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1. 发明申请

WO2009132181A3 LOW PROFILE PROCESS KIT 审中-公开
标题翻译：低配置工艺包
公开(公告)号：WO2009132181A3
公开(公告)日：2010-02-18
申请号：PCT/US2009041528
申请日：2009-04-23
申请人： APPLIED MATERIALS INC , RASHEED MUHAMMAD M , IWASHITA TERUKI , OTAKE HIROSHI , KOGA YUKI , MAEHARA KAZUTOSHI , CHEN XINGLONG , GONDHALEKAR SUDHIR , LUBOMIRSKY DMITRY
发明人： RASHEED MUHAMMAD M , IWASHITA TERUKI , OTAKE HIROSHI , KOGA YUKI , MAEHARA KAZUTOSHI , CHEN XINGLONG , GONDHALEKAR SUDHIR , LUBOMIRSKY DMITRY
IPC分类号： H01L21/683 , H01L21/687
CPC分类号： C23C16/4585 , C23C16/4581 , H01J37/32082 , H01J37/32642 , H01L21/68735
摘要： Embodiments of process kits for substrate supports of semiconductor substrate process chambers are provided herein. In some embodiments, a process kit for a semiconductor process chamber may include an annular body being substantially horizontal and having an inner and an outer edge, and an upper and a lower surface; an inner lip disposed proximate the inner edge and extending vertically from the upper surface; and an outer lip disposed proximate the outer edge and on the lower surface, and having a shape conforming to a surface of the substrate support pedestal. In some embodiments, a process kit for a semiconductor process chamber my include an annular body having an inner and an outer edge, and having an upper and lower surface, the upper surface disposed at a downward angle of between about 5-65 degrees in a radially outward direction from the inner edge toward the outer edge.
摘要翻译：本文提供了半导体衬底处理腔的衬底支撑件的工艺组件的实施例。在一些实施例中，用于半导体处理室的处理套件可以包括基本上水平的并具有内部和外部边缘以及上部和下部表面的环形体; 靠近所述内边缘并从所述上表面垂直延伸的内唇缘; 以及设置在所述外边缘和所述下表面附近并且具有与所述基板支撑基座的表面相符的形状的外唇缘。在一些实施例中，用于半导体处理室的处理套件包括具有内边缘和外边缘的环形体，并且具有上表面和下表面，所述上表面以约5-65度的向下角度设置在从内缘朝向外缘的径向向外方向。

2. 发明申请

WO2009132181A2 LOW PROFILE PROCESS KIT 审中-公开
标题翻译：低配置工艺包
公开(公告)号：WO2009132181A2
公开(公告)日：2009-10-29
申请号：PCT/US2009/041528
申请日：2009-04-23
申请人： APPLIED MATERIALS, INC. , RASHEED, Muhammad, M. , IWASHITA, Teruki , OTAKE, Hiroshi , KOGA, Yuki , MAEHARA, Kazutoshi , CHEN, Xinglong , GONDHALEKAR, Sudhir , LUBOMIRSKY, Dmitry
发明人： RASHEED, Muhammad, M. , IWASHITA, Teruki , OTAKE, Hiroshi , KOGA, Yuki , MAEHARA, Kazutoshi , CHEN, Xinglong , GONDHALEKAR, Sudhir , LUBOMIRSKY, Dmitry
IPC分类号： H01L21/683 , H01L21/687
CPC分类号： C23C16/4585 , C23C16/4581 , H01J37/32082 , H01J37/32642 , H01L21/68735
摘要： Embodiments of process kits for substrate supports of semiconductor substrate process chambers are provided herein. In some embodiments, a process kit for a semiconductor process chamber may include an annular body being substantially horizontal and having an inner and an outer edge, and an upper and a lower surface; an inner lip disposed proximate the inner edge and extending vertically from the upper surface; and an outer lip disposed proximate the outer edge and on the lower surface, and having a shape conforming to a surface of the substrate support pedestal. In some embodiments, a process kit for a semiconductor process chamber my include an annular body having an inner and an outer edge, and having an upper and lower surface, the upper surface disposed at a downward angle of between about 5-65 degrees in a radially outward direction from the inner edge toward the outer edge.
摘要翻译：本文提供了半导体衬底处理室的衬底支撑件的工艺组件的实施例。在一些实施例中，用于半导体处理室的处理套件可以包括基本上水平的并具有内部和外部边缘以及上部和下部表面的环形体; 靠近所述内边缘并从所述上表面垂直延伸的内唇缘; 以及设置在所述外边缘和所述下表面附近并且具有与所述基板支撑基座的表面相符的形状的外唇缘。在一些实施例中，用于半导体处理室my的处理套件包括具有内边缘和外边缘的环形体，并且具有上表面和下表面，上表面以约5-65度的向下角度设置在从内缘朝向外缘的径向向外方向。

