专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050197952A1 Risk mitigation management 审中-公开
标题翻译：风险缓解管理
公开(公告)号：US20050197952A1
公开(公告)日：2005-09-08
申请号：US10917368
申请日：2004-08-13
申请人： Edward Shea , David Stone , Ed Baechtold , Ralf Haug , Andy Evans
发明人： Edward Shea , David Stone , Ed Baechtold , Ralf Haug , Andy Evans
IPC分类号： G06Q40/00 , G06F17/60
CPC分类号： G06Q40/08 , G06Q40/025
摘要： Risk mitigation and management is provided through an executive management application for the active management of operational risks, derived from exposure to factors that threaten strategic objectives related to operations, strategy, regulation and recording priorities. This system is based on a architecture that automates the Committee Of Sponsoring Organizations (COSO) framework for enterprise risk management, using the objective, risk, control and actions (ORCA) methodology to actively manage risk at the business unit level. This business process and feedback mechanism actively isolates, evaluates and escalates risks and controls in an interactive, proactive and dynamic manor. Workflow, alerts, messaging and roles and permission profiles route risk information to all relevant entities to ensure enterprise-wide visibility of, for example, a companies overall risk exposure.
摘要翻译：通过执行管理应用程序提供风险缓解和管理，以积极管理操作风险，这些风险来自于威胁与操作，战略，监管和记录优先级相关的战略目标的因素。该系统基于一种使企业风险管理赞助组织（COSO）框架自动化的架构，使用客观，风险，控制和行动（ORCA）方法来主动管理业务部门的风险。这种业务流程和反馈机制主动隔离，评估和升级了一个交互式，主动和动态的风险和控制。工作流程，警报，消息传递和角色以及许可资料将风险信息路由到所有相关实体，以确保企业范围内的可见性，例如公司整体风险。

2. 发明授权

US5932300A Process for the currentless metallization of electrically non-conductive substrates 失效
标题翻译：用于非导电衬底无电镀金属化的工艺
公开(公告)号：US5932300A
公开(公告)日：1999-08-03
申请号：US913378
申请日：1997-09-08
申请人： Lothar Weber , Kurt Schmid , Ralf Haug , Dorothee Kling
发明人： Lothar Weber , Kurt Schmid , Ralf Haug , Dorothee Kling
IPC分类号： C23C18/20 , B05D3/06 , B05D5/06 , C08F2/48 , C23C18/16 , H05K3/18
CPC分类号： B05D5/067 , B05D3/067 , C23C18/1608 , C23C18/1612 , H05K3/185
摘要： A process for the currentless metallization of electrically non-conductive substrates, includes providing a substrate which is electrically non-conductive; depositing on the substrate a positive lacquer comprising at least one polymer which is UV hardenable, at least one organo-metalllic compound, and a substance which is light-active to provide a positive lacquer coated substrate; irradiating the positive lacquer coated substrate with UV radiation to provide an irradiated coated substrate; and precipitating a metal layer onto the irradiated coated substrate by currentless metallization in a bath effective therefore.
摘要翻译： PCT No.PCT / DE96 / 00201 Sec。 371日期：1997年9月8日 102（e）1997年9月8日PCT PCT 1996年2月9日PCT公布。公开号WO96 / 28588 日期1996年9月19日一种用于非导电衬底的无电镀金属化的工艺，包括提供不导电的衬底; 在基底上沉积包含至少一种可UV固化的聚合物，至少一种有机 - 金属化合物和一种轻的物质以提供正性涂漆的基材的正性漆; 用UV辐射照射正漆涂布的基底以提供经辐照的涂布的基底; 并通过在浴中无电镀金属化将金属层沉积在被照射的被涂覆的基底上，因此有效。

