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1. 发明申请

US20120209100A1 BIOCOMPATIBLE PACKAGING 有权
标题翻译：生物化学包装
公开(公告)号：US20120209100A1
公开(公告)日：2012-08-16
申请号：US13333836
申请日：2011-12-21
申请人： Maria OP DE BEECK , Eric Beyne , Philippe Soussan
发明人： Maria OP DE BEECK , Eric Beyne , Philippe Soussan
IPC分类号： H01L21/56 , A61B5/04
CPC分类号： A61B5/686 , A61B5/6861 , A61B2562/0247 , A61B2562/028 , A61M5/14276 , A61M2205/0244 , A61M2205/8206 , A61N1/37205 , A61N1/375 , A61N1/3756 , H01L23/3114 , H01L24/48 , H01L2224/451 , H01L2224/48227 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method is disclosed for packaging a device, e.g., for bio-medical applications. In one aspect, the method includes obtaining a component on a substrate and separating the component and a first part of the substrate from a second part of the substrate using at least one physical process inducing at least one sloped side wall on the first part of the substrate. The method also includes providing an encapsulation for the chip. The resulting packaged chip advantageously has a good step coverage resulting in a good hermeticity, less sharp edges resulting in a reduced risk of damaging or infection after implantation and has a relatively small packaged volume compared to conventional big box packaging techniques.
摘要翻译：公开了一种用于包装装置的方法，例如用于生物医学应用。在一个方面，该方法包括在基底上获得部件并使用至少一个物理过程将基板的部件和第一部分与基板的第二部分分离，该至少一个物理工艺在第一部分上引入至少一个倾斜的侧壁基质。该方法还包括为芯片提供封装。所得到的封装芯片有利地具有良好的阶梯覆盖，导致良好的气密性，较少的尖锐边缘导致植入后损害或感染的风险降低，并且与传统的大盒子封装技术相比具有相对较小的封装体积。

2. 发明申请

US20120279837A1 METHOD FOR REDUCING SUBSTRATE CHARGING 有权
标题翻译：减少基板充电的方法
公开(公告)号：US20120279837A1
公开(公告)日：2012-11-08
申请号：US12415937
申请日：2009-03-31
申请人： Ingrid De Wolf , Xavier Rottenberg , Piotr Czarnecki , Philippe Soussan
发明人： Ingrid De Wolf , Xavier Rottenberg , Piotr Czarnecki , Philippe Soussan
IPC分类号： H01H57/00 , H01H49/00
CPC分类号： B81B3/0008 , B81B2201/016 , H01G5/16 , H01H59/0009 , H01H2059/0018
摘要： An electrostatically actuatable micro electromechanical device is provided with enhanced reliability and lifetime. The electrostatically actuatable micro electromechanical device comprises: a substrate, a first conductor fixed to the top layer of the substrate, forming a fixed electrode, a second conductor fixed to the top layer of the substrate, and a substrate area. The second conductor is electrically isolated from the first conductor and comprises a moveable portion, suspended at a predetermined distance above the first conductor, the moveable portion forming a moveable electrode which approaches the fixed electrode upon applying an actuation voltage between the first and second conductors. The selected substrate surface area is defined as the orthogonal projection of the moveable portion on the substrate between the first and second conductors. In the substrate surface area at least one recess is provided in at least the top layer of the substrate.
摘要翻译：提供了一种可静电驱动的微机电装置，具有更高的可靠性和寿命。静电致动微机电装置包括：基板，固定到基板的顶层的第一导体，形成固定电极，固定到基板的顶层的第二导体和基板区域。所述第二导体与所述第一导体电隔离并且包括悬挂在所述第一导体上方预定距离处的可移动部分，所述可移动部分形成在所述第一和第二导体之间施加致动电压时接近所述固定电极的可移动电极。所选择的基板表面积被定义为在第一和第二导体之间的基板上的可移动部分的正交投影。在基板表面区域中，至少一个凹部设置在基板的至少顶层中。

