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    • 2. 发明申请
    • Inkjet printhead packaging tape for sealing nozzles
    • 用于密封喷嘴的喷墨打印头包装胶带
    • US20070120890A1
    • 2007-05-31
    • US11699295
    • 2007-01-29
    • Paul SpiveyWilliam Rose
    • Paul SpiveyWilliam Rose
    • B41J2/135
    • B41J2/14072
    • An inkjet printhead has a body and a heater chip attached thereto. A nozzle plate on the heater chip includes a periphery and plurality of nozzle holes. An encapsulant bead lines the periphery of the nozzle plate and has a leading edge extending in a direction away from the periphery toward the plurality of nozzle holes. The boundary of the bead embodies an irregular shape and the leading edge exists less than about 500 microns from any of the nozzle holes. A tape attaches to the nozzle plate and covers each of the nozzle holes. The tape does not, however, touch the encapsulant bead. Preferably, the tape has a narrow width portion shorter than a width of the nozzle plate. In this manner, the encapsulant bead may encroach upon the nozzle holes closer than heretofore known. In turn, the heater chip can have reduced size and silicon savings.
    • 喷墨打印头具有附接到其上的主体和加热器芯片。 加热器芯片上的喷嘴板包括周边和多个喷嘴孔。 密封剂珠沿着喷嘴板的周边排列,并且具有沿远离周边的方向朝向多个喷嘴孔延伸的前缘。 珠的边界体现为不规则形状,并且前缘离任何喷嘴孔小于约500微米。 胶带附着在喷嘴板上并覆盖每个喷嘴孔。 然而,胶带不接触密封剂珠。 优选地,带具有比喷嘴板的宽度短的宽度部分。 以这种方式,密封剂珠可能比以前已知的更接近喷嘴孔。 反过来,加热器芯片可以减小尺寸并节省硅。
    • 6. 发明申请
    • Inkjet printhead packaging tape for sealing nozzles
    • 用于密封喷嘴的喷墨打印头包装胶带
    • US20050174386A1
    • 2005-08-11
    • US10775939
    • 2004-02-10
    • Paul SpiveyWilliam Rose
    • Paul SpiveyWilliam Rose
    • B41J2/14
    • B41J2/14072
    • An inkjet printhead has a body and a heater chip attached thereto. A nozzle plate on the heater chip includes a periphery and plurality of nozzle holes. An encapsulant bead lines the periphery of the nozzle plate and has a leading edge extending in a direction away from the periphery toward the plurality of nozzle holes. The boundary of the bead embodies an irregular shape and the leading edge exists less than about 500 microns from any of the nozzle holes. A tape attaches to the nozzle plate and covers each of the nozzle holes. The tape does not, however, touch the encapsulant bead. Preferably, the tape has a narrow width portion shorter than a width of the nozzle plate. In this manner, the encapsulant bead may encroach upon the nozzle holes closer than heretofore known. In turn, the heater chip can have reduced size and silicon savings.
    • 喷墨打印头具有附接到其上的主体和加热器芯片。 加热器芯片上的喷嘴板包括周边和多个喷嘴孔。 密封剂珠沿着喷嘴板的周边排列,并且具有沿远离周边的方向朝向多个喷嘴孔延伸的前缘。 珠的边界体现为不规则形状,并且前缘离任何喷嘴孔小于约500微米。 胶带附着在喷嘴板上并覆盖每个喷嘴孔。 然而,胶带不接触密封剂珠。 优选地,带具有比喷嘴板的宽度短的宽度部分。 以这种方式,密封剂珠可能比以前已知的更接近喷嘴孔。 反过来,加热器芯片可以减小尺寸并节省硅。
    • 8. 发明申请
    • Die attach methods and apparatus for micro-fluid ejection device
    • 微流体喷射装置的贴片方法和装置
    • US20060000090A1
    • 2006-01-05
    • US10880899
    • 2004-06-30
    • Mary SmootPaul SpiveyMelissa WaldeckCraig BertelsenSean Weaver
    • Mary SmootPaul SpiveyMelissa WaldeckCraig BertelsenSean Weaver
    • B21D53/76
    • B41J2/17559B41J2/17513B41J2/1752B41J2/17526B41J2/17553C07D235/18C07D401/12C07D403/12Y10S29/001Y10T29/4913Y10T29/49155Y10T29/49401Y10T29/49798Y10T156/1062
    • A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm−1 on the micro-fluid ejection device structures or on the cartridge body. At least one of the micro-fluid ejection device structures and attached circuit is adhesively bonded to the cartridge body for flow of fluid from the containment localities to the device side thereof.
    • 提供了一种用于制造用于将多个流体保持在分离的容纳区域中的多流体盒的方法。 盒体包含与容纳部位流体连通的流体供给路径。 在半导体晶片上的多个限定的喷墨头基板的每一个的装置侧附着喷嘴板。 每个喷射头基板具有流体供应侧和两个或更多个流体流动路径,用于将流体从供给侧提供到其装置侧。 喷射头基板中的流体流动路径具有大于约1.0流动路径/毫米的流路密度。 切割晶片以提供多个微流体喷射装置结构。 电路装置连接到每个基板的装置侧。 在微流体喷射装置结构上或筒体上的粘合线密度为至少约1.2mm -1的粘合线密度的粘合剂。 微流体喷射装置结构和附接电路中的至少一个被粘合到盒主体上,用于将流体从容纳区域流动到其装置侧。
    • 9. 发明申请
    • Methods and structures for disassembling inkjet printhead components and control therefor
    • 用于拆卸喷墨打印头部件并进行控制的方法和结构
    • US20050099449A1
    • 2005-05-12
    • US10704427
    • 2003-11-07
    • Tim FrasureJames KerrSteven KomplinPaul Spivey
    • Tim FrasureJames KerrSteven KomplinPaul Spivey
    • B41J2/16B41J2/175B41J2/015
    • B41J2/17506B29C65/16B29C65/1635B29C65/76B29C66/112B29C66/114B29C66/53461B29L2031/767Y10T29/49401
    • Methods for disassembling at least two components of an inkjet printhead include applying heat, preferably in the form of laser energy, to one of the components and wholly or partially separating the components thereafter. The disassembly enables ease of refilling the inkjet printhead or replacing original parts. In one embodiment, the components comprise inkjet printhead lids and bodies originally laser welded to one another. In another aspect, methods of disassembly include laser unwelding inkjet printhead lids and bodies according to whether the inkjet printhead body embodies a mono or color ink body type through use of selective control of one or more laser light sources to illuminate the inkjet printhead lid in a specific pattern of light. Still other aspects include a disassembled inkjet printhead having components with laser welding residue thereon. The laser welding residue may have substantially matching edge lines between the two components.
    • 用于拆卸喷墨打印头的至少两个部件的方法包括将优选以激光能量的形式的热量施加到其中一个部件,然后将部件全部或部分分离。 拆卸使得易于重新填充喷墨打印头或更换原始部件。 在一个实施例中,组件包括原始地彼此激光焊接的喷墨打印头盖和主体。 在另一方面,拆卸方法包括根据喷墨打印头体是否通过选择性地控制一个或多个激光源以喷墨打印头盖来照亮喷墨打印头盖来体现单色或彩色墨体型的激光焊接喷墨打印头盖和主体 具体的光线模式。 还有其它方面包括具有在其上具有激光焊接残留的部件的分解的喷墨打印头。 激光焊接残余物可以在两个部件之间具有基本匹配的边缘线。