3. 发明授权

US5573808A Method for producing a multilayer circuit 失效
标题翻译：多层电路的制造方法
公开(公告)号：US5573808A
公开(公告)日：1996-11-12
申请号：US589234
申请日：1996-01-22
申请人： Werner Gruenwald , Walter Roethlingshoefer , Ulrich Goebel , Ralf Haug , Manfred Moser , Annette Seibold
发明人： Werner Gruenwald , Walter Roethlingshoefer , Ulrich Goebel , Ralf Haug , Manfred Moser , Annette Seibold
IPC分类号： H01G4/30 , H01L21/48 , H01L23/538 , H05K1/09 , H05K1/16 , H05K3/20 , H05K3/46 , B05D5/12 , B41M3/12
CPC分类号： H05K1/162 , H01G4/30 , H01L21/4857 , H01L23/5383 , H01L2924/0002 , H05K1/092 , H05K2201/09236 , H05K2201/09763 , H05K3/207 , H05K3/4611 , H05K3/4629 , Y10T29/435
摘要： In a method for producing a multilayer circuit, it is possible to produce capacitor structures including electrodes and a dielectric arranged in between. By pressing the capacitor structures into a ceramic layer, it is possible to produce a high-quality capacitor inside the multilayer circuit.
摘要翻译：在制造多层电路的方法中，可以制造包括电极和布置在其间的电介质的电容器结构。通过将电容器结构压入陶瓷层，可以在多层电路内产生高质量的电容器。

4. 发明授权

US06652312B2 Encapsulated electrical device 失效
标题翻译：封装电气设备
公开(公告)号：US06652312B2
公开(公告)日：2003-11-25
申请号：US10048871
申请日：2002-06-25
申请人： Erwin Liegl , Ralf Haug , Herbert Gentner
发明人： Erwin Liegl , Ralf Haug , Herbert Gentner
IPC分类号： H01R1352
CPC分类号： H05K5/064 , H01R13/5216
摘要： An electrical device includes two housing parts that may be joined to form one closed housing, the housing parts in the joined state enclosing a housing interior space, as well as an electrical/electronic circuit element arranged in the housing inner space, and a sealing material for protecting the circuit element. The two housing parts may be configured as half-shells and the interior area of the half-shells, in each case, may be subdivided by interior walls into at least two chambers, of which, in each case, a first chamber is filled with the sealing material and has spatial dimensions which are greater than the dimensions of the circuit element, the interior walls of the second half-shell, in the joined state of the two half-shells, overlapping the interior walls of the first half-shell with clearance, the interior walls of the first half-shell penetrating somewhat into the first chamber of the second half-shell, and the circuit element between the two half-shells being enveloped by the sealing material contained in the two first chambers, up to its electrical connections.
摘要翻译：电气设备包括两个壳体部件，其可以被连接以形成一个封闭的壳体，包围壳体内部空间的接合状态的壳体部件以及布置在壳体内部空间中的电气/电子电路元件以及密封材料用于保护电路元件。两个壳体部件可以被配置为半壳，并且在每种情况下，半壳体的内部区域可以被内壁细分成至少两个室，在每个壳体中，第一室被填充所述密封材料具有大于所述电路元件的尺寸的空间尺寸，所述第二半壳的所述内壁在所述两个半壳的接合状态下与所述第一半壳的内壁重叠，间隙，第一半壳的内壁稍微进入第二半壳的第一室，并且两个半壳之间的电路元件被包含在两个第一室中的密封材料包围，直到其电气连接。

