专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06402037B1 Two-photon upconverting dyes and applications 失效
标题翻译：双光子上变色染料及其应用
公开(公告)号：US06402037B1
公开(公告)日：2002-06-11
申请号：US09441720
申请日：1999-11-16
申请人： Paras N. Prasad , Jayant D. Bhawalker , Ping Chin Cheng , Shan Jen Pan
发明人： Paras N. Prasad , Jayant D. Bhawalker , Ping Chin Cheng , Shan Jen Pan
IPC分类号： G06K1900
CPC分类号： A61K49/0021 , A61K41/008 , A61K49/0084 , G11C13/04
摘要： The present invention is directed to styryl dyes having the formula: wherein D is an electron donating group; Q is an electron acceptor selected from the group consisting of electron acceptors having the formulae: W is an electron accepting group, R3 is selected from the group consisting of substituted or unsubstituted alkyl or substituted or unsubstituted aryl moieties, n is an integer from 0 to 4, A, B, and C are substituents of their rings and are each independently selected from the group consisting of alkyl, alkoxy, hydroxyalkyl, sulfoalkyl, carboxyalkyl, and hydrogen, and Y is a counterion The present invention discloses media and methods for recording data. A three-dimensional matrix including a plurality of dye molecules, such a styryl dye molecule of the present invention, is provided. A first volume element in the matrix is exposed to actinic radiation for a duration and at an intensity effective to alter detectably a fraction between 0.3 and 0.7 of the dye molecules contained therein. The detectably altered dye molecules are substantially uniformly dispersed in the first volume element. The data storage methods and media of the present invention have approximately 1012 volume elements per square centimeter, and each of the volume elements can store a single bit, digital information of approximately 8 bits, or analog information. The data storage methods and media of the present invention are particularly useful for storing or archiving a series of two-dimensional black and white or color images, such as frames of a movie. Methods for reading data stored in the data storage media of the present invention using confocal microscopy are also disclosed.
摘要翻译：本发明涉及具有下式的苯乙烯基染料：其中D是给电子基团; Q是选自下组的电子受体：具有下式的电子受体：W是电子接受基团，R 3选自的取代或未取代的烷基或取代或未取代的芳基部分，n为0至4的整数，A，B和C为它们的环的取代基，并且各自独立地选自烷基，烷氧基，羟基烷基，磺基烷基，羧基烷基和氢，Y是抗衡离子。本发明公开了用于记录数据的介质和方法。提供了包含多个染料分子，如本发明的苯乙烯基染料分子的三维基质。基质中的第一体积元素暴露于光化辐射持续时间，强度有效地改变其中所含的染料分子的0.3至0.7之间的分数。可检测地改变的染料分子基本均匀地分散在第一容积元件中。本发明的数据存储方法和介质具有每平方厘米大约1012体积的元素，并且每个体积元素可以存储大约8位的单位数字信息或模拟信息。本发明的数据存储方法和媒体对于存储或归档一系列二维黑白图像或彩色图像（例如电影帧）特别有用。还公开了使用共焦显微镜读取存储在本发明的数据存储介质中的数据的方法。

2. 发明授权

US07686909B2 Reel-type package of flexible printed circuit boards and method for supplying thereof 有权
标题翻译：柔性印刷电路板的卷绕式封装及其供电方法
公开(公告)号：US07686909B2
公开(公告)日：2010-03-30
申请号：US11896498
申请日：2007-09-04
申请人： Ping-Chin Cheng , Sheng-Hsiung Ho , Chin-Chen Yang
发明人： Ping-Chin Cheng , Sheng-Hsiung Ho , Chin-Chen Yang
IPC分类号： B32B38/04
CPC分类号： H05K3/0052 , H05K1/0393 , H05K3/005 , H05K3/0097 , H05K3/361 , H05K2203/1545 , Y10T156/1052 , Y10T156/1067 , Y10T156/1087 , Y10T156/12
摘要： A method for reel-type packaging flexible printed circuit boards (FPCs) is disclosed. Firstly, a flexible plate having a plurality of FPC patterns is cut out to form several bar-like materials, wherein each of the bar-like materials has a plurality of aligned FPCs thereon. Subsequently, the bar-like materials are wound onto a reel one by one to form a reel-type package so as to prevent the FPCs from crumpling, curving and deforming when suffering an external force.
摘要翻译：公开了一种卷绕式包装柔性印刷电路板（FPC）的方法。首先，切割具有多个FPC图案的柔性板以形成几个棒状材料，其中每个棒状材料上具有多个对准的FPC。随后，将棒状材料一个一个地缠绕在卷轴上，以形成卷轴式包装，以防止FPC在受到外力时弄皱，弯曲和变形。

