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1. 发明授权

CN1125525C 碳换向器及其制造方法失效
公开(公告)号：CN1125525C
公开(公告)日：2003-10-22
申请号：CN99806948.5
申请日：1999-04-30
申请人：麦考德·温·特克斯特恩公司
发明人：威廉·E·兹格勒 , 威廉·A·鲍尔
IPC分类号： H02K13/04 , H02K15/00 , H01R39/04 , H01R39/06 , H01R43/06
CPC分类号： H01R39/06 , H01R39/045 , Y10S29/012 , Y10S29/029 , Y10S228/903 , Y10T29/49011 , Y10T29/49144
摘要：一种电动机的圆柱体型或者面型碳片换向器组件(12c)包括分段换向表面(22c)，该换向表面(22c)由换向器部分(14c，18c)的环形布置限制出，每个部分包括碳片(18c)，而碳片被连接到相应的导体部分(14c)上。为了形成组件，环形碳圆柱体(20c)被模制到铜坯料(70c)上，径向槽(54c)形成于与换向表面相对的碳圆柱体的内表面内。绝缘体轮毂(24c)被模制到碳圆柱体上，并且被模制到径向槽内。然后，从换向表面到填充有绝缘体的槽之间向内机加工出槽(56c)，从而使这些换向器部分绝缘。剩下来的绝缘体材料机械地联锁住这些部分。在其它实施例中，换向器组件(100)通过下面方法来形成：在模制出轮毂(112)和切割出槽(108)从而使换向器部分(106)绝缘之前，把碳圆柱体(142)焊接到导体部分(102)上。

2. 发明公开

CN1304576A 碳换向器失效
公开(公告)号：CN1304576A
公开(公告)日：2001-07-18
申请号：CN99806948.5
申请日：1999-04-30
申请人：麦考德·温·特克斯特恩公司
发明人：威廉·E·兹格勒 , 威廉·A·鲍尔
IPC分类号： H02K13/08 , H02K15/00 , H02K15/12 , H01R39/16 , H01R39/04 , H01R39/06 , H01R43/06
CPC分类号： H01R39/06 , H01R39/045 , Y10S29/012 , Y10S29/029 , Y10S228/903 , Y10T29/49011 , Y10T29/49144
摘要：一种电马达的圆柱体型或者面型碳片换向器组件(12c)包括分段换向表面(22c),该换向表面(22c)由换向器部分(14c,18c)的环形布置限制出,每个部分包括碳片(18c),而碳片被连接到相应的导体部分(14c)上。为了形成组件,环形碳圆柱体(20c)被复制模制到铜坯料(70c)上,径向槽(54c)形成于与换向表面相对的碳圆柱体的内表面内。绝缘体轮毂(24c)被复制模制到碳圆柱体上,并且被复制模制到径向槽内。然后,从换向表面到填充有绝缘体的槽之间向内机加工出槽(56c),从而使这些换向器部分绝缘。剩下来的绝缘体材料机械地联锁住这些部分。在其它实施例中,换向器组件(100)通过下面方法来形成:在复制模制出轮毂(112)和切割出槽(108)从而使换向器部分(106)绝缘之前,把碳圆柱体(142)焊接到导体部分(102)上。