5. 发明授权

US5916407A Process for producing an electrically conductive connection 失效
标题翻译：用于制造导电连接的工艺
公开(公告)号：US5916407A
公开(公告)日：1999-06-29
申请号：US727671
申请日：1995-06-27
申请人： Werner Gruenwald , Ralf Haug , Thomas Burkhart , Martin Mennig , Helmut Schmidt
发明人： Werner Gruenwald , Ralf Haug , Thomas Burkhart , Martin Mennig , Helmut Schmidt
IPC分类号： H01R4/04 , H05K1/18 , H05K3/32 , H05K3/36 , H05K13/04
CPC分类号： H01R4/04 , H05K3/321 , H05K3/361 , H05K1/181 , H05K2201/0129 , H05K2201/09881 , H05K2201/10674 , H05K2201/10984 , H05K2203/0113 , H05K2203/0338 , H05K2203/0534 , H05K2203/1173 , H05K3/1275 , Y10T29/53174
摘要： A process for producing an electrically conductive connection between opposite arranged contact areas of two elements that are to be connected, by means of a hot-melt type adhesive formed of electrically conductive particles, which are dispersed in a thermoplastic base material. The hot-melt type adhesive (22) is applied purposely only to the contact areas (16) of at least one of the elements (10, 28, 42, 50) and that these elements are joined under the effects of heat.
摘要翻译： PCT No.PCT / DE95 / 00830 Sec。 371日期1996年10月17日第 102（e）日期1996年10月17日PCT提交1995年6月27日PCT公布。出版物WO96 / 02955 日期：1996年2月1日，一种用于通过由导电颗粒形成的热熔型粘合剂将待连接的两个元件的相对布置的接触区域之间的导电连接制造的方法，该粘合剂分散在热塑性基材。热熔型粘合剂（22）仅专门应用于至少一个元件（10,28,42,50）的接触区域（16），并且这些元件在热作用下接合。

6. 发明授权

US5885429A Electrochemical measuring sensor and method for producing an electrochemical measuring sensor 失效
标题翻译：电化学测量传感器及电化学测量传感器的制造方法
公开(公告)号：US5885429A
公开(公告)日：1999-03-23
申请号：US860661
申请日：1997-08-08
申请人： Karl-Hermann Friese , Werner Gruenwald , Kurt Schmid , Claudio De La Prieta , Gerhard Schneider , Hans-Joerg Renz , Harald Neumann , Uwe Glanz , Stefan Kuschel , Ralf Haug , Manfred Moser , Kurt Bayha , Annette Seibold , Carmen Schmiedel , Reiner Schuetz
发明人： Karl-Hermann Friese , Werner Gruenwald , Kurt Schmid , Claudio De La Prieta , Gerhard Schneider , Hans-Joerg Renz , Harald Neumann , Uwe Glanz , Stefan Kuschel , Ralf Haug , Manfred Moser , Kurt Bayha , Annette Seibold , Carmen Schmiedel , Reiner Schuetz
IPC分类号： G01N27/409 , G01N27/407 , G01N27/26
CPC分类号： G01N27/4075
摘要： An electrochemical measuring sensor having a solid electrolyte, a first electrode exposed to a gas to be measured and a second electrode exposed to a reference gas, with the electrodes preferably being arranged on opposite sides of the solid electrolyte. At least one of the electrodes (16, 20) is provided with a contouring (24) on its side (22) that is exposed to the gas to be measured or to the reference gas, with the contouring being a trench-shaped groove (26) embossed into the surface of the electrode such that the electrode is pressed into the adjacent solid electrolyte in the region of the groove. According to the method, the embossing is done while the electrode and the solid electrolyte are in the non-sintered state, and the sensor is subsequently sintered.
摘要翻译： PCT No.PCT / DE96 / 01753 Sec。 371日期：1997年8月8日 102（e）日期1997年8月8日PCT提交1996年9月17日PCT公布。公开号WO97 / 17608 日期1997年5月15日具有固体电解质的电化学测量传感器，暴露于待测气体的第一电极和暴露于参考气体的第二电极，电极优选布置在固体电解质的相对侧上。电极（16,20）中的至少一个在其侧面（22）处设置有暴露于待测量气体或参考气体的轮廓（24），其中轮廓是沟槽形凹槽 26）压印到电极的表面中，使得电极在凹槽的区域中被压入相邻的固体电解质中。根据该方法，在电极和固体电解质处于非烧结状态下进行压花，随后将传感器烧结。

