专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2006198756A Aligning guide sheet for punch for opening hole in document and stapler 审中-公开
标题翻译：用于在文件和打印机中打开孔的打孔指令
公开(公告)号：JP2006198756A
公开(公告)日：2006-08-03
申请号：JP2005036750
申请日：2005-01-17
申请人： Osamu Yamato , 修大和
发明人： YAMATO OSAMU
IPC分类号： B26F1/32 , B43M99/00
摘要： PROBLEM TO BE SOLVED: To provide a possessor of a punch for opening holes without a guide with a sheet for a guide to fix positions to open the holes in document or to staple by a stapler since a punch for opening holes with a guide is normally used, but main possessors of punches for opening holes have punches for opening holes without guides, and to provide the sheet for the guide to staple at fixed positions since stapling positions by the stapler are not fixed.
SOLUTION: Marks 2 are provided to align reference positions of the punch for opening the holes in a transparent sheet 1. After filing after opening the holes, cut-outs 3 are provided to smoothly extract the sheet 1. When the document is stapled by the stapler, cut-outs 4 and marks 5 for the guide are provided at stapling positions of the sheet 1 since the positions are not fixed.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供用于打开孔的冲头的拥有者，其中没有引导件用于引导件的片材，以固定位置以打开文件中的孔或由订书机进行订书钉，因为用于打开孔的冲头通常使用导向器，但是用于打开孔的冲头的主要拥有者具有用于没有导向件的开孔的冲头，并且由于订书机的装订位置不固定，所以在固定位置处将引导件提供给订书钉。
解决方案：提供标记2以对准用于打开透明片1中的孔的冲头的参考位置。在打开孔之后，提供切口3以平滑地提取片1.当文档是由于位置不固定，在订书机的装订位置上设有切口4和引导件5的标记5。版权所有（C）2006，JPO＆NCIPI

2. 发明授权

US5227747A Dielectric filter having coupling amount adjusting patterns 失效
标题翻译：具有耦合量调节图案的介质滤波器
公开(公告)号：US5227747A
公开(公告)日：1993-07-13
申请号：US892723
申请日：1992-05-29
申请人： Tomokazu Komazaki , Katsuhiko Gunji , Norio Onishi , Osamu Yamato , Akira Mashimo , Kouichi Ichikawa
发明人： Tomokazu Komazaki , Katsuhiko Gunji , Norio Onishi , Osamu Yamato , Akira Mashimo , Kouichi Ichikawa
IPC分类号： H01P1/205
CPC分类号： H01P1/2056
摘要： A dielectric filter includes a unitary dielectric block formed of a uniform, single dielectric material and having electrically conductive metallized patterns formed on front, rear and lateral walls, and on an outer bottom surface thereof. A plurality of coaxial dielectric resonators each including an open end and a central conductor are longitudinally arranged along the center of a top surface of the block and are spaced apart a predetermined distance. Frequency adjusting patterns are formed on the top surface of the block, each frequency adjusting pattern extending around an open end of a respective one of the resonators. Coupling amount adjusting patterns are also disposed on the top surface of the block, each connected to the front and rear walls and disposed between adjacent ones of the frequency adjusting patterns. At least one additional coupling amount adjusting pattern is disposed on the top surface of the block. The additional coupling amount adjusting pattern has a first end mechanically connected to the front wall and a second end capacitively coupled to the rear wall, a gap being provided between the second end and the rear wall. The additional coupling amount adjusting pattern determines a pre-adjusted maximum coupling amount larger than a coupling amount of the plurality of coupling amount adjusting patterns which are connected to the front and rear walls.
摘要翻译：介质滤波器包括由均匀的单个电介质材料形成并具有形成在前壁，后壁和侧壁以及其外底表面上的导电金属化图案的单一介质块。每个包括开口端和中心导体的多个同轴介质谐振器沿着块的顶表面的中心纵向布置并且间隔开预定距离。频率调整图案形成在块的顶表面上，每个频率调整图案围绕相应的谐振器的开口端延伸。耦合量调节图案也设置在块的顶表面上，每个连接到前壁和后壁并且设置在相邻的频率调整图案之间。至少一个附加的耦合量调节图案设置在块的顶表面上。额外的联接量调节图案具有机械地连接到前壁的第一端和与后壁电容耦合的第二端，在第二端和后壁之间设置间隙。附加耦合量调整图案确定大于连接到前壁和后壁的多个耦合量调节图案的耦合量的预调节最大耦合量。

