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1. 发明授权

US08684501B2 Fluid ejection device 有权
标题翻译：流体喷射装置
公开(公告)号：US08684501B2
公开(公告)日：2014-04-01
申请号：US13641469
申请日：2010-04-29
申请人： James E. Abbott, Jr. , Samuel Ajayi , Sadiq Bengali , Stephen Horvath , Greg S. Long , Satya Prakash , Alfred I-Tsung Pan , Mohammed S. Shaarawi , Roberto A. Pugliese
发明人： James E. Abbott, Jr. , Samuel Ajayi , Sadiq Bengali , Stephen Horvath , Greg S. Long , Satya Prakash , Alfred I-Tsung Pan , Mohammed S. Shaarawi , Roberto A. Pugliese
IPC分类号： B41J2/05
CPC分类号： B41J2/17526 , B41J2/14129 , B41J2202/03
摘要： A fluid ejection device includes a thin film heater resistor portion having a heater resistor, and a two-layer structure disposed over the heater resistor. The two-layer structure includes a top layer and a bottom layer, with the top layer having a hardness that is at least 1.5 times greater than the hardness of the bottom layer.
摘要翻译：流体喷射装置包括具有加热电阻器的薄膜加热器电阻部分和设置在加热电阻器上方的两层结构。双层结构包括顶层和底层，顶层的硬度是底层硬度的至少1.5倍。

2. 发明申请

US20130162724A1 PROTECTING A FLUID EJECTION DEVICE RESISTOR 有权
标题翻译：保护流体喷射装置电阻
公开(公告)号：US20130162724A1
公开(公告)日：2013-06-27
申请号：US13332797
申请日：2011-12-21
申请人： Roberto A. Pugliese, JR. , Timothy R. Emery , Ed Friesen , Rio Rivas
发明人： Roberto A. Pugliese, JR. , Timothy R. Emery , Ed Friesen , Rio Rivas
IPC分类号： B41J2/05 , H01L21/02
CPC分类号： B41J2/1603 , B41J2/14129 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1634 , B41J2/1642 , B41J2/1646 , H01C7/006 , H01C17/075 , H01L28/24
摘要： In an embodiment, a method of fabricating a fluid ejection device includes forming a resistor on the front side of a substrate, depositing a dielectric film on the resistor to protect the resistor from chemical exposure during a slot formation process, and forming a slot in the substrate that extends from the back side to the front side of the substrate.
摘要翻译：在一个实施例中，制造流体喷射装置的方法包括在衬底的正面上形成电阻器，在电阻器上沉积电介质膜，以在缝隙形成过程中保护电阻器免受化学暴露，并在衬底，其从衬底的背面延伸到前侧。

3. 发明授权

US07594328B2 Method of forming a slotted substrate with partially patterned layers 失效
标题翻译：形成具有部分图案化层的开槽衬底的方法
公开(公告)号：US07594328B2
公开(公告)日：2009-09-29
申请号：US11069421
申请日：2005-02-28
申请人： Roberto A. Pugliese, Jr. , Mark H. MacKenzie , Thomas E. Pettit , Victorio A. Chavarria , Steven P Storm , Allen H Smith , Tony Cruz-Uribe
发明人： Roberto A. Pugliese, Jr. , Mark H. MacKenzie , Thomas E. Pettit , Victorio A. Chavarria , Steven P Storm , Allen H Smith , Tony Cruz-Uribe
IPC分类号： B23P17/00 , B41J2/045
CPC分类号： B41J2/162 , B41J2/1433 , B41J2/1632 , B41J2/1634 , Y10T29/49083 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49401
摘要： A method of forming a slotted substrate that includes patterning a thin film over a substrate so that at least a portion of the substrate within a slot region is not covered by the thin film. In addition, a slot is formed in the substrate through the slot region that extends through the substrate and the thin film, wherein a chip count in a shelf surrounding the slot is minimized when the slot is formed in the substrate through the thin film in the slot region.
摘要翻译：一种形成开槽衬底的方法，其包括在衬底上图案化薄膜，使得槽区域内的衬底的至少一部分不被薄膜覆盖。此外，通过延伸穿过衬底和薄膜的槽区在衬底中形成槽，其中当通过薄膜在槽中形成槽时，围绕槽的搁板中的芯片数最小化槽区域。

