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热词
    • 3. 发明授权
    • Heatsink assembly for a high-power device
    • 用于大功率设备的散热器组件
    • US5771154A
    • 1998-06-23
    • US833018
    • 1997-04-03
    • Mitchell E. GoodmanJohn C. BarronRobert B. Ford
    • Mitchell E. GoodmanJohn C. BarronRobert B. Ford
    • H04R1/00H05K7/20H05H7/20
    • H04R1/00
    • A heatsink assembly (100) provides additional heat dissipation for a high-power integrated circuit package (102) contained within a communication product housing (130). There is an integral heatsink (104) protruding from the package. The heatsink frictionally mates with the first end (108) of a thermally conductive member (106). The second end (110) of the conductive member is magnetically-coupled to the rear surface (123) of a loudspeaker magnet (122). Tabs (111) extending away from the second end of the conductive member provide added mechanical support, preventing the second end from sliding against the rear surface of the magnet. Heat generated by the high-power device is transferred from the package heatsink, via the thermally conductive member, to the loudspeaker magnet such that heat is dissipated away from the package and toward the magnet.
    • 散热器组件(100)为包含在通信产品外壳(130)内的大功率集成电路封装(102)提供额外的散热。 从包装件突出的整体散热器(104)。 散热器与导热构件(106)的第一端(108)摩擦配合。 导电构件的第二端(110)磁耦合到扬声器磁体(122)的后表面(123)。 远离导电构件的第二端延伸的突片111提供附加的机械支撑,防止第二端滑动抵靠磁体的后表面。 由大功率器件产生的热量通过导热部件从封装散热片传递到扬声器磁体,使得热量从封装和磁体中消散。