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    • 4. 发明申请
    • METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC CIRCUIT BOARD
    • 制造电子电路板的方法和装置
    • US20080313893A1
    • 2008-12-25
    • US12136148
    • 2008-06-10
    • Nobuaki Nakasu
    • Nobuaki Nakasu
    • H05K3/00H05K3/36
    • H01L27/12G02F1/136259G02F2001/136254H01L27/124H05K3/225Y10T29/49124Y10T29/49126Y10T29/49128Y10T29/49155Y10T29/49156Y10T29/515Y10T29/53004
    • A method for manufacturing an electronic circuit board which contains an electronic circuit on a main surface of a glass substrate according to the invention sequentially performs a step of electrically inspecting the main surface of the glass substrate on which the electronic circuit is formed, a step of specifying positions and defect types of defects on the main surface of the glass substrate, a step of calculating reference point coordinates on the main surface of the glass substrate and correcting the coordinates, a step of extracting respective defects from an image around the defects and specifying a defect to be corrected in the extracted defects by referring to a defect existing range registered in advance for each defect type, and a step of cutting the specified defect. By this method, a foreign material adhering to the glass substrate is not erroneously judged as short-circuit defect causing short-circuit on the electronic circuit, and only defect actually requiring correction can be removed.
    • 根据本发明的在玻璃基板的主表面上包含电子电路的电子电路板的制造方法依次进行电气检查形成有电子电路的玻璃基板的主面的工序, 指定玻璃基板的主表面上的缺陷的位置和缺陷类型,计算玻璃基板的主表面上的参考点坐标并校正坐标的步骤,从缺陷周围的图像中提取各个缺陷并指定 通过参照针对每种缺陷类型预先登记的缺陷存在范围来提取缺陷中的缺陷,以及切割指定缺陷的步骤。 通过这种方法,附着在玻璃基板上的异物不会被错误地判定为在电子电路上导致短路的短路缺陷,并且仅能够消除实际需要校正的缺陷。
    • 7. 发明申请
    • DEFECT CORRECTING METHOD AND DEFECT CORRECTING DEVICE FOR AN ELECTRONIC CIRCUIT PATTERN
    • 电子电路图的缺陷修正方法和缺陷修正装置
    • US20100302360A1
    • 2010-12-02
    • US12784936
    • 2010-05-21
    • Takeshi AraiNobuaki Nakasu
    • Takeshi AraiNobuaki Nakasu
    • H04N7/18H01L21/66
    • H01L22/20G01N21/9501G01N21/956G01N2021/9513G01R31/309H01L22/12H01L2924/0002H01L2924/00
    • Provided is a defect correcting device for an electronic circuit pattern, which is capable of making a defect seed obvious, and normalizing a pixel or forming a pixel into a semi-black spot. A defect correcting device for an electronic circuit pattern includes: an imaging unit for irradiating a defective portion of the electronic circuit pattern with irradiation light having a wavelength of a visible light region and a wavelength of an infrared light region, and receiving reflected light having the wavelength of the visible light region and the wavelength of the infrared light region from the electronic circuit pattern; a signal processing unit for extracting the defective portion from a picked-up image, and determining a correcting method; a laser irradiating unit for irradiating the defective portion with laser light; and a correction determining unit for determining success or failure of defect correction before and after laser irradiation.
    • 提供一种电子电路图案的缺陷校正装置,其能够使缺陷种子变得明显,并且将像素归一化或形成像素到半黑点。 一种用于电子电路图案的缺陷校正装置,包括:成像单元,用于用具有可见光区域的波长和红外光区域的波长的照射光照射电子电路图案的缺陷部分,并且接收具有 可见光区域的波长和来自电子电路图案的红外光区域的波长; 信号处理单元,用于从拾取图像中提取缺陷部分,并确定校正方法; 激光照射单元,用于用激光照射该缺陷部分; 以及校正确定单元,用于确定在激光照射之前和之后的缺陷校正的成败。