3. 发明授权

US4882026A Dielectric block plating apparatus 失效
标题翻译：电介质电镀装置
公开(公告)号：US4882026A
公开(公告)日：1989-11-21
申请号：US189165
申请日：1988-05-02
申请人： Osamu Yamato , Tetsuji Takino
发明人： Osamu Yamato , Tetsuji Takino
IPC分类号： C25D5/02 , C25D5/08 , C25D7/04 , H01G13/00 , H01P1/205 , H01P11/00 , H05K3/00
CPC分类号： C25D7/04 , C25D5/02 , C25D5/08 , H01P1/205 , H01P11/007 , H05K3/0088
摘要： A dielectric block plating apparatus provides electrolytic solution to be circulated through a plating tank in a substantially uniform flow through practically the entire interior of the plating tank to form conductive layers over predetermined areas of ground conductive layers formed on surfaces of a dielectric block having through holes extending from the top surface to the bottom surface thereof. The dielectric block is immersed and held in the electrolytic solution contained in the plating tank so that the respective center axes of the through holes of the dielectric block extend parallel to the direction of flow of the electrolytic solution.

4. 发明授权

US4808951A Dielectric filter 失效
标题翻译：介质过滤器
公开(公告)号：US4808951A
公开(公告)日：1989-02-28
申请号：US48633
申请日：1987-05-11
申请人： Osamu Yamato , Hiroyuki Horii , Tetuji Takino , Takanori Yamasaki , Yoshimitu Sakurai , Hisao Matsukura , Ichiro Iwase
发明人： Osamu Yamato , Hiroyuki Horii , Tetuji Takino , Takanori Yamasaki , Yoshimitu Sakurai , Hisao Matsukura , Ichiro Iwase
IPC分类号： H01P1/205 , H01P7/04 , H01P1/20
CPC分类号： H01P1/2056
摘要： A dielectric filter of which a characteristic is stable without a gastight casing. The dielectric filter's structure is comprised of an input, an output, a dielectric having a plurality of holes extending from a top to a bottom surface thereof, each of the holes being covered with a first conductive material, a second conductive material being electrically connected to the first conductive material at the bottom surface and unconnected to the first conductive material at the top surface, and an insulating weatherproof coating provided on the top surface.
摘要翻译：介质滤波器，其特征在没有气密性外壳的情况下是稳定的。介质滤波器的结构包括一个输入端，一个输出端，一个具有从顶部到底面延伸的多个孔的电介质，每个孔被第一导电材料覆盖，第二导电材料电连接到第一导电材料在底表面处并且不与顶表面处的第一导电材料连接，以及设置在顶表面上的绝缘耐候性涂层。

5. 发明授权

US4877493A Dielectric block plating process 失效
标题翻译：电介质电镀工艺
公开(公告)号：US4877493A
公开(公告)日：1989-10-31
申请号：US258856
申请日：1988-10-17
申请人： Osamu Yamato , Tetsuji Takino
发明人： Osamu Yamato , Tetsuji Takino
IPC分类号： C25D5/02 , C25D5/08 , C25D7/04 , H01G13/00 , H01P1/205 , H01P11/00 , H05K3/00
CPC分类号： C25D7/04 , C25D5/02 , C25D5/08 , H01P1/205 , H01P11/007 , H05K3/0088
摘要： In a dielectric block plating process an electrolytic solution is circulated through a plating tank in a substantially uniform flow through practically the entire interior of the plating tank to form conductive layers over predetermined arears of ground conductive layers formed on surfaces of a dielectric block having through holes extending from the top surface to the bottom surface thereof. The dielectric block is immersed and held in the electrolytic solution contained in the plating tank so that the respective center axes of the through holes of the dielectric block extend parallel to the direction of flow of the electrolytic solution.