3. 发明专利

JPH06287545A POLISHING SALT 失效
公开(公告)号：JPH06287545A
公开(公告)日：1994-10-11
申请号：JP12644493
申请日：1993-04-06
申请人： OTAKE HIROSHI
发明人： OTAKE HIROSHI
IPC分类号： C09K3/14
摘要： PURPOSE:To obtain a stable polishing salt with enhanced safety by compounding a decomposed weathered granite with salt. CONSTITUTION:A polishing salt widely usable is obtd. by compounding a decomposed weathered granite with salt in a ratio of (1:9) to (9:1).

4. 发明专利

JP2010274025A Pin folding fastener 审中-公开
标题翻译： PIN折叠紧固件
公开(公告)号：JP2010274025A
公开(公告)日：2010-12-09
申请号：JP2009131814
申请日：2009-06-01
申请人： Otake Hiroshi , 大竹洋
发明人： ISHIKAWA HAJIME , DOBASHI TOKIHIKO
IPC分类号： A44C1/00 , A44C7/00 , A44C25/00
摘要： PROBLEM TO BE SOLVED: To provide a pin folding fastener, applicable to pierced earrings, earrings, a brooch, a pendant and the like.
SOLUTION: The pin folding fastener includes: a pin 1, the base end of which is provided with a shaft laterally projecting at right angles; and a base body 5 welded to an ornament, wherein the shaft is rotatably fitted to the upper part of the base body 5. The base end is a pin angle setting portion constituting two right-angled surfaces A, B to the base body 5, and a chain passing portion 4 is provided in the vicinity of the angle setting portion. A spring 6 and a metal pusher 7 are mounted in the base body 5, and the metal pusher 7 is urged upward by the spring 6, so that the top of the metal pusher 7 resiliently abuts against the angle setting portion. When the pin 1 is turned to bring the metal pusher 7 into contact with the right-angled surface A, the pin 1 is turned down along the base body 5, and when the metal pusher 7 comes into contact with the right-angled surface B, the pin 1 is raised at right angles from the base body 5. The pin 1 is retained in the respective positions by resilient force of the spring.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供适用于穿孔耳环，耳环，胸针，吊坠等的销折叠紧固件。销折叠紧固件包括：销1，其基端设有横向突出的直角的轴; 以及焊接到装饰件的基体5，其中轴可旋转地装配到基体5的上部。基端是构成基体5的两个直角表面A，B的销角设定部，并且在角度设定部附近设置有链条通过部4。弹簧6和金属推动器7安装在基体5中，金属推动器7被弹簧6向上推动，使得金属推动器7的顶部弹性抵靠角度设定部分。当销1转动以使金属推动器7与直角表面A接触时，销1沿着基体5向下转动，并且当金属推动器7与直角表面B接触时销1从基体5成直角地升高。销1通过弹簧的弹力保持在各自的位置上。版权所有（C）2011，JPO＆INPIT

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