3. 发明申请

US20070071900A1 Methods for protecting metal surfaces 审中-公开
标题翻译：保护金属表面的方法
公开(公告)号：US20070071900A1
公开(公告)日：2007-03-29
申请号：US11527303
申请日：2006-09-25
申请人： Philippe Soussan , Serguei Stoukatch , Eric Beyne
发明人： Philippe Soussan , Serguei Stoukatch , Eric Beyne
IPC分类号： B05D3/00 , B05D3/02
CPC分类号： H01L24/85 , B23K1/206 , C23C8/02 , C23F4/00 , C23G5/00 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/03505 , H01L2224/04042 , H01L2224/05624 , H01L2224/05647 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/45565 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/48505 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/48847 , H01L2224/78 , H01L2224/8501 , H01L2224/85013 , H01L2224/85065 , H01L2224/85075 , H01L2224/85205 , H01L2924/00011 , H01L2924/01005 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/20106 , H01L2924/20752 , H01L2924/3025 , H05K3/3489 , H05K2203/095 , H05K2203/1105 , H05K2203/1157 , H01L2924/00014 , H01L2924/01001 , H01L2224/05639 , H01L2924/00 , H01L2224/48824 , H01L2924/00015 , H01L2924/01006
摘要： Methods for protecting metal surfaces against oxidation are provided. The methods can comprise a plasma treatment, a sintering treatment or a combination of the plasma and sintering treatment. Also provided is a method for bonding a wire on a metal bond pad using the methods for protecting a metal surface.
摘要翻译：提供了保护金属表面免受氧化的方法。该方法可以包括等离子体处理，烧结处理或等离子体和烧结处理的组合。还提供了使用保护金属表面的方法将金属丝焊接在金属焊盘上的方法。

4. 发明授权

US09048198B2 Biocompatible packaging 有权
标题翻译：生物相容包装
公开(公告)号：US09048198B2
公开(公告)日：2015-06-02
申请号：US13333836
申请日：2011-12-21
申请人： Maria Op De Beeck , Eric Beyne , Philippe Soussan
发明人： Maria Op De Beeck , Eric Beyne , Philippe Soussan
IPC分类号： H01L21/00 , H01L23/31 , A61N1/375 , A61N1/372 , A61M5/142 , A61B5/00 , H01L23/00
CPC分类号： A61B5/686 , A61B5/6861 , A61B2562/0247 , A61B2562/028 , A61M5/14276 , A61M2205/0244 , A61M2205/8206 , A61N1/37205 , A61N1/375 , A61N1/3756 , H01L23/3114 , H01L24/48 , H01L2224/451 , H01L2224/48227 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method is disclosed for packaging a device, e.g., for bio-medical applications. In one aspect, the method includes obtaining a component on a substrate and separating the component and a first part of the substrate from a second part of the substrate using at least one physical process inducing at least one sloped side wall on the first part of the substrate. The method also includes providing an encapsulation for the chip. The resulting packaged chip advantageously has a good step coverage resulting in a good hermeticity, less sharp edges resulting in a reduced risk of damaging or infection after implantation and has a relatively small packaged volume compared to conventional big box packaging techniques.
摘要翻译：公开了一种用于包装装置的方法，例如用于生物医学应用。在一个方面，该方法包括在基底上获得部件并使用至少一个物理过程将基板的部件和第一部分与基板的第二部分分离，该至少一个物理工艺在第一部分上引入至少一个倾斜的侧壁基质。该方法还包括为芯片提供封装。所得到的封装芯片有利地具有良好的阶梯覆盖，导致良好的气密性，较少的尖锐边缘导致植入后损害或感染的风险降低，并且与传统的大盒子封装技术相比具有相对较小的封装体积。

5. 发明申请

US20120126391A1 Methods for Embedding Conducting Material and Devices Resulting from Said Methods 有权
标题翻译：用于嵌入由所述方法产生的导电材料和装置的方法
公开(公告)号：US20120126391A1
公开(公告)日：2012-05-24
申请号：US13292261
申请日：2011-11-09
申请人： Alain Phommahaxay , Lieve Bogaerts , Philippe Soussan
发明人： Alain Phommahaxay , Lieve Bogaerts , Philippe Soussan
IPC分类号： H01L23/04 , H01L21/52
CPC分类号： B81C1/00896 , B81C2203/0109 , B81C2203/035
摘要： Disclosed are methods for forming semiconductor devices and the semiconductor devices thus obtained. In one embodiment, the method may include providing a semiconductor wafer comprising a surface, forming on the surface at least one device, forming a release layer at least in an area of the surface that encircles the at least one device, forming on the release layer at least one wall structure around the at least one device, and forming at least one cap on the at least one wall structure. In one embodiment, the device may include a substrate comprising a surface, at least one device formed on the surface, a release layer formed at least in an area of the surface that encircles the at least one device, at least one wall structure formed around the at least one device, and at least one removable cap formed on the at least one wall structure.
摘要翻译：公开了用于形成如此获得的半导体器件和半导体器件的方法。在一个实施例中，该方法可以包括提供包括表面的半导体晶片，在表面上形成至少一个器件，在至少在包围至少一个器件的表面的区域中形成释放层，形成在释放层围绕所述至少一个装置的至少一个壁结构，以及在所述至少一个壁结构上形成至少一个盖。在一个实施例中，该装置可以包括一个包括一个表面的基底，至少一个在该表面上形成的装置，至少在该表面的区域中形成的剥离层，该释放层环绕该至少一个装置，至少一个壁结构所述至少一个装置以及形成在所述至少一个壁结构上的至少一个可拆卸盖。