6. 发明申请

US20130105985A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20130105985A1
公开(公告)日：2013-05-02
申请号：US13646074
申请日：2012-10-05
申请人： Junji TSURUOKA , Seiji YASUI , Osamu YAMATO , Takayuki MAEDA
发明人： Junji TSURUOKA , Seiji YASUI , Osamu YAMATO , Takayuki MAEDA
IPC分类号： H01L23/48
CPC分类号： B23K1/0016 , H01L23/36 , H01L23/492 , H01L24/37 , H01L24/40 , H01L25/072 , H01L2224/29101 , H01L2224/32245 , H01L2224/33181 , H01L2224/37011 , H01L2224/40095 , H01L2224/40101 , H01L2224/40139 , H01L2224/40151 , H01L2224/73263 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/15787 , H01L2924/014 , H01L2924/00 , H01L2224/37099
摘要： A semiconductor device includes a connection terminal. The connection terminal includes two legs bonded via a filler material to a bonding target object that is a substrate or one semiconductor element placed on the substrate; and a joining portion connected to the two legs, extending between the two legs, and separated from the bonding target object.
摘要翻译：半导体器件包括连接端子。连接端子包括通过填充材料连接到作为衬底的结合目标物体的两个腿或放置在衬底上的一个半导体元件; 以及连接到两个腿的连接部分，在两个腿之间延伸并且与结合目标物体分离。

7. 发明授权

US06302706B1 Electronic component 有权
标题翻译：电子元器件
公开(公告)号：US06302706B1
公开(公告)日：2001-10-16
申请号：US09475213
申请日：1999-12-29
申请人： Kouji Aokie , Naotaka Murakami , Hiroki Takata , Osamu Yamato , Katsuhiko Onoda
发明人： Kouji Aokie , Naotaka Murakami , Hiroki Takata , Osamu Yamato , Katsuhiko Onoda
IPC分类号： H01R1200
CPC分类号： H01R13/405 , H01L2224/05554 , H01L2224/45124 , H01L2224/48472 , H01L2224/49175 , H01R13/6658 , H01L2924/00
摘要： In order to precisely detect positions of respective lead portions of an electronic component and to reduce the cost of production of the electronic component, the electronic component has a resinous pad portion and a plurality of terminal units embedded in the pad portion. Each of the terminal units is provided with lead portions that are disposed parallel to one another with their terminal faces exposed, and junction portions for junction between bonding wires and the lead portions are formed on the terminal faces. Corner portions are formed at predetermined sections on the terminal faces. In this case, even if resin of the pad portion has adhered to the peripheries of the terminal faces and fouled the terminal faces, since the lead portions have the corner portions, images of the lead portions can be detected precisely. Accordingly, the operation of connecting the bonding wires to the terminal faces is performed more efficiently, whereby the cost of production of the electronic component can be reduced.
摘要翻译：为了精确地检测电子部件的各个引线部的位置，并且为了降低电子部件的制造成本，电子部件具有嵌入焊盘部的树脂焊盘部和多个端子部。每个端子单元设置有彼此平行布置的引线部分，其端子面暴露，并且在端子面上形成用于接合线和引线部分之间的接合部的接合部分。拐角部分形成在终端面上的预定部分。在这种情况下，即使焊盘部分的树脂粘附到端子表面的周边并且使端子端部被污染，由于引线部分具有拐角部分，因此可以精确地检测引线部分的图像。因此，更有效地进行将接合线连接到端子面的动作，能够降低电子部件的制造成本。

8. 发明申请

US20130113120A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件的半导体器件和制造方法
公开(公告)号：US20130113120A1
公开(公告)日：2013-05-09
申请号：US13646151
申请日：2012-10-05
申请人： Junji TSURUOKA , Seiji YASUI , Osamu YAMATO , Takayuki MAEDA
发明人： Junji TSURUOKA , Seiji YASUI , Osamu YAMATO , Takayuki MAEDA
IPC分类号： H01L23/52 , H01L21/58
CPC分类号： H01L24/40 , H01L23/24 , H01L23/3107 , H01L23/36 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/072 , H01L2224/32245 , H01L2224/40095 , H01L2224/40137 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01029 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A semiconductor device includes a metal substrate; a semiconductor element placed on the metal substrate; a flexible circuit substrate that has one end placed on the metal substrate and is electrically connected to the semiconductor element, the flexible circuit substrate extending over an edge of the metal substrate to outside the metal substrate; a resin wall portion placed, in an outer periphery of the metal substrate, at least at the edge of the metal substrate over which the flexible circuit substrate extends, the resin wall portion being provided on the flexible circuit substrate at the edge; and a resin seal portion provided inside the resin wall portion so as to cover the metal substrate.
摘要翻译：半导体器件包括金属基板; 放置在金属基板上的半导体元件; 柔性电路基板，其一端放置在所述金属基板上，并且电连接到所述半导体元件，所述柔性电路基板在所述金属基板的边缘上延伸到所述金属基板的外部; 在所述金属基板的外周至少在所述柔性电路基板所延伸的所述金属基板的边缘处设置树脂壁部，所述树脂壁部设置在所述柔性电路基板的所述边缘处; 以及设置在树脂壁部内部以覆盖金属基板的树脂密封部。