3. 发明申请

US20070132918A1 Flat display 审中-公开
标题翻译：平面显示
公开(公告)号：US20070132918A1
公开(公告)日：2007-06-14
申请号：US11603883
申请日：2006-11-24
申请人： Chih-Liang Pan , Chun-Yen Chang , Han-Chang Cheng , Yang-En Wu , Ping-Chin Cheng , Lid-Joon Jong
发明人： Chih-Liang Pan , Chun-Yen Chang , Han-Chang Cheng , Yang-En Wu , Ping-Chin Cheng , Lid-Joon Jong
IPC分类号： G02F1/1335
CPC分类号： G02B6/0053 , G02B6/0046 , G02B6/0051
摘要： A flat display, a flat panel display and a backlight module are disclosed. The flat display module comprises the flat panel display and the backlight module. The flat panel display comprises an upper polarizer and a lower polarizer. The lower polarizer includes a first diffusion layer. The backlight module comprises a light emitting device, a prism sheet and a light guide plate. A light beam is provided by the light emitting device. The prism sheet is one-dimensional prism array structure. The light guide plate includes a second diffusion layer for diffusing the light beam. The first diffusion layer has an optical haze greater than the optical haze of the surface of the upper polarizer. Accordingly, thin thickness and high brightness are achieved for the flat display.
摘要翻译：公开了平板显示器，平板显示器和背光模块。平板显示模块包括平板显示器和背光模块。平板显示器包括上偏振器和下偏振器。下偏振器包括第一扩散层。背光模块包括发光器件，棱镜片和导光板。由发光装置提供光束。棱镜片是一维棱镜阵列结构。导光板包括用于扩散光束的第二扩散层。第一扩散层具有大于上偏振器的表面的光学雾度的光学雾度。因此，对于平板显示器，实现了薄的厚度和高的亮度。

4. 发明申请

US20050162603A1 Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film 有权
标题翻译：使用单个各向异性导电膜安装驱动IC芯片和FPC板/ TCP / COF装置的方法
公开(公告)号：US20050162603A1
公开(公告)日：2005-07-28
申请号：US10766536
申请日：2004-01-27
申请人： Ping-Chin Cheng , Hui-Chang Chen
发明人： Ping-Chin Cheng , Hui-Chang Chen
IPC分类号： G02F1/13 , G02F1/133 , G02F1/1345 , G09G3/36 , H01L21/60 , H05K3/32 , H05K3/36
CPC分类号： G02F1/13452 , H01L24/29 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/83192 , H01L2224/838 , H01L2924/00013 , H01L2924/01006 , H01L2924/01033 , H01L2924/0781 , H01L2924/14 , H05K3/323 , H05K3/361 , H05K2201/10674 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A method for bonding integrated circuit chips and other devices to a liquid crystal display panel. The method involves using a single anisotropic conductive film that is sized to bond at least one integrated circuit chip and at least one other device, such as a flexible printed circuit board, a tape carrier package and a chip-on-film, to the liquid crystal display panel.
摘要翻译：一种用于将集成电路芯片和其它器件接合到液晶显示面板的方法。该方法包括使用单个各向异性导电膜，其大小适于将至少一个集成电路芯片和至少一个其它器件（例如柔性印刷电路板，载带封装和片上芯片）结合到液体水晶显示面板。

