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1. 发明申请

WO2014099032A1 PACKAGE STRUCTURES INCLUDING DISCRETE ANTENNAS ASSEMBLED ON A DEVICE 审中-公开
标题翻译：包装结构包括在装置上组装的离散天线
公开(公告)号：WO2014099032A1
公开(公告)日：2014-06-26
申请号：PCT/US2013/048671
申请日：2013-06-28
申请人： INTEL CORPORATION , KAMGAING, Telesphor , RAO, Valluri R. , DEGANI, Ofir
发明人： KAMGAING, Telesphor , RAO, Valluri R. , DEGANI, Ofir
IPC分类号： H01Q1/38 , H01Q1/24
CPC分类号： H01Q9/045 , H01L2224/16225 , H01L2924/15311 , H01P11/00 , H01Q1/2283 , H01Q1/38 , H01Q1/526 , H01Q21/0006 , Y10T29/49018
摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.
摘要翻译：描述了形成微电子封装结构的方法及由此形成的相关结构。这些方法和结构可以包括形成包括设置在设备的背侧的分立天线的封装结构，其中分立天线包括天线基板，通过天线基板垂直设置的通过天线基板。垂直设置在器件内的穿通器件衬底通孔经由天线衬底与封装衬底耦合，并且封装衬底与器件的有源侧耦合。

2. 发明申请

WO2008002943A1 BIT-ERASING ARCHITECTURE FOR SEEK-SCAN PROBE (SSP) MEMORY STORAGE 审中-公开
标题翻译： SEEK-SCAN PROBE（SSP）存储器的BIT-ERASING ARCHITECTURE
公开(公告)号：WO2008002943A1
公开(公告)日：2008-01-03
申请号：PCT/US2007/072163
申请日：2007-06-26
申请人： INTEL CORPORATION , MA, Qing , RAO, Valluri, R. , CHOU, Tsung-kuan, Allen
发明人： MA, Qing , RAO, Valluri, R. , CHOU, Tsung-kuan, Allen
IPC分类号： H01L27/115 , H01L21/8247
CPC分类号： B82Y10/00 , G11B9/04 , G11B9/1436 , G11B9/1472
摘要： An apparatus comprising a substrate, a heater formed on the substrate, and a phase-change layer formed on the heater. The heater comprises a heater layer and first and second electrodes electrically coupled to the heater layer. A process comprising forming a heater on a substrate and forming a phase-change layer on the heater. The heater comprises a heater layer and first and second electrodes electrically coupled to the heater layer.
摘要翻译：一种包括基板，形成在基板上的加热器和形成在加热器上的相变层的装置。加热器包括加热器层和电耦合到加热器层的第一和第二电极。一种方法，包括在基底上形成加热器并在加热器上形成相变层。加热器包括加热器层和电耦合到加热器层的第一和第二电极。

3. 发明申请

WO2007005701A3 GAS PHASE CHEMICAL SENSOR BASED ON FILM BULK ACOUSTIC RESONATORS (FBAR) 审中-公开
公开(公告)号：WO2007005701A3
公开(公告)日：2007-01-11
申请号：PCT/US2006/025755
申请日：2006-06-29
申请人： INTEL CORPORATION , MA, Qing , WANG, Li-Peng , RAO, Valluri
发明人： MA, Qing , WANG, Li-Peng , RAO, Valluri
IPC分类号： G01N29/02 , G01N29/036 , G01N33/543
摘要： An FBAR device may be chemically functionalized by depositing an interactive layer so that targeted chemicals are preferentially adsorbed. Such miniaturized chemical sensors may be combined with wireless network technology. For example, a chemical sensor may be integrated in a cell phone, PDA, a watch, or a car with wireless connection and GPS. Since such devices are widely populated, a national sensor network may be established. Consequently, a national toxicity map can be generated in real time. Detailed chemical information may be obtained, such as if a chemical is released by a source fixed on ground or by a moving object, or if is spread by explosives or by wind and so on.

