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    • 5. 发明申请
    • SINGLE CRYSTAL PRODUCTION APPARATUS AND PROCESS
    • 单晶生产设备和工艺
    • WO1997021853A1
    • 1997-06-19
    • PCT/JP1995002514
    • 1995-12-08
    • SHIN-ETSU HANDOTAI CO., LTD.OHTA, TomohikoSONOKAWA, SusumuSOETA, SatoshiKODAMA, Yoshihiro
    • SHIN-ETSU HANDOTAI CO., LTD.
    • C30B15/00
    • C30B29/40C30B15/14C30B15/206C30B29/06Y10T117/1064Y10T117/1068Y10T117/1072Y10T117/1088
    • An apparatus and process for producing single crystals according to the Czochralski method for pulling up crystals, wherein the production efficiency and qualities of the crystals can be improved by freely controlling the temperature distribution and heat history of the crystals to be pulled up. The invention relates to a production apparatus according to the Czochralski method provided with a cylinder (19) that is airtightly joined to the ceiling of a lift chamber at the upper end thereof and is closed up to the surface of a melt in a crucible at the lower end thereof and that surrounds coaxially the pulled single crystal bar, and is characterized in that the lower end of the cylinder is provided with a heat-barrier body (25) occupying 30-95 vol.% of the space that is enclosed by the crystal surface, the inner wall of a quartz crucible and the surface of a melt and has a height corresponding to the radius of the crystal to be pulled up from the melt; a process for producing single crystals with the use of the above apparatus; a method of controlling the temperature distribution and heat history of the crystals thus pulled up; and single crystals thus produced. As the apparatus is provided with a heat-barrier body (25) having a sufficient barrier effect, it does not cause any lowering in the velocity of pulling even when the diameter of the pulled single crystal is increased, can uniform the temperature at the whole solid-liquid boundary, does not lower the convention into singl crystals, and can control readily and accurately the temperature distribution and heat history of the crystals to be pulled up.
    • 用于提取晶体的根据Czochralski法制造单晶的装置和方法,其中可以通过自由地控制要拉起的晶体的温度分布和热历史来提高晶体的生产效率和质量。 本发明涉及一种根据切克劳斯基法的生产设备,其具有气缸(19),该气缸(19)在其上端处气密地接合到提升室的天花板上,并在坩埚内的熔体表面封闭 其下端并且同轴地围绕拉出的单晶棒,并且其特征在于,圆筒的下端设置有占据30-95体积%的空间的隔热体(25),该隔热体 晶体表面,石英坩埚的内壁和熔体的表面,并且具有与从熔体拉起的晶体的半径相对应的高度; 使用上述装置制造单晶的方法; 控制由此提升的晶体的温度分布和热历史的方法; 和由此产生的单晶。 由于该装置设置有具有足够的阻挡效果的隔热体(25),所以即使拉伸的单晶的直径增加也不会引起拉伸速度的任何降低,整体温度可以均匀 固液边界,不能将惯例降低为单晶,并且可以容易地和准确地控制要拉起的晶体的温度分布和热历史。
    • 7. 发明授权
    • Fused silica glass crucible
    • 熔融石英玻璃坩埚
    • US5730800A
    • 1998-03-24
    • US768282
    • 1996-12-17
    • Wataru SatoMasahiro SakuradaOhta TomohikoKatsuhiko Kemmochi
    • Wataru SatoMasahiro SakuradaOhta TomohikoKatsuhiko Kemmochi
    • C03C3/06C30B15/00C30B15/10C30B35/00
    • C30B29/06C03C3/06C30B15/10C30B35/002C03C2201/30C03C2201/32
    • An improved method is proposed for the preparation of a semiconductor silicon single crystal of N-type by the Czochralski process, which is free from the problem of occurrence of delayed OSFs as defects in the single crystal even after prolonged storage at room temperature based on the discovery that presence of a certain amount of aluminum in the melt of silicon contained in a fused silica glass crucible acts to suppress occurrence of delayed OSFs as a type of defects in the single crystal while copper as an impurity acts adversely in this regard. With a known fact that an about 30 .mu.m thick inner surface layer of the crucible is melted down into the silicon melt during the single crystal pulling-up process, namely, the invention proposes use of a crucible of which the inner surface layer of 30 .mu.m thickness contains aluminum in an average concentration of 40 to 500 ppm by weight while the content of copper is as low as possible not to exceed 0.5 ppb by weight. Alternatively, when the fused silica glass crucible is deficient in the content of aluminum, an amount of aluminum is introduced as a dopant into the melt of silicon in the crucible to supplement the content of aluminum in order to be sufficient to suppress delayed OSFs.
