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1. 发明申请

US20090078689A1 Method of Welding a Wear Layer onto a Parent Material Using a Plurality of Flux-Cored Wire Electrodes, Metal Powder and Welding Powder 有权
标题翻译：使用多种助焊剂电极，金属粉末和焊接粉末将耐磨层焊接到母材上的方法
公开(公告)号：US20090078689A1
公开(公告)日：2009-03-26
申请号：US12236925
申请日：2008-09-24
申请人： Walter Brass , Rene Scholz
发明人： Walter Brass , Rene Scholz
IPC分类号： B23K28/00
CPC分类号： B23K9/048 , B23K9/188 , B23K9/324 , B23K25/005 , B23K2101/04
摘要： A method of welding a wear layer onto a parent material, wherein a welding current is applied to a first wire electrode and to at least one second wire electrode. The first wire electrode and at least one second wire electrode are continuously fed to the parent material for producing a common weld pool. Metal powder and welding powder are fed to the weld pool. The wire electrodes are flux-cored wire electrodes, having a core and a covered electrode. The flux-cored wire electrodes have a higher alloy than a weld deposit analysis of the wear layer to be welded on the parent material. The covered electrode of the flux-cored wire electrodes includes an alloy, which has magnetization properties suitable for adhesion of the metal powder.
摘要翻译：将耐磨层焊接到母材上的方法，其中焊接电流施加到第一线电极和至少一个第二线电极。第一线电极和至少一个第二线电极被连续馈送到母材以产生公共焊池。将金属粉末和焊接粉末送入焊池。线电极是药芯焊丝电极，具有芯和被覆电极。药芯焊丝电极具有比待焊接在母材上的耐磨层的焊缝沉积分析更高的合金。药芯焊丝电极的被覆电极包括合金，其具有适于金属粉末粘附的磁化特性。

2. 发明申请

US20130026659A1 MICROELECTRONIC COMPONENT 审中-公开
标题翻译：微电子元件
公开(公告)号：US20130026659A1
公开(公告)日：2013-01-31
申请号：US13639370
申请日：2011-03-22
申请人： Mehmet Kaynak , Bernd Tillack , Rene Scholz
发明人： Mehmet Kaynak , Bernd Tillack , Rene Scholz
IPC分类号： H01L23/522 , H01L21/768
CPC分类号： B81C1/00587 , B81B2207/015 , B81B2207/07 , B81C2201/014
摘要： A method for producing a MEMS component including the steps of simultaneously embedding structure elements during producing the multi-level conductive path layer stack which structure elements are to be subsequently exposed, subsequently producing a recess that extends from a substrate backside to the multi-level conductive path layer stack, exposing the micromechanical structure elements in the multi-level conductive path layer stack through the recess. In order to increase process precision a reference mask for defining a lateral position or a lateral extension of the micromechanical structure elements to be exposed is produced, wherein the reference mask is either arranged on the substrate front side between the substrate and the multi-level conductive path layer stack or in a layer of the multi-level conductive path layer stack which layer is more proximal to the substrate than the structure element to be exposed.
摘要翻译：一种用于制造MEMS部件的方法，包括以下步骤：在制造多级导电路径层堆叠期间同时嵌入结构元件，该结构元件随后将被暴露，随后产生从背衬延伸到多层导电路径层堆叠，通过凹槽暴露多层导电路径层堆叠中的微机械结构元件。为了提高加工精度，产生用于限定要暴露的微机械结构元件的横向位置或横向延伸的参考掩模，其中参考掩模或者被布置在基板和多层导电路径层堆叠或者在多层导电路径层堆叠的层中，该层比要暴露的结构元件更靠近衬底。

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