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    • 1. 发明授权
    • Fused silica glass crucible
    • 熔融石英玻璃坩埚
    • US5730800A
    • 1998-03-24
    • US768282
    • 1996-12-17
    • Wataru SatoMasahiro SakuradaOhta TomohikoKatsuhiko Kemmochi
    • Wataru SatoMasahiro SakuradaOhta TomohikoKatsuhiko Kemmochi
    • C03C3/06C30B15/00C30B15/10C30B35/00
    • C30B29/06C03C3/06C30B15/10C30B35/002C03C2201/30C03C2201/32
    • An improved method is proposed for the preparation of a semiconductor silicon single crystal of N-type by the Czochralski process, which is free from the problem of occurrence of delayed OSFs as defects in the single crystal even after prolonged storage at room temperature based on the discovery that presence of a certain amount of aluminum in the melt of silicon contained in a fused silica glass crucible acts to suppress occurrence of delayed OSFs as a type of defects in the single crystal while copper as an impurity acts adversely in this regard. With a known fact that an about 30 .mu.m thick inner surface layer of the crucible is melted down into the silicon melt during the single crystal pulling-up process, namely, the invention proposes use of a crucible of which the inner surface layer of 30 .mu.m thickness contains aluminum in an average concentration of 40 to 500 ppm by weight while the content of copper is as low as possible not to exceed 0.5 ppb by weight. Alternatively, when the fused silica glass crucible is deficient in the content of aluminum, an amount of aluminum is introduced as a dopant into the melt of silicon in the crucible to supplement the content of aluminum in order to be sufficient to suppress delayed OSFs.
    • 提出了一种通过Czochralski工艺制备N型半导体硅单晶的改进方法,其即使在室温下长时间储存​​之后也不会出现延迟OSF作为单晶的缺陷的问题,基于 发现在熔融石英玻璃坩埚中含有的硅熔体中存在一定量的铝作为抑制作为单晶中的缺陷的延迟OSF的发生,而作为杂质的铜在这方面起不利影响。 在已知的事实中,在单晶提拉过程中坩埚的内表面层约30μm的内表面层熔化成硅熔体,即本发明提出使用内表面层为30的坩埚 平均浓度为40〜500ppm的铝,而铜的含量尽可能低,不超过0.5ppb(重量)。 或者,当熔融石英玻璃坩埚的铝含量不足时,将铝的量作为掺杂剂引入到坩埚中的硅熔体中,以补充铝的含量,以足以抑制延迟的OSF。
    • 2. 发明授权
    • Method for the preparation of silicon single crystal
    • 硅单晶的制备方法
    • US5609682A
    • 1997-03-11
    • US498894
    • 1995-07-06
    • Wataru SatoMasahiro SakuradaOhta TomohikoKatsuhiko Kemmochi
    • Wataru SatoMasahiro SakuradaOhta TomohikoKatsuhiko Kemmochi
    • C03C3/06C30B15/00C30B15/10C30B35/00
    • C30B29/06C03C3/06C30B15/10C30B35/002C03C2201/30C03C2201/32
    • An improved method is proposed for the preparation of a semiconductor silicon single crystal of N-type by the Czochralski process, which is free from the problem of occurrence of delayed OSFs as defects in the single crystal even after prolonged storage at room temperature based on the discovery that presence of a certain amount of aluminum in the melt of silicon contained in a fused silica glass crucible acts to suppress occurrence of delayed OSFs as a type of defects in the single crystal while copper as an impurity acts adversely in this regard. With a known fact that an about 30 .mu.m thick inner surface layer of the crucible is melted down into the silicon melt during the single crystal pulling-up process, namely, the invention proposes use of a crucible of which the inner surface layer of 30 .mu.m thickness contains aluminum in an average concentration of 40 to 500 ppm by weight while the content of copper is as low as possible not to exceed 0.5 ppb by weight. Alternatively, when the fused silica glass crucible is deficient in the content of aluminum, an amount of aluminum is introduced as a dopant into the melt of silicon in the crucible to supplement the content of aluminum in order to be sufficient to suppress delayed OSFs.
