会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Semiconductor device and display device
    • 半导体器件和显示器件
    • US08415678B2
    • 2013-04-09
    • US13321411
    • 2010-05-20
    • Masaki YamanakaHiroshi NakatsujiNaoki Makita
    • Masaki YamanakaHiroshi NakatsujiNaoki Makita
    • H01L31/0368
    • H01L27/12G02F1/136209G02F2001/13312H01L21/268H01L27/1233H01L29/78696H01L31/105
    • A semiconductor device of the present invention is a semiconductor device including a thin film transistor and a thin film diode. A semiconductor layer (113) of the thin film transistor and a semiconductor layer (114) of the thin film diode are both crystalline semiconductor layers. The semiconductor layer (113) of the thin film transistor and the semiconductor layer (114) of the thin film diode respectively include portions formed by crystallizing the same amorphous semiconductor film. The thickness of the semiconductor layer (114) of the thin film diode is greater than the thickness of the semiconductor layer (113) of the thin film transistor. The difference between the thickness of the semiconductor layer (113) of the thin film transistor and the thickness of the semiconductor layer (114) of the thin film diode is greater than 25 nm. The surface roughness of the semiconductor layer (114) of the thin film diode is larger than the surface roughness of the semiconductor layer (113) of the thin film transistor. As a result, the thin film transistor and the thin film diode achieve respective required characteristics.
    • 本发明的半导体器件是包括薄膜晶体管和薄膜二极管的半导体器件。 薄膜晶体管的半导体层(113)和薄膜二极管的半导体层(114)都是结晶半导体层。 薄膜晶体管的半导体层(113)和薄膜二极管的半导体层(114)分别包括通过使相同的非晶半导体膜结晶而形成的部分。 薄膜二极管的半导体层(114)的厚度大于薄膜晶体管的半导体层(113)的厚度。 薄膜晶体管的半导体层(113)的厚度与薄膜二极管的半导体层(114)的厚度之差大于25nm。 薄膜二极管的半导体层(114)的表面粗糙度大于薄膜晶体管的半导体层(113)的表面粗糙度。 结果,薄膜晶体管和薄膜二极管实现了各自所需的特性。
    • 2. 发明申请
    • SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE
    • 半导体器件,其制造方法和显示器件
    • US20120068182A1
    • 2012-03-22
    • US13321411
    • 2010-05-20
    • Masaki YamanakaHiroshi NakatsujiNaoki Makita
    • Masaki YamanakaHiroshi NakatsujiNaoki Makita
    • H01L33/08H01L21/336
    • H01L27/12G02F1/136209G02F2001/13312H01L21/268H01L27/1233H01L29/78696H01L31/105
    • A semiconductor device of the present invention is a semiconductor device including a thin film transistor and a thin film diode. A semiconductor layer (113) of the thin film transistor and a semiconductor layer (114) of the thin film diode are both crystalline semiconductor layers. The semiconductor layer (113) of the thin film transistor and the semiconductor layer (114) of the thin film diode respectively include portions formed by crystallizing the same amorphous semiconductor film. The thickness of the semiconductor layer (114) of the thin film diode is greater than the thickness of the semiconductor layer (113) of the thin film transistor. The difference between the thickness of the semiconductor layer (113) of the thin film transistor and the thickness of the semiconductor layer (114) of the thin film diode is greater than 25 nm. The surface roughness of the semiconductor layer (114) of the thin film diode is larger than the surface roughness of the semiconductor layer (113) of the thin film transistor. As a result, the thin film transistor and the thin film diode achieve respective required characteristics.
    • 本发明的半导体器件是包括薄膜晶体管和薄膜二极管的半导体器件。 薄膜晶体管的半导体层(113)和薄膜二极管的半导体层(114)都是结晶半导体层。 薄膜晶体管的半导体层(113)和薄膜二极管的半导体层(114)分别包括通过使相同的非晶半导体膜结晶而形成的部分。 薄膜二极管的半导体层(114)的厚度大于薄膜晶体管的半导体层(113)的厚度。 薄膜晶体管的半导体层(113)的厚度与薄膜二极管的半导体层(114)的厚度之差大于25nm。 薄膜二极管的半导体层(114)的表面粗糙度大于薄膜晶体管的半导体层(113)的表面粗糙度。 结果,薄膜晶体管和薄膜二极管实现了各自所需的特性。
    • 3. 发明授权
    • Display device including metal lines provided above photodiode
    • 显示装置,包括光电二极管上方提供的金属线
    • US08106401B2
    • 2012-01-31
    • US12595322
    • 2008-04-17
    • Masaki YamanakaHiromi KatohChristopher Brown
    • Masaki YamanakaHiromi KatohChristopher Brown
    • H01L27/14H01L29/04H01L29/15H01L31/036
    • H01L31/035281G02F1/13318G02F1/1362H01L27/1446H01L31/0232H01L31/153H01L31/1804Y02E10/547
    • Provided are a display device in which variation in output characteristics of the photodiode is suppressed, and a method for manufacturing the display device. The display device is provided with the active matrix substrate (2) and photodiode (6). First, on a substrate of glass (12), a silicon film (8) and an interlayer insulation film (15) for covering the silicon film (8) are formed in this order. Then, a metal film is formed, and metal lines (10, 11) traversing the silicon film (8) are formed by etching the metal film. Then, p-type impurity ions are implanted by using a mask that has an opening (24a) that exposes a portion that overlaps a region where a p-layer (9a) is to be formed, a part of the opening (24a) being formed with the metal line (10). Furthermore, n-type impurity ions are implanted by using a mask that has an opening (25b) that exposes a portion that overlaps a region where an n-layer (9c) is to be formed, a part of the opening (25a) being formed with the metal line (11).