4. 发明申请

WO2006105528A1 SILICON MICROMACHINED ULTRA-SENSITIVE VIBRATION SPECTRUM SENSOR ARRAY (VSSA) 审中-公开
标题翻译：硅微型超声波振动频谱传感器阵列（VSSA）
公开(公告)号：WO2006105528A1
公开(公告)日：2006-10-05
申请号：PCT/US2006/012602
申请日：2006-03-31
申请人： INTEL CORPORATION , WANG, Li-Peng , MA, Qing , RAO, Valluri , PAUL, Goutam
发明人： WANG, Li-Peng , MA, Qing , RAO, Valluri , PAUL, Goutam
IPC分类号： G01H1/00
CPC分类号： G01H1/00
摘要： An apparatus comprising a substrate and an array of vibration sensors formed on the substrate, the array comprising two or more vibration sensors, wherein each vibration sensor in the array has a different noise floor and a different operational frequency range than any of the other vibration sensors in the array. A process comprising forming an array of vibration sensors on a substrate, the array comprising two or more vibration sensors, wherein each of the two or more vibration sensors in the array has a different noise floor and a different operational frequency range than any of the other vibration sensors in the array. Other embodiments are disclosed and claimed.
摘要翻译：一种包括衬底和形成在衬底上的振动传感器阵列的装置，该阵列包括两个或更多个振动传感器，其中阵列中的每个振动传感器具有与任何其它振动传感器不同的本底噪声和不同的工作频率范围在阵列中。一种方法，包括在衬底上形成振动传感器阵列，所述阵列包括两个或更多个振动传感器，其中所述阵列中的所述两个或更多个振动传感器中的每一个具有与其他任何其它振动传感器不同的本底噪声和不同的工作频率范围阵列中的振动传感器。公开和要求保护其他实施例。

5. 发明申请

WO2006071834A3 MEMS PROBE BASED MEMORY 审中-公开
标题翻译：基于MEMS探针的存储器
公开(公告)号：WO2006071834A3
公开(公告)日：2006-08-17
申请号：PCT/US2005046990
申请日：2005-12-21
申请人： INTEL CORP , LAI STEFAN , FAZIO ALBERT , RAO VALLURI , BROWN MIKE , MURALI KRISNAMURTHY
发明人： LAI STEFAN , FAZIO ALBERT , RAO VALLURI , BROWN MIKE , MURALI KRISNAMURTHY
IPC分类号： G11B9/00
CPC分类号： G11C23/00 , B82Y10/00 , G11B9/1436 , G11B9/149 , G11C13/0004
摘要： In accordance with one embodiment of the invention, a memory device may include a memory layer and a MEMS layer. The memory layer may include an integrated circuit with a multiplexer and optionally a memory controller and a storage medium disposed on the integrated circuit where the storage medium includes chalcogenide islands as storage elements. The MEMS layer may include a movable MEMS platform having probes to connect selected chalcogenide islands via positioning of the MEMS platform. A high voltage source disposed external to the memory layer and the MEMS layer may provide a high voltage to a stator electrode on the memory layer and to a rotor electrode on the MEMS platform to control movement of the MEMS platform with respect to the storage medium. The memory device may be utilized in portable electronic devices such as media players and cellular telephones to provide a nonvolatile storage of information.
摘要翻译：根据本发明的一个实施例，存储器件可以包括存储器层和MEMS层。存储器层可以包括具有多路复用器和可选地存储器控制器的集成电路和布置在集成电路上的存储介质，其中存储介质包括作为存储元件的硫族化物岛。 MEMS层可以包括具有通过MEMS平台的定位连接选定的硫族化物岛的探针的可移动MEMS平台。设置在存储器层和MEMS层外部的高电压源可以向存储器层上的定子电极和MEMS平台上的转子电极提供高电压，以控制MEMS平台相对于存储介质的移动。存储装置可以用于诸如媒体播放器和蜂窝电话的便携式电子设备中，以提供信息的非易失性存储。

6. 发明申请

WO2006071834A2 MEMS PROBE BASED MEMORY 审中-公开
标题翻译：基于MEMS探头的存储器
公开(公告)号：WO2006071834A2
公开(公告)日：2006-07-06
申请号：PCT/US2005/046990
申请日：2005-12-21
申请人： INTEL CORPORATION , LAI, Stefan , FAZIO, Albert , RAO, Valluri , BROWN, Mike , MURALI, Krisnamurthy
发明人： LAI, Stefan , FAZIO, Albert , RAO, Valluri , BROWN, Mike , MURALI, Krisnamurthy
IPC分类号： G11B9/00
CPC分类号： G11C23/00 , B82Y10/00 , G11B9/1436 , G11B9/149 , G11C13/0004
摘要： In accordance with one embodiment of the invention, a memory device may include a memory layer and a MEMS layer. The memory layer may include an integrated circuit with a multiplexer and optionally a memory controller and a storage medium disposed on the integrated circuit where the storage medium includes chalcogenide islands as storage elements. The MEMS layer may include a movable MEMS platform having probes to connect selected chalcogenide islands via positioning of the MEMS platform. A high voltage source disposed external to the memory layer and the MEMS layer may provide a high voltage to a stator electrode on the memory layer and to a rotor electrode on the MEMS platform to control movement of the MEMS platform with respect to the storage medium. The memory device may be utilized in portable electronic devices such as media players and cellular telephones to provide a nonvolatile storage of information.
摘要翻译：根据本发明的一个实施例，存储器件可以包括存储器层和MEMS层。存储器层可以包括具有多路复用器的集成电路以及可选地存储器控制器和设置在集成电路上的存储介质，其中存储介质包括作为存储元件的硫族化物岛。 MEMS层可以包括具有探针的可移动MEMS平台，以通过MEMS平台的定位连接选定的硫族化物岛。设置在存储层和MEMS层外部的高电压源可以向存储层上的定子电极和MEMS平台上的转子电极提供高电压，以控制MEMS平台相对于存储介质的移动。存储器装置可用于诸如媒体播放器和蜂窝电话之类的便携式电子装置中以提供信息的非易失性存储。

