铆钉用于将焊料质量的长度保持在焊接轴承制品上。焊接轴承制品包括任何数量的不同类型的组件，其中保持焊料块，例如引线，端子，连接器，电磁屏蔽等

9. 发明专利

GB2374307A Forming solder balls on contacts 未知
公开(公告)号：GB2374307A
公开(公告)日：2002-10-16
申请号：GB0205434
申请日：2002-03-07
申请人： NAS INTERPLEX IND INC
发明人： CACHINA JOSEPH S , SEIDLER JACK , ZANOLLI JAMES R
IPC分类号： B23K35/02 , B23K35/14 , H01R4/02 , H01R43/02 , H01R43/16 , H05K3/34
摘要： A method of forming a solder ball 90 on a portion, e.g., one end, of a contact 80 is provided. In one embodiment, the contact 80 is a terminal pin which is intended for use in an electrical connector and more particularly, for use in a solder ball grid array (SBGA) connector. The method includes providing the contact 80 along with a solder-holding clip 18 having a body 20 with an opening 21. The body 20 has a solder-holding conformation 32 adjacent the opening 21 and a solder mass 30 is held by the conformation 32. The contact 80 is then positioned proximate to the body opening 21 and heat is applied to the solder mass 30 causing the solder to reflow so that the solder flows into a spherical shape. This results in a solder ball 90 being formed on the portion of the contact 80 (fig 24). Subsequent to forming the solder ball, the solder-holding clip 18 is separated from the contact 80 leaving a contact 80 with a solder ball 90 affixed thereto. Preferably, a series of solder-holding clips 18 are provided along a carrier strip 12 of material so that a number of solder balls may be formed on corresponding contacts during a single reflow operation.

10. 发明专利

DE112010001187T5 Ebener Kontakt mit Lötzinn 未知
公开(公告)号：DE112010001187T5
公开(公告)日：2012-04-26
申请号：DE112010001187
申请日：2010-03-18
申请人： INTERPLEX IND INC
发明人： SEIDLER JACK
IPC分类号： H01R33/76 , G01R31/26 , H01R4/24
摘要： Verfahren zum Befestigen von wiederverflüssigbaren Elementen an elektrischen Kontakten. Das Verfahren weist Bereitstellen eines Streifens auf, welcher eine Vielzahl von elektrischen Kontakten aufweist, wobei jeder Kontakt einen Kontaktkörper und einen Endabschnitt auf weist, welcher sich weg von dem Kontaktkörper erstreckt, aufweist. Die Endabschnitte der Kontakte sind dann benachbart zu einem länglichen wiederverflüssigbaren Element angeordnet. Das längliche wiederverflüssigbare Element wird auf die Endabschnitte der Vielzahl von Kontakten gedrückt. Anschließend wird das längliche wiederverflüssigbare Element in eine Vielzahl von separaten wiederverflüssigbaren Elementen geschnitten, wobei jedes wiederverflüssigbare Element einem der Endabschnitte entspricht. Die elektrischen Kontakte mit dem daran angebrachten wiederverflüssigbaren Element werden von dem Streifen abgetrennt.

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