3. 发明申请

WO1996036991A1 PROCESS FOR CONNECTING AN ELECTRIC CONNECTION OF AN UNPACKED IC COMPONENT TO A CONDUCTIVE TRACK ON A SUBSTRATE 审中-公开
标题翻译：方法用于连接散装的IC部件有导体对基片的电连接
公开(公告)号：WO1996036991A1
公开(公告)日：1996-11-21
申请号：PCT/DE1996000432
申请日：1996-03-12
申请人： ROBERT BOSCH GMBH , GRÜNWALD, Werner , HAUG, Ralf , SEYFFERT, Martin , HAUSCHILD, Frank-Dieter
发明人： ROBERT BOSCH GMBH
IPC分类号： H01L21/60
CPC分类号： H01L24/81 , H01L2224/81801 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19043 , H05K3/32 , Y10S29/012 , Y10T29/49133 , Y10T29/49144
摘要： The description relates to a process for connecting an electric connection (10) of an unpacked IC component (15) to a conductive track (35) on a substrate (30). An easily metallisable coating is applied to the surface of an electric connection (10) to be contacted. The surface (10, 20) of the connection (10) to be contacted is arranged at a distance from and facing a land (45) of a conductive track (35) on a substrate (30). At the same time an electrically conductive substance (50) is applied to the land (45) and the surface to be contacted (10, 20) to fill the free space between the two surfaces (10, 20; 45) to be contacted.
摘要翻译：中描述了一种基片（30）上连接一个解包IC部件（15）的导体轨（35）的电端子（10）的方法。在接触表面到电端子（10）被施加了良好的金属化层（20）。要接触的表面（10，20）隔开的基板上的导体轨道（35）的接合表面（45）的终端（10）的（30）面对。在着陆区（45）和所述接触表面（10，20）同时被接触的导电材料（50）填充在两个表面之间的自由体积（10，20; 45）施加。

4. 发明授权

EP0739675B1 Liquid crystal display panel holding metal fixture 失效
标题翻译：对于液晶显示面板的金属保持装置
公开(公告)号：EP0739675B1
公开(公告)日：1999-10-20
申请号：EP96106779.0
申请日：1996-04-29
申请人： NEC CORPORATION
发明人： Takaya, Kei
IPC分类号： B23K1/00 , H05K3/34 , G02F1/13
CPC分类号： H05K3/341 , B23K33/00 , H05K3/301 , H05K2201/10136 , H05K2201/10969 , H05K2201/2081 , Y02P70/613 , Y10S29/012 , Y10T29/49002

5. 发明公开

EP0771472A1 VERFAHREN ZUM VERBINDEN EINES ELEKTRISCHEN ANSCHLUSSES EINES UNVERPACKTEN IC-BAUELEMENTS MIT EINER LEITERBAHN AUF EINEM SUBSTRAT 失效
标题翻译：方法用于连接散装的IC部件有导体对基片的电连接
公开(公告)号：EP0771472A1
公开(公告)日：1997-05-07
申请号：EP96905709.0
申请日：1996-03-12
申请人： ROBERT BOSCH GMBH
发明人： GRÜNWALD, Werner , HAUG, Ralf , SEYFFERT, Martin , HAUSCHILD, Frank-Dieter
IPC分类号： H01L21 , H05K3
CPC分类号： H01L24/81 , H01L2224/81801 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19043 , H05K3/32 , Y10S29/012 , Y10T29/49133 , Y10T29/49144
摘要： The description relates to a process for connecting an electric connection (10) of an unpacked IC component (15) to a conductive track (35) on a substrate (30). An easily metallisable coating is applied to the surface of an electric connection (10) to be contacted. The surface (10, 20) of the connection (10) to be contacted is arranged at a distance from and facing a land (45) of a conductive track (35) on a substrate (30). At the same time an electrically conductive substance (50) is applied to the land (45) and the surface to be contacted (10, 20) to fill the free space between the two surfaces (10, 20; 45) to be contacted.

6. 发明专利

JP3871132B2 Method of manufacturing a commutator 有权
公开(公告)号：JP3871132B2
公开(公告)日：2007-01-24
申请号：JP2003143163
申请日：2003-05-21
申请人：株式会社デンソー
发明人：正幸小林 , 栄二岩成
IPC分类号： H02K15/02 , H01R39/06 , H01R43/08 , H02K13/00 , H02K15/00 , H02K15/12
CPC分类号： H01R43/08 , H01R39/06 , H02K13/006 , H02K15/0056 , H02K15/12 , Y10S29/012 , Y10S29/029 , Y10S228/903 , Y10T29/49009 , Y10T29/49011 , Y10T29/49012 , Y10T29/49144