7. 发明申请

WO2005066366A2 NUCLEIC ACID SEQUENCING BY RAMAN MONITORING OF UPTAKE OF NUCLEOTIDES DURING MOLECULAR REPLICATION 审中-公开
标题翻译：在分子复制期间通过拉曼监测核酸摄取的核酸序列
公开(公告)号：WO2005066366A2
公开(公告)日：2005-07-21
申请号：PCT/US2004/043091
申请日：2004-12-24
申请人： INTEL CORPORATION , RAO, Valluri , NEUBAUER, Gabi , KIRCH, Steven , YAMAKAWA, Mineo , BERLIN, Andrew
发明人： RAO, Valluri , NEUBAUER, Gabi , KIRCH, Steven , YAMAKAWA, Mineo , BERLIN, Andrew
IPC分类号： C12Q1/68
CPC分类号： G01N21/05 , B01L3/5027 , B01L3/502761 , B01L2200/0647 , B01L2300/0896 , B01L2400/0454 , B01L2400/0463 , B82Y5/00 , B82Y15/00 , B82Y30/00 , C12Q1/6869 , G01N21/658 , G01N2021/0346 , G01N2021/651 , G01N2021/653 , G01N2021/655 , G01N2021/656 , C12Q2565/628
摘要： The methods and apparatus disclosed herein are useful for detecting nucleotides, nucleosides, and bases and for nucleic acid sequence determination. The methods involve detection of a nucleotide, nucleoside, or base using surface enhanced Raman spectroscopy (SERS). The detection can be part of a nucleic acid sequencing reaction to detect uptake of a deoxynucleotide triphosphate during a nucleic acid polymerization reaction, such as a nucleic acid sequencing reaction. The nucleic acid sequence of a synthesized nascent strand, and the complementary sequence of the template strand, can be determined by tracking the order of incorporation of nucleotides during the polymerization reaction.
摘要翻译：本文公开的方法和装置可用于检测核苷酸，核苷和碱基并用于核酸序列测定。该方法涉及使用表面增强拉曼光谱（SERS）检测核苷酸，核苷或碱基。检测可以是在核酸聚合反应（例如核酸测序反应）期间检测脱氧核苷酸三磷酸的摄取的核酸测序反应的一部分。合成的新生链的核酸序列和模板链的互补序列可以通过跟踪聚合反应期间核苷酸掺入的顺序来确定。

8. 发明申请

WO2018004696A1 ALIGNMENT OF SINGLE AND MULTI-MODE OPTICAL FIBERS USING PIEZOELECTRIC ACTUATORS 审中-公开
标题翻译：使用压电执行器来调整单模和多模光纤
公开(公告)号：WO2018004696A1
公开(公告)日：2018-01-04
申请号：PCT/US2016/040871
申请日：2016-07-01
申请人： INTEL CORPORATION , SWAN, Johanna M. , ALEKSOV, Aleksandar , OSTER, Sasha N. , EID, Feras , BICEN, Baris , SOUNART, Thomas L. , LIFF, Shawna M. , RAO, Valluri R.
发明人： SWAN, Johanna M. , ALEKSOV, Aleksandar , OSTER, Sasha N. , EID, Feras , BICEN, Baris , SOUNART, Thomas L. , LIFF, Shawna M. , RAO, Valluri R.
IPC分类号： G02B6/26 , G02B6/35 , G02B6/36
摘要： Embodiments of the invention include an optoelectronic package that allows for in situ alignment of optical fibers. In an embodiment, the optoelectronic package may include an organic substrate. Embodiments include a cavity formed into the organic substrate. Additionally, the optoelectronic package may include an actuator formed on the organic substrate that extends over the cavity. In one embodiment, the actuator may include a first electrode, a piezoelectric layer formed on the first electrode, and a second electrode formed on the piezoelectric layer. According to an additional embodiment of the invention, the actuator may include a first portion and a second portion. In order to allow for resistive heating and actuation driven by thermal expansion, a cross-sectional area of the first portion of the beam may be greater than a cross-sectional area of the second portion of the beam.
摘要翻译：本发明的实施例包括允许光纤原位对准的光电子封装。在一个实施例中，光电子封装可以包括有机衬底。实施例包括形成在有机衬底中的空腔。另外，光电子封装可以包括在有机衬底上形成的致动器，其在腔体上延伸。在一个实施例中，致动器可以包括第一电极，形成在第一电极上的压电层以及形成在压电层上的第二电极。根据本发明的另外的实施例，致动器可以包括第一部分和第二部分。为了允许由热膨胀驱动的电阻加热和致动，梁的第一部分的横截面积可以大于梁的第二部分的横截面积。