4. 发明授权

US06911155B2 Methods and systems for forming slots in a substrate 有权
标题翻译：用于在衬底中形成槽的方法和系统
公开(公告)号：US06911155B2
公开(公告)日：2005-06-28
申请号：US10061836
申请日：2002-01-31
申请人： Michael D. Miller , Michael Hager , Naoto A. Kawamura , Roberto A. Pugliese, Jr. , Ronald L. Enck , Susanne L. Kumpf , Shen Buswell , Mehrgan Khavari
发明人： Michael D. Miller , Michael Hager , Naoto A. Kawamura , Roberto A. Pugliese, Jr. , Ronald L. Enck , Susanne L. Kumpf , Shen Buswell , Mehrgan Khavari
IPC分类号： B24C1/04 , B41J2/05 , B41J2/16 , H01L21/00 , B41J2/04
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1632
摘要： The described embodiments relate to methods and systems for forming slots in a substrate. In one exemplary embodiment, a slot is formed in a substrate that has first and second opposing surfaces. A first trench is dry etched through the first surface of the substrate. A second trench is created through the second surface of the substrate effective to form, in combination with the first trench, a slot. At least a portion of the slot passes entirely through the substrate, and the maximum width of the slot is less than or equal to about 50 of the thickness of the substrate.
摘要翻译：所描述的实施例涉及在衬底中形成槽的方法和系统。在一个示例性实施例中，在具有第一和第二相对表面的基板中形成槽。通过衬底的第一表面干蚀刻第一沟槽。通过衬底的第二表面产生第二沟槽，其有效地与第一沟槽组合形成槽。槽的至少一部分完全穿过衬底，并且槽的最大宽度小于或等于衬底厚度的约50％。

5. 发明申请

US20130044163A1 FLUID EJECTION DEVICE 有权
标题翻译：流体喷射装置
公开(公告)号：US20130044163A1
公开(公告)日：2013-02-21
申请号：US13641469
申请日：2010-04-29
申请人： James E. Abbott, JR. , Samuel Ajayi , Sadiq Bengali , Stephen Horvath , Greg S. Long , Satya Prakash , Alfred I-Tsung Pan , Mohammed S. Shaarawi , Roberto A. Pugliese
发明人： James E. Abbott, JR. , Samuel Ajayi , Sadiq Bengali , Stephen Horvath , Greg S. Long , Satya Prakash , Alfred I-Tsung Pan , Mohammed S. Shaarawi , Roberto A. Pugliese
IPC分类号： B41J2/05 , B05D1/36
CPC分类号： B41J2/17526 , B41J2/14129 , B41J2202/03
摘要： A fluid ejection device includes a thin film heater resistor portion having a heater resistor, and a two-layer structure disposed over the heater resistor. The two-layer structure includes a top layer and a bottom layer, with the top layer having a hardness that is at least 1.5 times greater than the hardness of the bottom layer.
摘要翻译：流体喷射装置包括具有加热电阻器的薄膜加热器电阻部分和设置在加热电阻器上方的两层结构。双层结构包括顶层和底层，顶层的硬度是底层硬度的至少1.5倍。

6. 发明授权

US06682874B2 Droplet plate architecture 有权
公开(公告)号：US06682874B2
公开(公告)日：2004-01-27
申请号：US10244351
申请日：2002-09-16
申请人： Ravi Ramaswami , Victor Joseph , Colin C. Davis , Ronnie J. Yenchik , Daniel A. Kearl , Martha A. Truninger , Roberto A. Pugliese, Jr. , Ronald L. Enck
发明人： Ravi Ramaswami , Victor Joseph , Colin C. Davis , Ronnie J. Yenchik , Daniel A. Kearl , Martha A. Truninger , Roberto A. Pugliese, Jr. , Ronald L. Enck
IPC分类号： G03C500
CPC分类号： B41J2/1628 , B41J2/162 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1642 , B41J2/1645 , B41J2/1646 , Y10T29/49401
摘要： A process for fabricating a droplet plate for the printhead of an ink-jet printer, which process provides design flexibility, precise dimension control, as well as material robustness. Also provided is a droplet plate fabricated in accord with the process.

