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    • 3. 发明申请
    • Semiconductor device and fabrication method thereof
    • 半导体器件及其制造方法
    • US20050067615A1
    • 2005-03-31
    • US10962492
    • 2004-10-13
    • Shigeo YoshiiNobuyuki OtsukaKoichi MizunoAsamira Suzuki
    • Shigeo YoshiiNobuyuki OtsukaKoichi MizunoAsamira Suzuki
    • H01L29/68H01L29/06H01L29/08H01L29/12H01L29/737H01L31/0328
    • B82Y10/00H01L29/0817H01L29/127H01L29/7371
    • The present invention relates to a semiconductor device comprising a substrate (101); a semiconductor multi-layered structure formed on the substrate (101); the semiconductor multi-layered structure comprising an emitter layer (102), a base layer (105), and a collector layer (107), each composed of a group III-V n-type compound semiconductor and layered in this order; a quantum dot barrier layer (103) disposed between the emitter layer (102) and the base layer (105); a collector electrode (110), a base electrode (111) and an emitter electrode (112) connected to the collector layer (107), the base layer (105) and the emitter layer (102), respectively; the quantum dot barrier layer (103) comprising a plurality of quantum dots (103c); the quantum dots (103) being sandwiched between first and second barrier layers (103a, 103d) from the emitter layer side and the base layer side, respectively; each of the quantum dots (103c) having a convex portion that is convex to the base layer (105); a base layer (105) side interface (d1) in the second barrier layer (103d), and collector layer side and emitter layer side interfaces (d2, d3) in the base layer (105); the interfaces having curvatures (d12, d22, d23) that are convex to the collector layer (107) corresponding to the convex portions of the quantum dots (103c).
    • 本发明涉及一种包括衬底(101)的半导体器件; 形成在所述基板(101)上的半导体多层结构; 所述半导体多层结构包括由III-V族N型化合物半导体构成的发射极层(102),基极层(105)和集电极层(107),并且按顺序层叠; 设置在发射极层(102)和基极层(105)之间的量子点势垒层(103); 分别与集电极层(107)连接的集电极(110),基极(111)和发射极(112),基极层(105)和发射极层(102) 所述量子点势垒层(103)包括多个量子点(103c); 量子点(103)分别从发射极侧和基极侧夹在第一和第二阻挡层(103a,103d)之间; 每个量子点(103c)具有与基底层(105)凸起的凸部; 第二阻挡层(103d)中的基底层(105)侧界面(d1),以及基底层(105)中的集电极层侧和发射极层侧界面(d2,d3) 具有对应于量子点(103c)的凸部的与集电体层(107)凸起的曲率(d12,d22,d23)的界面。
    • 8. 发明授权
    • Distributed feedback semiconductor laser and method for fabricating the
same
    • 分布式反馈半导体激光器及其制造方法
    • US5764682A
    • 1998-06-09
    • US606455
    • 1996-02-23
    • Masato IshinoMasahiro KitohNobuyuki OtsukaYasushi Matsui
    • Masato IshinoMasahiro KitohNobuyuki OtsukaYasushi Matsui
    • H01L21/00H01S5/12H01S5/34H01S3/19
    • H01S5/1228B82Y20/00H01S5/2022H01S5/3403H01S5/3428H01S5/3434Y10S148/095
    • A distributed feedback semiconductor laser which includes a semiconductor substrate of a first conductive type; a semiconductor multi-layer structure provided on the semiconductor substrate and including an active layer for generating laser light; and a gain-coupled diffraction grating provided between the semiconductor substrate and the semiconductor multi-layer structure. The diffraction grating includes a plurality of curved projections periodically arranged at a surface of the semiconductor substrate and a quantum well light absorption layer for covering the plurality of curved projections. The quantum well light absorption layer includes a light absorption area having a first thickness at each border between two adjacent curved projections and a non-light absorption area having a second thickness which is smaller than the first thickness at a top of each of the curved projections. The light absorption area has a band gap which is narrower than a band gap of the active layer, and the non-light absorption area has a band gap which is wider than the band gap of the active layer.
    • 一种分布式反馈半导体激光器,包括第一导电类型的半导体衬底; 半导体多层结构,设置在所述半导体基板上并且包括用于产生激光的有源层; 以及设置在半导体衬底和半导体多层结构之间的增益耦合衍射光栅。 衍射光栅包括周期性地布置在半导体衬底的表面上的多个弯曲突起和用于覆盖多个弯曲突起的量子阱光吸收层。 量子阱光吸收层包括在两个相邻弯曲突起之间的每个边界处具有第一厚度的光吸收区域和具有比每个弯曲突起的顶部处的第一厚度小的第二厚度的非光吸收区域 。 光吸收区域具有比有源层的带隙窄的带隙,并且非光吸收区域具有比有源层的带隙宽的带隙。
    • 10. 发明授权
    • Apparatus for prevention of the removal of a universal joint
    • 用于防止万向节拆卸的装置
    • US4196598A
    • 1980-04-08
    • US919749
    • 1978-06-27
    • Seiichi HiraiNobuyuki Otsuka
    • Seiichi HiraiNobuyuki Otsuka
    • F16D3/20F16D3/205F16D3/227F16D3/84F16D3/30
    • F16D3/845F16D3/2055F16D3/227F16D2003/22316
    • The apparatus prevents the unintentional removal of a universal joint of the type where a tubular outer member is provided on an end portion of a shaft. In this structure, plural longitudinal directional sliding grooves are arranged in parallel one with another and an inner member provided on an end portion of another shaft is provided with plural spherical surface members. These may be spherical surface rollers, balls or the like. The respective spherical surface members are in slidable engagement with associated sliding grooves. An open end of the outer member has an annular closure member and is provided with concave portions facing the respective spherical surface members in the sliding grooves. The inner surfaces are formed into spherical surfaces substantially in conformity with the spherical surfaces of the spherical surface members.
    • 该装置防止无意地移除在轴的端部上设置有管状外部构件的类型的万向接头。 在这种结构中,多个纵向方向滑动槽彼此平行地布置,并且设置在另一个轴的端部上的内部构件设置有多个球形构件。 这些可以是球面滚子,球等。 相应的球形表面构件可与相关联的滑动槽滑动接合。 外部构件的开口端具有环形闭合构件,并且在滑动槽中设置有面对各个球形构件的凹部。 内表面形成为与球面部件的球面大致一致的球面。