6. 发明申请

US20110086507A1 METHOD FOR PROVIDING OXIDE LAYERS 有权
标题翻译：提供氧化层的方法
公开(公告)号：US20110086507A1
公开(公告)日：2011-04-14
申请号：US12906766
申请日：2010-10-18
申请人： Philippe Soussan , Eric Beyne , Philippe Muller
发明人： Philippe Soussan , Eric Beyne , Philippe Muller
IPC分类号： H01L21/768
CPC分类号： H01L21/3167 , H01L21/02238 , H01L21/02258 , H01L21/31675
摘要： A method for providing an oxide layer on a semiconductor substrate is disclosed. In one aspect, the method includes obtaining a semiconductor substrate. The substrate may have a three-dimensional structure, which may comprise at least one hole. The method may also include forming an oxide layer on the substrate, for example, on the three-dimensional structure, by anodizing the substrate in an acidic electrolyte solution.
摘要翻译：公开了一种在半导体衬底上提供氧化物层的方法。一方面，该方法包括获得半导体衬底。衬底可以具有三维结构，其可以包括至少一个孔。该方法还可以包括在基板上形成氧化物层，例如在三维结构上，通过在酸性电解质溶液中阳极氧化基板。

7. 发明申请

US20110006431A1 METHOD FOR ALIGNING AND BONDING ELEMENTS AND A DEVICE COMPRISING ALIGNED AND BONDED ELEMENTS 有权
标题翻译：用于对准和结合元件的方法以及包含对准和结合元件的器件
公开(公告)号：US20110006431A1
公开(公告)日：2011-01-13
申请号：US12864871
申请日：2008-12-29
申请人： Philippe Soussan
发明人： Philippe Soussan
IPC分类号： H01L23/538 , H01L21/50
CPC分类号： H01L24/90 , F16B5/04 , H01H1/04 , H01H11/042 , H01L21/6835 , H01L21/6836 , H01L21/76898 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2224/13025 , H01L2224/1308 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16146 , H01L2224/16237 , H01L2224/32145 , H01L2224/75 , H01L2224/757 , H01L2224/81136 , H01L2224/81224 , H01L2224/81801 , H01L2224/83136 , H01L2225/06541 , H01L2225/06575 , H01L2225/06589 , H01L2924/00013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01R4/06 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： The present invention is related to a method for aligning and bonding a first element (1) and a second element (2), comprising: obtaining a first element (1) having at least one protrusion, the protrusion having a base portion (12) made of a first material and an upper portion (13) made of a second, deformable material, different from the first material; obtaining a second element (2) having a first main surface and second main surface (8) and at least one through-hole between the first and second main surface; placing the first and second element onto each other; receiving in the through-hole of the second element (2) the protrusion of the first element (1), the protrusion being arranged and constructed so as to extend from an opening of the through-hole in the first main surface to a position beyond an opening of the through-hole in the second main surface (8); deforming the deformable portion (13) of the protrusion, such that the deformed portion mechanically fixes the second element (2) on the first element (1).
摘要翻译：本发明涉及一种用于对准和接合第一元件（1）和第二元件（2）的方法，包括：获得具有至少一个突起的第一元件（1），所述突起具有基部（12）由与第一材料不同的第二可变形材料制成的第一材料和上部（13）制成; 获得具有第一主表面和第二主表面（8）的第二元件（2）和在第一和第二主表面之间的至少一个通孔; 将第一和第二元件彼此放置; 在所述第二元件（2）的所述通孔中容纳所述第一元件（1）的突起，所述突起被布置和构造成从所述第一主表面中的所述通孔的开口延伸到超出所述第一元件在第二主表面（8）中的通孔的开口; 使突起的可变形部分（13）变形，使得变形部分将第二元件（2）机械地固定在第一元件（1）上。