7. 发明授权

US08727499B2 Protecting a fluid ejection device resistor 有权
标题翻译：保护流体喷射装置电阻
公开(公告)号：US08727499B2
公开(公告)日：2014-05-20
申请号：US13332797
申请日：2011-12-21
申请人： Roberto A. Pugliese, Jr. , Timothy R. Emery , Ed Friesen , Rio Rivas
发明人： Roberto A. Pugliese, Jr. , Timothy R. Emery , Ed Friesen , Rio Rivas
IPC分类号： B41J2/05 , H01L21/02 , G01D15/00 , G11B5/127
CPC分类号： B41J2/1603 , B41J2/14129 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1634 , B41J2/1642 , B41J2/1646 , H01C7/006 , H01C17/075 , H01L28/24
摘要： In an embodiment, a method of fabricating a fluid ejection device includes forming a resistor on the front side of a substrate, depositing a dielectric film on the resistor to protect the resistor from chemical exposure during a slot formation process, and forming a slot in the substrate that extends from the back side to the front side of the substrate.
摘要翻译：在一个实施例中，制造流体喷射装置的方法包括在衬底的正面上形成电阻器，在电阻器上沉积电介质膜，以在缝隙形成过程中保护电阻器免受化学暴露，并在衬底，其从衬底的背面延伸到前侧。

8. 发明授权

US06837572B2 Droplet plate architecture 失效
标题翻译：液滴板结构
公开(公告)号：US06837572B2
公开(公告)日：2005-01-04
申请号：US10643264
申请日：2003-08-19
申请人： Ravi Ramaswami , Victor Joseph , Colin C. Davis , Ronnie J. Yenchik , Daniel A. Kearl , Martha A. Truninger , Roberto A. Pugliese, Jr. , Ronald L. Enck
发明人： Ravi Ramaswami , Victor Joseph , Colin C. Davis , Ronnie J. Yenchik , Daniel A. Kearl , Martha A. Truninger , Roberto A. Pugliese, Jr. , Ronald L. Enck
IPC分类号： B41J2/16
CPC分类号： B41J2/1628 , B41J2/162 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1642 , B41J2/1645 , B41J2/1646 , Y10T29/49401
摘要： A process for fabricating a droplet plate for the printhead of an ink-jet printer, which process provides design flexibility, precise dimension control, as well as material robustness. Also provided is a droplet plate fabricated in accord with the process.
摘要翻译：一种用于制造用于喷墨打印机的打印头的液滴板的方法，该方法提供设计灵活性，精确的尺寸控制以及材料坚固性。还提供了根据该方法制造的液滴板。