    • 提出了一种通过Czochralski工艺制备N型半导体硅单晶的改进方法,其即使在室温下长时间储存​​之后也不会出现延迟OSF作为单晶的缺陷的问题,基于 发现在熔融石英玻璃坩埚中含有的硅熔体中存在一定量的铝作为抑制作为单晶中的缺陷的延迟OSF的发生,而作为杂质的铜在这方面起不利影响。 在已知的事实中,在单晶提拉过程中坩埚的内表面层约30μm的内表面层熔化成硅熔体,即本发明提出使用内表面层为30的坩埚 平均浓度为40〜500ppm的铝,而铜的含量尽可能低,不超过0.5ppb(重量)。 或者,当熔融石英玻璃坩埚的铝含量不足时,将铝的量作为掺杂剂引入到坩埚中的硅熔体中,以补充铝的含量,以足以抑制延迟的OSF。
    • 8. 发明授权
    • Method for the preparation of silicon single crystal
    • 硅单晶的制备方法
    • US5609682A
    • 1997-03-11
    • US498894
    • 1995-07-06
    • Wataru SatoMasahiro SakuradaOhta TomohikoKatsuhiko Kemmochi
    • Wataru SatoMasahiro SakuradaOhta TomohikoKatsuhiko Kemmochi
    • C03C3/06C30B15/00C30B15/10C30B35/00
    • C30B29/06C03C3/06C30B15/10C30B35/002C03C2201/30C03C2201/32
    • An improved method is proposed for the preparation of a semiconductor silicon single crystal of N-type by the Czochralski process, which is free from the problem of occurrence of delayed OSFs as defects in the single crystal even after prolonged storage at room temperature based on the discovery that presence of a certain amount of aluminum in the melt of silicon contained in a fused silica glass crucible acts to suppress occurrence of delayed OSFs as a type of defects in the single crystal while copper as an impurity acts adversely in this regard. With a known fact that an about 30 .mu.m thick inner surface layer of the crucible is melted down into the silicon melt during the single crystal pulling-up process, namely, the invention proposes use of a crucible of which the inner surface layer of 30 .mu.m thickness contains aluminum in an average concentration of 40 to 500 ppm by weight while the content of copper is as low as possible not to exceed 0.5 ppb by weight. Alternatively, when the fused silica glass crucible is deficient in the content of aluminum, an amount of aluminum is introduced as a dopant into the melt of silicon in the crucible to supplement the content of aluminum in order to be sufficient to suppress delayed OSFs.
    • 提出了一种通过Czochralski工艺制备N型半导体硅单晶的改进方法,其即使在室温下长时间储存​​之后也不会出现延迟OSF作为单晶的缺陷的问题,基于 发现在熔融石英玻璃坩埚中含有的硅熔体中存在一定量的铝作为抑制作为单晶中的缺陷的延迟OSF的发生,而作为杂质的铜在这方面起不利影响。 在已知的事实中,在单晶提拉过程中坩埚的内表面层约30μm的内表面层熔化成硅熔体,即本发明提出使用内表面层为30的坩埚 平均浓度为40〜500ppm的铝,而铜的含量尽可能低,不超过0.5ppb(重量)。 或者,当熔融石英玻璃坩埚的铝含量不足时,将铝的量作为掺杂剂引入到坩埚中的硅熔体中,以补充铝的含量,以足以抑制延迟的OSF。