5. 发明授权

US07375787B2 Liquid crystal display devices 有权
标题翻译：液晶显示装置
公开(公告)号：US07375787B2
公开(公告)日：2008-05-20
申请号：US11544409
申请日：2006-10-05
申请人： Ping-Chin Cheng , Hui-Chang Chen
发明人： Ping-Chin Cheng , Hui-Chang Chen
IPC分类号： G02F1/1345
CPC分类号： G02F1/13452 , H01L24/29 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/83192 , H01L2224/838 , H01L2924/00013 , H01L2924/01006 , H01L2924/01033 , H01L2924/0781 , H01L2924/14 , H05K3/323 , H05K3/361 , H05K2201/10674 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A liquid crystal display device includes a thin film transistor array disposed on a first region of a panel. An anisotropic conductive film bonds at least one integrated circuit chip and at least one other device, such as a FPC board, a TCP and a COF, to a second region of the panel.
摘要翻译：液晶显示装置包括设置在面板的第一区域上的薄膜晶体管阵列。各向异性导电膜将至少一个集成电路芯片和至少一个其它器件（例如FPC板，TCP和COF）结合到面板的第二区域。

6. 发明申请

US20070295444A1 Reel-type package of flexible printed circuit borads and method for supplying thereof 有权
标题翻译：柔性印刷电路槽的卷绕式封装及其供应方法
公开(公告)号：US20070295444A1
公开(公告)日：2007-12-27
申请号：US11896498
申请日：2007-09-04
申请人： Ping-Chin Cheng , Sheng-Hsiung Ho , Chin-Chen Yang
发明人： Ping-Chin Cheng , Sheng-Hsiung Ho , Chin-Chen Yang
IPC分类号： B65H81/00
CPC分类号： H05K3/0052 , H05K1/0393 , H05K3/005 , H05K3/0097 , H05K3/361 , H05K2203/1545 , Y10T156/1052 , Y10T156/1067 , Y10T156/1087 , Y10T156/12
摘要： A method for reel-type packaging flexible printed circuit boards (FPCs) is disclosed. Firstly, a flexible plate having a plurality of FPC patterns is cut out to form several bar-like materials, wherein each of the bar-like materials has a plurality of aligned FPCs thereon. Subsequently, the bar-like materials are wound onto a reel one by one to form a reel-type package so as to prevent the FPCs from crumpling, curving and deforming when suffering an external force.
摘要翻译：公开了一种卷绕式包装柔性印刷电路板（FPC）的方法。首先，切割具有多个FPC图案的柔性板以形成几个棒状材料，其中每个棒状材料上具有多个对准的FPC。随后，将棒状材料一个一个地缠绕在卷轴上，以形成卷轴式包装，以防止FPC在受到外力时弄皱，弯曲和变形。

7. 发明申请

US20070030435A1 Liquid crystal display devices 有权
标题翻译：液晶显示装置
公开(公告)号：US20070030435A1
公开(公告)日：2007-02-08
申请号：US11544409
申请日：2006-10-05
申请人： Ping-Chin Cheng , Hui-Chang Chen
发明人： Ping-Chin Cheng , Hui-Chang Chen
IPC分类号： G02F1/1345
CPC分类号： G02F1/13452 , H01L24/29 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/83192 , H01L2224/838 , H01L2924/00013 , H01L2924/01006 , H01L2924/01033 , H01L2924/0781 , H01L2924/14 , H05K3/323 , H05K3/361 , H05K2201/10674 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A liquid crystal display device includes a thin film transistor array disposed on a first region of a panel. An anisotropic conductive film bonds at least one integrated circuit chip and at least one other device, such as a FPC board, a TCP and a COF, to a second region of the panel.
摘要翻译：液晶显示装置包括设置在面板的第一区域上的薄膜晶体管阵列。各向异性导电膜将至少一个集成电路芯片和至少一个其它器件（例如FPC板，TCP和COF）结合到面板的第二区域。

