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    • 1. 发明申请
    • METHOD OF MANUFACTURING ELECTRICAL CONTACTS OF A SILICON SOLAR CELL STRUCTURE
    • 制造硅太阳能电池结构的电气接触方法
    • WO2011117797A1
    • 2011-09-29
    • PCT/IB2011/051164
    • 2011-03-21
    • ROTH & RAU AGBOEHME, RicoANDRAULT, YoannBUECHEL, ArthurPAPET, Pierre
    • BOEHME, RicoANDRAULT, YoannBUECHEL, ArthurPAPET, Pierre
    • H01L31/0224C25D5/02
    • C25D5/02C25D7/12H01L31/022425H01L31/022466H01L31/1884Y02E10/50
    • The present invention relates to a method of manufacturing at least one electrical contact of a silicon solar cell structure comprising the steps of: providing a silicon substrate (11); forming at least one silicon layer (12, 13) on at least one side of the silicon substrate, wherein the silicon substrate and the silicon layer are doped in such a way that a p-n junction is formed between the silicon substrate and the silicon layer; forming at least one transparent conductive oxide (TCO) layer (14, 15) on the at least one silicon layer; forming a metal oxide or carbide layer (16) on the TCO layer, wherein the metal oxide or carbide layer has a lower conductance than the TCO layer; patterning the metal oxide or carbide layer by laser patterning; and forming at least one metal contact (17) on the patterned metal oxide or carbide layer by single- sided electroplating or by metal printing and firing.
    • 本发明涉及一种制造硅太阳能电池结构的至少一个电接触的方法,包括以下步骤:提供硅衬底(11); 在所述硅衬底的至少一侧上形成至少一个硅层(12,13),其中所述硅衬底和所述硅层以在所述硅衬底和所述硅层之间形成p-n结的方式被掺杂; 在所述至少一个硅层上形成至少一个透明导电氧化物(TCO)层(14,15); 在所述TCO层上形成金属氧化物或碳化物层(16),其中所述金属氧化物或碳化物层具有比所述TCO层低的导电性; 通过激光图案化图案化金属氧化物或碳化物层; 以及通过单面电镀或通过金属印刷和烧制在图案化的金属氧化物或碳化物层上形成至少一个金属接触(17)。