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    • 3. 发明授权
    • Monolithic circuit fabrication method
    • 单片电路制造方法
    • US5361967A
    • 1994-11-08
    • US149900
    • 1993-11-10
    • Michael J. AndersonHoward D. KnuthWayne D. Pasco
    • Michael J. AndersonHoward D. KnuthWayne D. Pasco
    • C23C14/04H03H3/08H03H9/145H05K3/14H01L21/52
    • H03H3/08C23C14/042H03H9/14538H05K3/143Y10T29/42Y10T29/49171
    • A monolithic circuit, such as a piezoelectric device, semiconductor, or the like, may be fabricated by forming an operational metallization layer (12) on a substrate (10). A subsequent layer (40), such as a sealing ring pattern (42) may then be applied using a thin film deposition technique. A thin film material is applied through a mask assembly (28). The mask assembly (28) includes a mask material (30) that has been applied to a screen (24) and patterned as desired. The mask material (30) extends beyond the screen (24) so that only the mask material contacts the substrate (10) during thin film deposition. Preferably, the screen (24) is woven from individual wires (26) having circular cross-sectional shapes. The subsequent layer (40) is applied both through perforations (18) in the screen (24) and under the screen's wires (26).
    • 可以通过在衬底(10)上形成可操作的金属化层(12)来制造单片电路,例如压电器件,半导体等。 然后可以使用薄膜沉积技术来施加随后的层(40),例如密封环图案(42)。 通过掩模组件(28)施加薄膜材料。 掩模组件(28)包括已经施加到屏幕(24)并根据需要进行图案化的掩模材料(30)。 掩模材料(30)延伸超过筛网(24),使得在薄膜沉积期间仅掩模材料与基底(10)接触。 优选地,屏幕(24)由具有圆形横截面形状的单根线(26)编织。 随后的层(40)通过屏幕(24)中的穿孔(18)并且在屏幕的电线(26)下方施加。
    • 9. 发明授权
    • Noise reduction back cover for computer devices
    • US06198627B1
    • 2001-03-06
    • US09215047
    • 1998-12-17
    • Donald P. RoehlingMichael J. Anderson
    • Donald P. RoehlingMichael J. Anderson
    • G06F170
    • G06F1/181G06F1/20
    • A back cover assembly is provided for use in a device including a housing having a plurality of walls forming an enclosure. A blower mechanism is adapted to cause exhaust air to flow from an interior of the housing to an exterior of the housing. The back cover assembly is located in proximity with the blower mechanism, and includes an acoustical chamber adapted to permit exhaust air from the interior of the housing to pass therethrough. The acoustical chamber is adapted and constructed to reflect acoustical energy back into the blower mechanism. In an embodiment, at least one interior surface of the acoustical chamber is lined with a sound absorbing material such as polyurethane polyester foam. The acoustical chamber can include a front wall with at least one inlet open to blower mechanism, and a rear wall with at least one outlet. The outlet is in fluid communication with the at least one inlet on the front wall, and is open to the exterior of the housing. In order to provide the necessary acoustical reflectivity, the at least one inlet and the at least one outlet can be placed out of axial alignment with one another. For instance, where the at least one inlet is located at a top portion of the front wall, the at least one outlet may be located at a bottom portion of the rear wall. The at least one inlet and outlet can also be located at opposite sides of the chamber. Where there are a plurality of inlets and outlets, the plurality of inlets and outlets may be arranged to form respective inlet/outlet pairs. The acoustical chamber can be provided with at least one divider substantially spanning the space between the front and rear walls. The at least one dividers defines subchambers within the acoustical chamber, with each subchamber enclosing at least one inlet/outlet pair. The device with which the back cover assembly is associated may be provided as a disk array, such as a RAID system. Also disclosed is a method for reducing the amount of noise emitted by a device.