7. 发明授权

US5891366A Anisotropically conducting adhesive, and process for producing an anisotropically conducting adhesive 失效
标题翻译：各向异性导电粘合剂，以及用于制造各向异性导电粘合剂的方法
公开(公告)号：US5891366A
公开(公告)日：1999-04-06
申请号：US765071
申请日：1996-12-27
申请人： Werner Gruenwald , Ralf Haug , Thomas Burkhart , Martin Mennig , Helmut Schmidt , Monika Schneider
发明人： Werner Gruenwald , Ralf Haug , Thomas Burkhart , Martin Mennig , Helmut Schmidt , Monika Schneider
IPC分类号： C04B35/46 , C04B35/468 , C09J9/02 , C09J201/00 , C09J201/04 , H01B1/22 , H01B3/12 , H01G4/12 , H01L21/60 , H01R11/01 , H05K3/32 , B32B31/26 , B32B31/28
CPC分类号： H05K3/323 , C04B35/468 , C09J9/02 , C23C18/14 , H01G4/1227 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/2755 , H01L2224/278 , H01L2224/2919 , H01L2224/29339 , H01L2224/29499 , H01L2224/83192 , H01L2224/8388 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01077 , H01L2924/01082 , H01L2924/0665 , H01L2924/0781 , H01L2924/12042 , H01L2924/14 , H05K2201/10674 , H05K2203/107
摘要： An anisotropically conducting adhesive includes a thermoplastic base material; and particles which include metal particles and metal ions, which are electrically conductive, and which are finely distributed within the thermoplastic base material below a percolation threshold, wherein the particles are enriched in certain regions under the influence of exposure to at least one of light and heat. A process for producing an anisotropically conducting adhesive includes providing a material comprised of thermoplastic base material in which electrically conductive particles including metal particles and metal ions are dispersed; and exposing the material to at least one of light and heat in predetermined regions in a targeted manner so that a targeted local heating occurs in the exposed regions and an increased mobility of the metal particles and metal ions occurs which is effective to provide a plurality of anisotropically electrically conductive paths having an enriched amount of the electrically conductive particles compared to that of adjacent regions, wherein the metal ions contribute to the formation of the plurality of anisotropically electrically conductive paths by undergoing reduction from the metal ion to the metal.
摘要翻译： PCT No.PCT / DE95 / 00769 Sec。 371日期1996年12月27日第 102（e）日期1996年12月27日PCT归档1995年6月16日PCT公布。公开号WO96 / 00969 日期1996年1月11日各向异性导电粘合剂包括热塑性基材; 以及包括金属颗粒和金属离子的颗粒，它们是导电的，并且在渗透阈值以下精细地分布在热塑性基材内部，其中颗粒在暴露于光和热。制造各向异性导电粘合剂的方法包括提供由热塑性基材构成的材料，其中分散有金属颗粒和金属离子的导电颗粒; 并且以目标方式将材料暴露于预定区域中的光和热中的至少一种，使得在暴露区域中发生目标局部加热，并且发生金属颗粒和金属离子的增加的迁移率，这有助于提供多个各向异性导电路径具有与相邻区域相比富集的导电颗粒的量，其中金属离子有助于通过从金属离子还原成金属来形成多个各向异性导电路径。

8. 发明授权

US5784779A Method for joining an electrical connection of a non-packaged IC component with a conductive strip on a substrate 失效
标题翻译：用于将未封装的IC部件的电连接与基板上的导电条接合的方法
公开(公告)号：US5784779A
公开(公告)日：1998-07-28
申请号：US727541
申请日：1996-10-22
申请人： Werner Gruenwald , Ralf Haug , Martin Seyffert , Frank-Dieter Hauschild
发明人： Werner Gruenwald , Ralf Haug , Martin Seyffert , Frank-Dieter Hauschild
IPC分类号： H01L21/60 , H05K3/32 , H05K3/18 , H05K13/04
CPC分类号： H01L24/81 , H05K3/32 , H01L2224/81801 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19043 , Y10S29/012 , Y10T29/49133 , Y10T29/49144
摘要： A method for joining an electrical connection (10) of a non-packaged IC component (15) with a conductive strip (35) on a substrate (30). An easy to metallize layer (20) preferably is applied to the surface of an electrical connection (10) that is to be connected. The surface (10, 20) to be connected of connection (10) is arranged at a distance to and facing a contact surface (45) of a conductive strip (35) on a substrate (30). An electrically conductive material (50) for filling in the free volume between the two surfaces (10, 20; 45) to be connected is applied simultaneously to the contact surface (45) and the surface (10, 20) to be connected.
摘要翻译： PCT No.PCT / DE96 / 00432 Sec。 371日期1996年10月22日第 102（e）日期1996年10月22日PCT 1996年3月12日PCT公布。 WO96 / 36991 PCT出版物日期1996年11月21日一种用于将未封装的IC部件（15）的电连接（10）与基板（30）上的导电条（35）接合的方法。优选地，易于金属化层（20）施加到要连接的电连接（10）的表面。要连接的连接（10）的表面（10,20）被布置成与衬底（30）上的导电条（35）的接触表面（45）相距一定距离。用于填充待连接的两个表面（10,20,45）之间的自由体积的导电材料（50）同时施加到要连接的接触表面（45）和表面（10,20）。