9. 发明授权

US06945634B2 Thin film coating of a slotted substrate and techniques for forming slotted substrates 失效
标题翻译：开槽衬底的薄膜涂层和用于形成开槽衬底的技术
公开(公告)号：US06945634B2
公开(公告)日：2005-09-20
申请号：US10679097
申请日：2003-10-03
申请人： Roberto A. Pugliese, Jr. , Mark H. MacKenzie , Thomas E Pettit , Victorio A. Chavarria , Steven P Storm , Allen H Smith
发明人： Roberto A. Pugliese, Jr. , Mark H. MacKenzie , Thomas E Pettit , Victorio A. Chavarria , Steven P Storm , Allen H Smith
IPC分类号： B41J2/05 , B41J2/16
CPC分类号： B41J2/1631 , B41J2/1603 , B41J2/1626 , B41J2/1632 , B41J2/1642 , B41J2/1646
摘要： A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate.In one embodiment, the thin film is at least one of a metal film, a polymer film, and a dielectric film. In another embodiment, the thin film material is ductile and/or deposited under compression. In one embodiment, the substrate is silicon, and the thin film is an insulating layer grown from the substrate, such as field oxide. In one embodiment, the thin film is PSG. In one embodiment, the thin film is a passivation layer, such as at least one of silicon nitride and silicon carbide. In one embodiment, the thin film is a cavitation barrier layer, such as tantalum.
摘要翻译：用于中心进给打印头的涂覆基底具有基底，施加在基底上的薄膜以及延伸穿过基底和薄膜的狭槽区域。通过涂覆的基底的槽区形成槽。薄膜层涂层使通过基底的槽周围的搁板中的裂纹形成和/或芯片数量最小化。在一个实施例中，槽是机械地形成的。在一个实施例中，使用多个薄膜。槽区域延伸穿过多个薄膜。可以将任何薄膜的组合施加在衬底上。在一个实施例中，薄膜是金属膜，聚合物膜和电介质膜中的至少一种。在另一个实施例中，薄膜材料在压缩下是延展性的和/或沉积的。在一个实施例中，衬底是硅，并且薄膜是从衬底生长的绝缘层，例如场氧化物。在一个实施例中，薄膜是PSG。在一个实施例中，薄膜是钝化层，例如氮化硅和碳化硅中的至少一种。在一个实施例中，薄膜是空穴阻挡层，例如钽。

10. 发明授权

US06648732B2 Thin film coating of a slotted substrate and techniques for forming slotted substrates 失效
标题翻译：开槽衬底的薄膜涂层和用于形成开槽衬底的技术
公开(公告)号：US06648732B2
公开(公告)日：2003-11-18
申请号：US09772752
申请日：2001-01-30
申请人： Roberto A. Pugliese, Jr. , Mark H. MacKenzie , Thomas E Pettit , Victorio A. Chavarria , Steven P Storm , Allen H Smith
发明人： Roberto A. Pugliese, Jr. , Mark H. MacKenzie , Thomas E Pettit , Victorio A. Chavarria , Steven P Storm , Allen H Smith
IPC分类号： B24C104
CPC分类号： B41J2/1631 , B41J2/1603 , B41J2/1626 , B41J2/1632 , B41J2/1642 , B41J2/1646
摘要： A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate. In one embodiment, the thin film is at least one of a metal film, a polymer film, and a dielectric film. In another embodiment, the thin film material is ductile and/or deposited under compression. In one embodiment, the substrate is silicon, and the thin film is an insulating layer grown from the substrate, such as field oxide. In one embodiment, the thin film is PSG. In one embodiment, the thin film is a passivation layer, such as at least one of silicon nitride and silicon carbide. In one embodiment, the thin film is a cavitation barrier layer, such as tantalum.
摘要翻译：用于中心进给打印头的涂覆基底具有基底，施加在基底上的薄膜以及延伸穿过基底和薄膜的狭槽区域。通过涂覆的基底的槽区形成槽。薄膜层涂层使通过基底的槽周围的搁板中的裂纹形成和/或芯片数量最小化。在一个实施例中，槽是机械地形成的。在一个实施例中，使用多个薄膜。槽区域延伸穿过多个薄膜。薄膜的任何组合可以施加在基板上。在一个实施例中，薄膜是金属膜，聚合物膜和电介质膜中的至少一种。在另一个实施例中，薄膜材料在压缩下是延展性的和/或沉积的。在一个实施例中，衬底是硅，并且薄膜是从衬底生长的绝缘层，例如场氧化物。在一个实施例中，薄膜是PSG。在一个实施例中，薄膜是钝化层，例如氮化硅和碳化硅中的至少一种。在一个实施例中，薄膜是空穴阻挡层，例如钽。

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