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1. 发明申请

US20120227665A1 APPARATUS FOR MONITORING AND CONTROLLING SUBSTRATE TEMPERATURE 审中-公开
标题翻译：用于监测和控制基板温度的装置
公开(公告)号：US20120227665A1
公开(公告)日：2012-09-13
申请号：US13406058
申请日：2012-02-27
申请人： OMER OZGUN , Didier P. Florin , Donald J.K. Olgado
发明人： OMER OZGUN , Didier P. Florin , Donald J.K. Olgado
IPC分类号： B05C11/00 , H05B3/68
CPC分类号： C23C16/45565 , C23C16/4411 , C23C16/45572 , C23C16/4584 , C23C16/481 , C23C16/52
摘要： A system and methods for heating substrates during high temperature processing is provided. The system uses multiple temperature inputs of the backside of a substrate carrier and known parameters within the processing chamber to estimate the temperature of substrates being processed on the substrate carrier. Temperature readings of the substrate carrier taken from above the processing volume may be used to correct any drift that may occur with respect to temperature readings taken from below the substrate carrier. Temperature readings of heat exchanging fluid flowing through a showerhead assembly may be used to estimate the temperature of the surface of the showerhead, which may be used in the estimation of the temperature of the substrates being processed. The system then uses the estimated temperature to control the amount of power supplied to a plurality of heat sources configured to heat the substrates from below the substrate carrier.
摘要翻译：提供了一种在高温处理过程中加热基板的系统和方法。该系统使用衬底载体的背侧的多个温度输入和处理室内的已知参数来估计在衬底载体上正在处理的衬底的温度。可以使用从处理体积以上获取的衬底载体的温度读数来校正可能发生的相对于从衬底载体下方读取的温度读数的漂移。可以使用流过喷头组件的热交换流体的温度读数来估计喷头表面的温度，这可以用于估计待处理的基底的温度。然后，系统使用估计的温度来控制供应给配置为从衬底载体下方加热衬底的多个热源的功率量。

2. 发明申请

US20080146121A1 PLATEN ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL PROCESSING 审中-公开
标题翻译：电化学机械加工用板组件
公开(公告)号：US20080146121A1
公开(公告)日：2008-06-19
申请号：US11957798
申请日：2007-12-17
申请人： Omer Ozgun , Alpay Yilmaz , Antoine P. Manens , Lakshmanan Karuppiah
发明人： Omer Ozgun , Alpay Yilmaz , Antoine P. Manens , Lakshmanan Karuppiah
IPC分类号： B24B7/04 , B24B1/00 , B23H5/08
CPC分类号： B24B37/16 , B23H5/08
摘要： A processing pad and platen assembly for processing a substrate is provided. The platen assembly includes a spacer having an upper surface adapted to contact a lower surface of a pad assembly, an upper plate having a recessed area coupled to and disposed below the spacer, and a lower plate coupled to and disposed below the upper plate. The pad assembly includes at least a processing layer having a working surface adapted to process a substrate and an electrode disposed below the working surface of the processing layer. The spacer and the pad assembly have apertures therethrough to provide an electrolyte pathway to the platen assembly for removal of residual materials and other byproducts.
摘要翻译：提供了一种用于处理基板的处理垫和压板组件。压板组件包括具有适于接触焊盘组件的下表面的上表面的间隔件，具有联接到并设置在间隔件下方的凹陷区域的上板和联接到并设置在上板下方的下板。衬垫组件至少包括具有适于处理衬底的工作表面和设置在处理层的工作表面下方的电极的处理层。间隔件和衬垫组件具有穿过其中的孔，以提供到压板组件的电解质通路，用于去除残余材料和其它副产物。

3. 发明申请

US20080014845A1 CONDITIONING DISK HAVING UNIFORM STRUCTURES 审中-公开
标题翻译：具有均匀结构的调节盘
公开(公告)号：US20080014845A1
公开(公告)日：2008-01-17
申请号：US11775533
申请日：2007-07-10
申请人： Alpay Yilmaz , Omer Ozgun , Gerald Alonzo , Lakshmanan Karuppiah , Shou-Sung Chang , Antoine P. Manens , Clinton Sakata
发明人： Alpay Yilmaz , Omer Ozgun , Gerald Alonzo , Lakshmanan Karuppiah , Shou-Sung Chang , Antoine P. Manens , Clinton Sakata
IPC分类号： B24B21/18
CPC分类号： B24B53/017
摘要： A method and apparatus for conditioning a conductive polishing material is described. In one embodiment, the pad dresser comprises a backing plate adapted to coupled to a conditioning head assembly, the backing plate comprising a rigid disk having a first side and an opposing second side, the second side having a perpendicular orientation to a centerline of the backing plate, and an annular member having a base portion adhered to the second side of the backing plate, wherein the annular member defines a conditioning surface opposite the second side that is radially sloped relative to a plane of the second side.
摘要翻译：描述了用于调理导电抛光材料的方法和装置。在一个实施例中，垫修整器包括适于联接到调节头组件的背板，所述背板包括具有第一侧和相对的第二侧的刚性盘，所述第二侧具有与所述背衬的中心线垂直的取向板和环形构件，其具有粘附到背板的第二侧的基部，其中环形构件限定相对于第二侧的平面径向倾斜的第二侧相对的调节表面。

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