8. 发明授权

US09061897B2 Methods for embedding conducting material and devices resulting from said methods 有权
标题翻译：用于嵌入由所述方法产生的导电材料和装置的方法
公开(公告)号：US09061897B2
公开(公告)日：2015-06-23
申请号：US13292261
申请日：2011-11-09
申请人： Alain Phommahaxay , Lieve Bogaerts , Philippe Soussan
发明人： Alain Phommahaxay , Lieve Bogaerts , Philippe Soussan
IPC分类号： H01L23/12 , B81C1/00
CPC分类号： B81C1/00896 , B81C2203/0109 , B81C2203/035
摘要： Disclosed are methods for forming semiconductor devices and the semiconductor devices thus obtained. In one embodiment, the method may include providing a semiconductor wafer comprising a surface, forming on the surface at least one device, forming a release layer at least in an area of the surface that encircles the at least one device, forming on the release layer at least one wall structure around the at least one device, and forming at least one cap on the at least one wall structure. In one embodiment, the device may include a substrate comprising a surface, at least one device formed on the surface, a release layer formed at least in an area of the surface that encircles the at least one device, at least one wall structure formed around the at least one device, and at least one removable cap formed on the at least one wall structure.
摘要翻译：公开了用于形成如此获得的半导体器件和半导体器件的方法。在一个实施例中，该方法可以包括提供包括表面的半导体晶片，在表面上形成至少一个器件，在至少在包围至少一个器件的表面的区域中形成释放层，形成在释放层上围绕所述至少一个装置的至少一个壁结构，以及在所述至少一个壁结构上形成至少一个盖。在一个实施例中，该装置可以包括一个包括一个表面的基底，至少一个在该表面上形成的装置，至少在该表面的区域中形成的剥离层，该释放层环绕该至少一个装置，至少一个壁结构所述至少一个装置以及形成在所述至少一个壁结构上的至少一个可拆卸盖。

9. 发明授权

US08822330B2 Method for providing oxide layers 有权
标题翻译：提供氧化物层的方法
公开(公告)号：US08822330B2
公开(公告)日：2014-09-02
申请号：US12906766
申请日：2010-10-18
申请人： Philippe Soussan , Eric Beyne , Philippe Muller
发明人： Philippe Soussan , Eric Beyne , Philippe Muller
IPC分类号： H01L21/4763 , H01L21/02 , H01L21/316
CPC分类号： H01L21/3167 , H01L21/02238 , H01L21/02258 , H01L21/31675
摘要： A method for providing an oxide layer on a semiconductor substrate is disclosed. In one aspect, the method includes obtaining a semiconductor substrate. The substrate may have a three-dimensional structure, which may comprise at least one hole. The method may also include forming an oxide layer on the substrate, for example, on the three-dimensional structure, by anodizing the substrate in an acidic electrolyte solution.
摘要翻译：公开了一种在半导体衬底上提供氧化物层的方法。一方面，该方法包括获得半导体衬底。衬底可以具有三维结构，其可以包括至少一个孔。该方法还可以包括在基板上形成氧化物层，例如在三维结构上，通过在酸性电解质溶液中阳极氧化基板。

10. 发明授权

US08440504B2 Method for aligning and bonding elements and a device comprising aligned and bonded elements 有权
标题翻译：用于对准和结合元件的方法和包括对准和结合元件的装置
公开(公告)号：US08440504B2
公开(公告)日：2013-05-14
申请号：US12864871
申请日：2008-12-29
申请人： Philippe Soussan , Wouter Ruythooren , Eric Beyne , Koen De Munck
发明人： Philippe Soussan , Wouter Ruythooren , Eric Beyne , Koen De Munck
IPC分类号： H01L21/44
CPC分类号： H01L24/90 , F16B5/04 , H01H1/04 , H01H11/042 , H01L21/6835 , H01L21/6836 , H01L21/76898 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2224/13025 , H01L2224/1308 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16146 , H01L2224/16237 , H01L2224/32145 , H01L2224/75 , H01L2224/757 , H01L2224/81136 , H01L2224/81224 , H01L2224/81801 , H01L2224/83136 , H01L2225/06541 , H01L2225/06575 , H01L2225/06589 , H01L2924/00013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01R4/06 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： The present invention is related to a method for aligning and bonding a first element (1) and a second element (2), comprising: obtaining a first element (1) having at least one protrusion, the protrusion having a base portion (12) made of a first material and an upper portion (13) made of a second, deformable material, different from the first material; obtaining a second element (2) having a first main surface and second main surface (8) and at least one through-hole between the first and second main surface; placing the first and second element onto each other; receiving in the through-hole of the second element (2) the protrusion of the first element (1), the protrusion being arranged and constructed so as to extend from an opening of the through-hole in the first main surface to a position beyond an opening of the through-hole in the second main surface (8); deforming the deformable portion (13) of the protrusion, such that the deformed portion mechanically fixes the second element (2) on the first element (1).
摘要翻译：本发明涉及一种用于对准和接合第一元件（1）和第二元件（2）的方法，包括：获得具有至少一个突起的第一元件（1），所述突起具有基部（12）由与第一材料不同的第二可变形材料制成的第一材料和上部（13）制成; 获得具有第一主表面和第二主表面（8）的第二元件（2）和在第一和第二主表面之间的至少一个通孔; 将第一和第二元件彼此放置; 在所述第二元件（2）的所述通孔中容纳所述第一元件（1）的突起，所述突起被布置和构造成从所述第一主表面中的所述通孔的开口延伸到超出所述第一元件在第二主表面（8）中的通孔的开口; 使突起的可变形部分（13）变形，使得变形部分将第二元件（2）机械地固定在第一元件（1）上。

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