9. 发明授权

US08114001B2 Workpiece processing plant 有权
标题翻译：工件加工厂
公开(公告)号：US08114001B2
公开(公告)日：2012-02-14
申请号：US12306195
申请日：2008-06-11
申请人： Wolfgang Horn , Moshe Israel Meidar , Thomas Bayha , Ralf Haug
发明人： Wolfgang Horn , Moshe Israel Meidar , Thomas Bayha , Ralf Haug
IPC分类号： B23Q3/155 , B23Q7/14 , B23Q41/02
CPC分类号： B25J5/02 , B23Q7/04 , B23Q7/1415 , B23Q11/005 , B23Q11/0057 , B23Q2230/002 , B25J9/046 , Y10S483/901 , Y10T29/5124 , Y10T409/304088 , Y10T409/305264 , Y10T409/30532 , Y10T483/165 , Y10T483/17
摘要： A workpiece processing plant comprises several machine tools which are arranged in opposite rows. The rows define a free space between each other. A loading and unloading device is provided which comprises a girder above the machine tools and above the free space. Rails are provided on the upper side of the girder. A loading and unloading unit configured as a multiple-axis robot is displaceable along the rails, the loading and unloading unit comprising several arms which are articulated to one another.
摘要翻译：工件加工设备包括布置成相对的几个机床。这些行定义了彼此之间的空闲空间。提供了装载和卸载装置，其包括在机床上方并在自由空间上方的梁。在大梁的上侧设置有轨道。构造为多轴机器人的装卸单元可沿轨道移动，装载和卸载单元包括彼此铰接的多个臂。

10. 发明申请

US20090288287A1 Workpiece Processing Plant 有权
标题翻译：工件加工厂
公开(公告)号：US20090288287A1
公开(公告)日：2009-11-26
申请号：US12306195
申请日：2008-06-11
申请人： Wolfgang Horn , Moshe Israel Meidar , Thomas Bayha , Ralf Haug
发明人： Wolfgang Horn , Moshe Israel Meidar , Thomas Bayha , Ralf Haug
IPC分类号： B23Q41/02 , B23P23/00
CPC分类号： B25J5/02 , B23Q7/04 , B23Q7/1415 , B23Q11/005 , B23Q11/0057 , B23Q2230/002 , B25J9/046 , Y10S483/901 , Y10T29/5124 , Y10T409/304088 , Y10T409/305264 , Y10T409/30532 , Y10T483/165 , Y10T483/17
摘要： A workpiece processing plant comprises several machine tools which are arranged in opposite rows. The rows define a free space between each other. A loading and unloading device is provided which comprises a girder above the machine tools and above the free space. Rails are provided on the upper side of the girder. A loading and unloading unit configured as a multiple-axis robot is displaceable along the rails, the loading and unloading unit comprising several arms which are articulated to one another.
摘要翻译：工件加工设备包括布置成相对的几个机床。这些行定义了彼此之间的空闲空间。提供了装载和卸载装置，其包括在机床上方并在自由空间上方的梁。在大梁的上侧设置有轨道。构造为多轴机器人的装卸单元可沿轨道移动，装载和卸载单元包括彼此铰接的多个臂。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式