9. 发明申请

WO2012151003A3 CHIP PACKAGES INCLUDING THROUGH-SILICON VIA DICE WITH VERTICALLY INTEGRATED PHASED-ARRAY ANTENNAS AND LOW-FREQUENCY AND POWER DELIVERY SUBSTRATES 审中-公开
标题翻译：芯片包装，包括通过硅片与垂直集成的相位阵列天线和低频和电力输送基板
公开(公告)号：WO2012151003A3
公开(公告)日：2013-03-14
申请号：PCT/US2012029363
申请日：2012-03-16
申请人： INTEL CORP , KAMGAING TELESPHOR , RAO VALLURI R , PALASKAS YORGOS
发明人： KAMGAING TELESPHOR , RAO VALLURI R , PALASKAS YORGOS
IPC分类号： H01L23/48
CPC分类号： H01Q3/30 , H01L23/66 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L2223/6677 , H01L2224/13025 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2225/06513 , H01L2225/06517 , H01L2924/15321 , H01Q1/2283 , H01Q9/0414 , H01Q21/065 , H01Q23/00 , Y10T29/49004 , Y10T29/49018
摘要： An apparatus includes a die with through-silicon vias and radio frequency integrated circuit capabilities and it is vertically integrated with a phased-array antenna substrate. The through-silicon via and a radio frequency integrated circuit is coupled to a plurality of antenna elements disposed on the phased-array antenna substrate where each of the plurality of antenna elements is coupled to the through-silicon vias and radio frequency integrated circuit through a plurality of through-silicon vias. A process of assembling the through-silicon vias and radio frequency integrated circuit to the phased-array antenna substrate includes testing the apparatus.
摘要翻译：一种装置包括具有通硅通孔和射频集成电路功能的裸片，并且与相控阵天线基板垂直集成。穿硅通孔和射频集成电路耦合到布置在相控阵天线基板上的多个天线元件，其中多个天线元件中的每一个天线元件通过一个通孔硅通孔和射频集成电路多个通硅通孔。将穿硅通孔和射频集成电路组装到相控阵天线基板的过程包括测试该装置。

10. 发明申请

WO2012151120A2 RADIO- AND ELECTROMAGNETIC INTERFERENCE THROUGH-SILICON VIAS FOR STACKED-DIE PACKAGES, AND METHODS OF MAKING SAME 审中-公开
标题翻译：用于堆叠式包装的通过硅电缆的无线电和电磁干扰及其制造方法
公开(公告)号：WO2012151120A2
公开(公告)日：2012-11-08
申请号：PCT/US2012/035373
申请日：2012-04-27
申请人： INTEL CORPORATION , KAMGAING, Telesphor , RAO, Valluri R.
发明人： KAMGAING, Telesphor , RAO, Valluri R.
IPC分类号： H01L23/66 , H05K9/00
CPC分类号： H01L23/552 , H01L23/481 , H01L23/66 , H01L25/18 , H01L2223/6616 , H01L2223/6677 , H01L2224/16225 , H01L2225/06513 , H01L2225/06537 , H01L2225/06541 , H01L2924/15311
摘要： An apparatus includes a radio-frequency die with shielding through-silicon vias and a die backside lattice lid that shield a sector in the RF die from radio - and electromagnetic interference.
摘要翻译：一种装置包括具有屏蔽通硅通孔的射频管芯和屏蔽RF管芯中的扇区的模具背面格栅盖与无线电和电磁干扰。

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