7. 发明授权

EP1075727B1 CARBON COMMUTATOR 有权
标题翻译：碳刷
公开(公告)号：EP1075727B1
公开(公告)日：2004-06-23
申请号：EP99921595.7
申请日：1999-04-30
申请人： Johnson Electric S.A.
发明人： ZIEGLER, William, E. , BAUER, William, A.
IPC分类号： H02K15/00 , H02K15/12 , H01R39/16 , H01R39/04 , H01R39/06 , H01R43/06 , H01R43/08
CPC分类号： H01R39/06 , H01R39/045 , Y10S29/012 , Y10S29/029 , Y10S228/903 , Y10T29/49011 , Y10T29/49144
摘要： A barrel or face-type carbon-segment commutator assembly (12c) for an electric motor includes a segmented commutating surface (22c) defined by an annular array of commutator sector (14c, 18c), each sector including a carbon segment (18c) connected to a respective conductor section (14c). To form the assembly, an annular carbon cylinder (20c) is overmolded onto a copper blank (70c) and radial grooves (54c) are formed in an inside surface of the carbon cylinder opposite the communicating surface. An insulator hub (24c) is overmolded onto the carbon cylinder and into the radial grooves. Slots (56c) are then machined inward from the communicating surface to the insulator-filled grooves to isolate the commutator sectors. The remaining insulator material mechanically interlocks the sectors. In other embodiments, the commutator assembly (100) is formed by soldering a carbon cylinder (142) to conductor sections (102) before overmolding a hub (112) and cutting slots (108) to isolate commutator sectors (106).

8. 发明公开

EP0739675A3 Liquid crystal display panel holding metal fixture 失效
标题翻译： Metallische HaltevorrichtungfürFlüssigkristallanzeigetafel
公开(公告)号：EP0739675A3
公开(公告)日：1997-04-16
申请号：EP96106779.0
申请日：1996-04-29
申请人： NEC CORPORATION
发明人： Takaya, Kei
IPC分类号： B23K1/00 , H05K3/34 , G02F1/13
CPC分类号： H05K3/341 , B23K33/00 , H05K3/301 , H05K2201/10136 , H05K2201/10969 , H05K2201/2081 , Y02P70/613 , Y10S29/012 , Y10T29/49002
摘要： This invention provides a liquid crystal display panel holding metal fixture into which solder can be prohibited from flowing through the gap of its corner portion when it is to be soldered to a printed circuit board, so that a liquid crystal display panel can be prevented from being held in an inclined state due to the solder flowing into the liquid crystal display panel holding metal fixture. The liquid crystal display panel holding metal fixture holds a liquid crystal display panel and is to be soldered to a printed circuit board. The liquid crystal display panel holding metal fixture has bottom and side surfaces that are formed by bending a metal plate cut into a predetermined shape. The bottom surface has a corner portion where the cut surfaces of the metal plate that form the side surfaces are close to each other. The metal plate is obtained by performing plating for imparting solder wettability on a metal plate made of a material having poor solder wettability, and cutting the plated metal plate into the predetermined shape. Alternatively, the metal plate is made of a material having good solder wettability, and the cut surfaces are subjected to a surface treatment for hampering solder wettability. When the above arrangement is employed, the solder does not easily wet the cut surfaces of the metal plate that form adjacent side surfaces at the corner portion of the bottom surface of the liquid crystal display panel holding metal fixture. Thus, the solder can be prohibited from flowing into the liquid crystal display panel holding metal fixture through the gap in the adjacent cut surfaces when the liquid crystal display panel holding metal fixture is soldered to the printed circuit board.
摘要翻译：本发明提供了一种液晶显示面板，其保持金属夹具，当焊料被焊接到印刷电路板时，可阻止焊料流过其拐角部分的间隙，从而可以防止液晶显示面板由于焊料流入液晶显示面板夹持金属夹具而保持在倾斜状态。液晶显示面板固定金属夹具装有液晶显示面板，并被焊接到印刷电路板上。液晶显示面板固定金属夹具具有通过弯曲切割成预定形状的金属板而形成的底面和侧面。底面具有角部，其中形成侧面的金属板的切割面彼此靠近。通过进行电镀以在由具有差的焊料润湿性的材料制成的金属板上赋予焊料润湿性并将电镀金属板切割成预定形状来获得金属板。或者，金属板由具有良好焊料润湿性的材料制成，并且对切割表面进行表面处理以阻碍焊料润湿性。当采用上述布置时，焊料不容易润湿在液晶显示面板固定金属夹具的底面的角部处形成相邻侧表面的金属板的切割表面。因此，当将液晶显示面板固定金属夹具焊接到印刷电路板时，可以禁止焊料通过相邻切割面中的间隙流入液晶显示面板夹持金属夹具。