8. 发明授权

US07139060B2 Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film 有权
标题翻译：使用单个各向异性导电膜安装驱动IC芯片和FPC板/ TCP / COF装置的方法
公开(公告)号：US07139060B2
公开(公告)日：2006-11-21
申请号：US10766536
申请日：2004-01-27
申请人： Ping-Chin Cheng , Hui-Chang Chen
发明人： Ping-Chin Cheng , Hui-Chang Chen
IPC分类号： G02F1/1345
CPC分类号： G02F1/13452 , H01L24/29 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/83192 , H01L2224/838 , H01L2924/00013 , H01L2924/01006 , H01L2924/01033 , H01L2924/0781 , H01L2924/14 , H05K3/323 , H05K3/361 , H05K2201/10674 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A method for bonding integrated circuit chips and other devices to a liquid crystal display panel. The method involves using a single anisotropic conductive film that is sized to bond at least one integrated circuit chip and at least one other device, such as a flexible printed circuit board, a tape carrier package and a chip-on-film, to the liquid crystal display panel.
摘要翻译：一种用于将集成电路芯片和其它器件接合到液晶显示面板的方法。该方法包括使用单个各向异性导电膜，其大小适于将至少一个集成电路芯片和至少一个其它器件（例如柔性印刷电路板，载带封装和片上芯片）结合到液体水晶显示面板。

9. 发明申请

US20060006537A1 Conductive line structure 有权
公开(公告)号：US20060006537A1
公开(公告)日：2006-01-12
申请号：US10903624
申请日：2004-07-30
申请人： Chun-Yu Lee , Ping-Chin Cheng
发明人： Chun-Yu Lee , Ping-Chin Cheng
IPC分类号： H01L23/48 , H01L21/82
CPC分类号： G02F1/1345 , H01L27/124 , H05K1/111 , H05K1/117 , H05K3/225 , H05K3/323 , H05K3/361 , H05K2201/09663 , H05K2203/175 , Y02P70/611
摘要： A conductive line Structure. In one embodiment of the invention, a conductive line includes at least two outer conductive portions, an inner conductive portion between the outer conductive portions, separated from the outer conductive portions by at least two trenches along the conductive line, and at least one connecting portion disposed in each trench connecting the inner conductive portion and the outer conductive portions.

10. 发明授权

US06867505B2 Semiconductor device, a method for making the same, and an LCD monitor comprising the same 有权
标题翻译：半导体器件及其制造方法以及包括该半导体器件的LCD监视器
公开(公告)号：US06867505B2
公开(公告)日：2005-03-15
申请号：US10010661
申请日：2001-11-30
申请人： Chun-Yu Lee , Ping-Chin Cheng
发明人： Chun-Yu Lee , Ping-Chin Cheng
IPC分类号： G02F1/1345 , G09F9/00 , G09F9/35 , H01L21/60 , H01L23/16 , H05K3/32 , H05K3/34 , H05K3/36 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/32 , H01L23/16 , H01L24/29 , H01L24/83 , H01L2224/1147 , H01L2224/16225 , H01L2224/27013 , H01L2224/29399 , H01L2224/83051 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/0781 , H01L2924/14 , H01L2924/3011 , H05K3/323 , H05K3/3452 , H05K3/361 , H05K2201/09909 , H05K2201/10674
摘要： A semiconductor device, comprising an electrode on a base surface, a bump formed on the electrode, a pad, and a means of connection. The means of connection comprises a plurality of conductive particles, conducting the bump and the pad with conductive particles bonded between. The base surface is further formed with a barrier rib that separates the conductive particles.
摘要翻译：一种半导体器件，包括在基底表面上的电极，形成在电极上的凸块，焊盘和连接装置。连接装置包括多个导电颗粒，导电凸块和焊盘之间的导电颗粒结合在一起。基底表面进一步形成有分隔导电颗粒的隔壁。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式