    • 提出了一种通过Czochralski工艺制备N型半导体硅单晶的改进方法,其即使在室温下长时间储存​​之后也不会出现延迟OSF作为单晶的缺陷的问题,基于 发现在熔融石英玻璃坩埚中含有的硅熔体中存在一定量的铝作为抑制作为单晶中的缺陷的延迟OSF的发生,而作为杂质的铜在这方面起不利影响。 在已知的事实中,在单晶提拉过程中坩埚的内表面层约30μm的内表面层熔化成硅熔体,即本发明提出使用内表面层为30的坩埚 平均浓度为40〜500ppm的铝,而铜的含量尽可能低,不超过0.5ppb(重量)。 或者,当熔融石英玻璃坩埚的铝含量不足时,将铝的量作为掺杂剂引入到坩埚中的硅熔体中,以补充铝的含量,以足以抑制延迟的OSF。
    • 3. 发明授权
    • Apparatus and method for the uniform distribution of crystal defects
upon a silicon single crystal
    • 在硅单晶上均匀分布晶体缺陷的装置和方法
    • US5704973A
    • 1998-01-06
    • US666654
    • 1996-06-18
    • Masahiro SakuradaWataru SatoTomohiko Ohta
    • Masahiro SakuradaWataru SatoTomohiko Ohta
    • C30B15/00C30B15/20C30B29/06C30B33/02H01L21/208
    • C30B29/06C30B15/00Y10T117/1032
    • Proposed is an improvement in the method and single crystal growing chamber for the preparation of a single crystal rod of silicon by the Czochralski method, according to which the distance between the surface of the melt of silicon contained in a crucible and the lower surface of the top wall of the crystal growing chamber is equal to or larger than the diameter of the crucible and the heat-insulating cylinder surrounding the crucible containing the melt of silicon and the heater has such a height as to reach the lower surface of the top wall of the chamber so as to keep the single crystal rod under growing is kept at a temperature not lower than 700.degree. C. until reaching the lower surface of the top wall of the chamber thereby decreasing the density of the crystal defects of BMD type in the seed end of the single crystal rod as grown so that the uniformity in the distribution of BMD density is increased throughout the single crystal rod.
    • 提出了通过切克劳斯基法(Czochralski method)制备单晶硅的方法和单晶生长室的改进,根据该方法,坩埚中包含的硅熔体表面与坩埚的下表面之间的距离 晶体生长室的顶壁等于或大于坩埚的直径,并且包含硅和加热器的熔体的坩埚周围的隔热圆筒具有如下高度:到达顶壁的下表面 保持单晶棒生长的室保持在不低于700℃的温度,直到到达室的顶壁的下表面,从而降低种子中BMD型晶体缺陷的密度 生长的单晶棒的端部,使得在整个单晶棒中BMD密度分布的均匀性增加。
    • 7. 发明申请
    • AIR HEAT EXCHANGER
    • 空气热交换器
    • US20150211781A1
    • 2015-07-30
    • US14405408
    • 2012-06-07
    • Wataru SatoShigeyuki Sasaki
    • Wataru SatoShigeyuki Sasaki
    • F25D21/14
    • F25D21/14F25B39/02F28D1/05383F28D2021/0071F28F1/128F28F1/325F28F17/005
    • Provided is an air heat exchanger capable of preventing an increase in ventilation resistance and a decrease in heat exchange efficiency due to condensation water generated on surfaces of heat transfer fins, without increasing thermal resistance of flat tubes and the heat transfer fins, and preventing scattering of water droplets downwind from the heat transfer fins. In the air heat exchanger including a plurality of flat tubes 2 and heat transfer fins 5 provided between the flat tubes 2 and on which air is blown, the flat tubes 2 include water draining grooves 4 on side surfaces on which the heat transfer fins 5 are provided and the heat transfer fins 5 include water guiding grooves 6 communicating with the water draining grooves 4. At least a groove wall 40 on the upwind side of an air blowing direction 10 among groove walls forming the water guiding grooves 6 is provided from a position of the upwind side from the water draining grooves 4 to the water draining grooves 4. The water guiding grooves 6 extend toward the water draining grooves 4 along the groove wall 40 on the upwind side and an area of a cross section perpendicular to an extension direction decreases toward the water draining grooves 4.
    • 提供一种空气热交换器,其能够防止由于传热翅片表面产生的冷凝水导致的通风阻力增加和热交换效率降低,而不增加扁平管和传热翅片的热阻,并且防止散热 水滴从传热翅片向下风向。 在包括设置在扁平管2之间的多个扁平管2和传热翅片5的空气热交换器中,扁平管2包括在其上具有传热翅片5的侧表面上的排水槽4 传热翅片5包括与排水槽4连通的导水槽6.至少在形成导水槽6的槽壁中的吹风方向10的上风侧的槽壁40从位置 从排水沟4向排水槽4的上风侧。导水槽6沿着上下风向侧的槽壁40向排水槽4延伸,与延伸方向垂直的截面的区域 朝向排水槽4减少。