9. 发明公开

EP0118537A1 METHOD FOR FABRICATING CORRUGATED MICROWAVE COMPONENTS 失效
标题翻译： HERSTELLUNGSVERFAHREN VON MIKROWELLENRILLENELEMENTEN。
公开(公告)号：EP0118537A1
公开(公告)日：1984-09-19
申请号：EP83902975.0
申请日：1983-09-01
申请人： Hughes Aircraft Company
发明人： COBB, Jack, M.
IPC分类号： H01P11 , H01Q13
CPC分类号： H01Q13/0291 , H01P11/002 , Y10S29/012 , Y10S29/026 , Y10T29/49016 , Y10T29/49861
摘要： Dans le procédé de fabrication de composants striés pour micro-ondes, un assemblage à billettes est formé de plaques électriquement conductrices (10) prises en sandwich avec un matériau d'espacement sensible à une attaque chimique (20) et serrées ensemble (30 et 31). Une surface intérieure (40) est formée dans la billette et un mandrin (50) est inséré. Une surface de contour extérieure (55) est ensuite formée sur l'assemblage mandrin-billette. La surface extérieure est ensuite plaquée (60) jusqu'à obtenir une épaisseur désirée. Le mandrin (50) est extrait et les matériaux d'espacement (20) sont enlevés par attaque chimique pour obtenir le composant fini. Avec le procédé en question, il est possible de fabriquer des dispositifs à micro-ondes pour des fréquences allant jusqu'à 100 GHz et davantage.
摘要翻译：在所公开的用于制造波纹微波部件的方法中，坯料组件由夹在化学蚀刻敏感间隔物材料上并夹在一起的导电板形成。在坯料中形成内表面并插入心轴。然后在心轴 - 坯料组件上形成外部轮廓表面。然后将外表面电镀到期望的厚度。去除心轴，并将间隔物化学蚀刻掉离开成品组件。利用所公开的方法，可以使用包括100GHz及更高频率的微波器件制造。

10. 发明授权

EP0771472B1 VERFAHREN ZUM VERBINDEN EINES ELEKTRISCHEN ANSCHLUSSES EINES UNVERPACKTEN IC-BAUELEMENTS MIT EINER LEITERBAHN AUF EINEM SUBSTRAT 失效
标题翻译：方法用于连接散装的IC部件有导体对基片的电连接
公开(公告)号：EP0771472B1
公开(公告)日：2000-07-26
申请号：EP96905709.0
申请日：1996-03-12
申请人： ROBERT BOSCH GMBH
发明人： GRÜNWALD, Werner , HAUG, Ralf , SEYFFERT, Martin , HAUSCHILD, Frank-Dieter
IPC分类号： H01L21/60
CPC分类号： H01L24/81 , H01L2224/81801 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19043 , H05K3/32 , Y10S29/012 , Y10T29/49133 , Y10T29/49144
摘要： The description relates to a process for connecting an electric connection (10) of an unpacked IC component (15) to a conductive track (35) on a substrate (30). An easily metallisable coating is applied to the surface of an electric connection (10) to be contacted. The surface (10, 20) of the connection (10) to be contacted is arranged at a distance from and facing a land (45) of a conductive track (35) on a substrate (30). At the same time an electrically conductive substance (50) is applied to the land (45) and the surface to be contacted (10, 20) to fill the free space between the two surfaces (10, 20; 45) to be contacted.

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