9. 发明授权

US06195263B1 Electronic control unit 有权
标题翻译：电子控制单元
公开(公告)号：US06195263B1
公开(公告)日：2001-02-27
申请号：US09271167
申请日：1999-03-18
申请人： Koji Aoike , Naotaka Murakami , Hiroki Takata , Osamu Yamato
发明人： Koji Aoike , Naotaka Murakami , Hiroki Takata , Osamu Yamato
IPC分类号： H05K700
CPC分类号： H05K5/0069 , H01L2224/06153 , H01L2224/45124 , H01L2224/48091 , H01L2224/48472 , H01L2224/4943 , H01L2924/01068 , H01R12/57 , Y10S439/949 , Y10T29/49172 , H01L2924/00014 , H01L2924/00
摘要： In an electronic control unit, a pad portion thereof is firmly fixed to a terminal plate and vibration of the terminal plate under supersonic vibration is prevented so as to secure the bonding strength between the terminal plate and the wire during wire bonding. One lead portion of each terminal plate is connected to a pin of the connector and another lead portion is wire bonded to the terminal of the circuit substrate. The leads have bent portions extending from an exposed surface to be bonded in opposite directions to be embedded in the pad portion of the case such that the lead portion of the terminal plate is firmly fixed to the case.
摘要翻译：在电子控制单元中，其焊盘部牢固地固定在端子板上，防止了超音速振动下端子板的振动，从而确保了引线接合时端子板与导线之间的接合强度。每个端子板的一个引线部分连接到连接器的引脚，另一个引线部分引线接合到电路基板的端子。引线具有从暴露表面延伸的弯曲部分，以相对方向接合以嵌入壳体的焊盘部分，使得端子板的引线部分牢固地固定在壳体上。

10. 发明授权

US5287355A Module comprising in an ATM exchange connection ports, each transmitting a cell indicative of a destination module in a cell header 失效
标题翻译：模块包括在ATM交换连接端口中，每个端口在小区头部中发送指示目的地模块的小区
公开(公告)号：US5287355A
公开(公告)日：1994-02-15
申请号：US910587
申请日：1992-07-08
申请人： Kiyoh Takahashi , Hiroshi Shimizu , Yoshihiko Itou , Osamu Yamato
发明人： Kiyoh Takahashi , Hiroshi Shimizu , Yoshihiko Itou , Osamu Yamato
IPC分类号： H04Q3/52 , H04L12/801 , H04L12/911 , H04L12/947 , H04Q11/04 , H04L12/40
CPC分类号： H04L12/5601 , H04L49/1553 , H04L49/255 , H04L2012/5652
摘要： In a local module (11(1)) of an asynchronous time division exchange or switching system, each of connection ports (17) transfers a transmission signal to a module bus (19) as a cell with its header made to indicate a destination module number and a destination port number as a VCI (Virtual channel identifier) when the signal is directed to a destination module (11(N)) and one of the connection ports, respectively. Preferably, a connection control unit (15) of the local module transfers and does not transfer the cell to a highway bus (13) when the signal is directed to the destination module and the last-mentioned one of the connection ports. More preferably, the header additionally indicates a binary one and zero bit when the signal is directed to the destination module and the last-mentioned one of the connection ports.
摘要翻译：在异步时分交换或交换系统的本地模块（11（1））中，每个连接端口（17）将发送信号作为小区传输到模块总线（19），其小区用于指示目的地模块数字和目的地端口号作为VCI（虚拟信道标识符），当该信号被分配到目的地模块（11（N））和一个连接端口时。优选地，当信号被引导到目的地模块和最后提到的一个连接端口时，本地模块的连接控制单元（15）传送并且不将小区传送到公路总线（13）。更优选地，当信号被引导到目的地模块和最后提到的一个连接端口时，头部还附加地指示二进制1和零比特。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式