    • 提供了抑制光电二极管的输出特性的变化的显示装置及其制造方法。 显示装置设置有有源矩阵基板(2)和光电二极管(6)。 首先,在玻璃基板(12)上依次形成用于覆盖硅膜(8)的硅膜(8)和层间绝缘膜(15)。 然后,形成金属膜,通过蚀刻金属膜形成穿过硅膜(8)的金属线(10,11)。 然后,通过使用具有露出与形成有p层(9a)的区域重叠的部分的开口(24a)的掩模来注入p型杂质离子,开口部(24a)的一部分 与金属线(10)形成。 此外,通过使用具有露出与要形成n层(9c)的区域重叠的部分的开口(25b)的掩模来注入n型杂质离子,所述开口(25a)的一部分为 与金属线(11)形成。
    • 4. 发明授权
    • Elastic network structure
    • 弹性网络结构
    • US07892991B2
    • 2011-02-22
    • US11722265
    • 2005-12-20
    • Masaki YamanakaYoshihiro Matsui
    • Masaki YamanakaYoshihiro Matsui
    • D04H3/03D04H3/07D04H3/14D04H3/16
    • D04H13/00D04H3/03D04H3/05Y10T442/601Y10T442/69
    • Provided is an elastic network structure having durability and cushioning properties suitable for furniture, bedding such as a bed, seats for vehicles, seats for shipping, etc., the network structure being lightweight and having excellent chemical resistance, excellent light resistance, soft repellency, and excellent cushioning characteristics in a low temperature environment. The elastic network structure comprises a three-dimensional random loop bonded structure obtained by forming random loops with curling treatment of a continuous linear structure having not less than 300 decitex, and by making each loop mutually contact in a molten state to weld the majority of contacted part, the continuous linear structure mainly including a low density polyethylene resin with a specific gravity of not more than 0.94 g/cm3.
    • 本发明提供一种具有耐用性和缓冲性的弹性网状结构,其适用于家具,床上用品,车辆用座椅,运输座椅等,网状结构重量轻,耐化学性优异,耐光性优异,防排斥性, 在低温环境下具有优异的缓冲特性。 弹性网络结构包括通过形成具有不小于300分特的连续线性结构的卷曲处理的随机环获得的三维随机环接合结构,并且通过使每个环在熔融状态下相互接触以焊接大部分接触 部分连续线性结构主要包括比重不超过0.94 g / cm3的低密度聚乙烯树脂。
    • 6. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
    • 半导体器件及其制造方法
    • US20130146879A1
    • 2013-06-13
    • US13703987
    • 2011-06-13
    • Masaki YamanakaKazushige Hotta
    • Masaki YamanakaKazushige Hotta
    • H01L27/092H01L33/00H01L29/786
    • H01L27/092G02F1/136204G02F1/136259G02F2001/136245H01L27/11H01L27/1108H01L27/1222H01L29/786H01L29/78696H01L33/0041
    • Disclosed is a semiconductor device in which an n-channel type first thin film transistor and a p-channel type second thin film transistor are provided on the same substrate. The first thin film transistor has a first semiconductor layer (11), and the second thin film transistor has a second semiconductor layer (20), a third semiconductor layer (21), and a fourth semiconductor layer (22). The first semiconductor layer (11), the second semiconductor layer (20), the third semiconductor layer (21) and the fourth semiconductor layer (22) are formed of the same film, and the first and second semiconductor layers (11, 20) respectively have slanted portions (11e, 20e) positioned at respective peripheries, and main portions (11m, 20m) made of portions other than the slanted portions. A p-type impurity is implanted into the slanted portion (11e) of the first semiconductor layer at a concentration higher than that in the main portion (11m) of the first semiconductor layer and that in the main portion (20m) of the second semiconductor layer.
    • 公开了一种半导体器件,其中在同一衬底上设置有n沟道型第一薄膜晶体管和p沟道型第二薄膜晶体管。 第一薄膜晶体管具有第一半导体层(11),第二薄膜晶体管具有第二半导体层(20),第三半导体层(21)和第四半导体层(22)。 第一半导体层(11),第二半导体层(20),第三半导体层(21)和第四半导体层(22)由相同的膜形成,第一和第二半导体层(11,20) 分别具有位于相应周边的倾斜部分(11e,20e)以及由倾斜部分以外的部分制成的主要部分(11m,20m)。 在第一半导体层的倾斜部分(11e)中以比第一半导体层的主要部分(11m)高的浓度注入p型杂质,并且在第二半导体的主要部分(20m)中注入p型杂质 层。
    • 9. 发明申请
    • DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 显示装置及其制造方法
    • US20100140631A1
    • 2010-06-10
    • US12595322
    • 2008-04-17
    • Masaki YamanakaHiromi KatohChristopher Brown
    • Masaki YamanakaHiromi KatohChristopher Brown
    • H01L33/00H01L21/265
    • H01L31/035281G02F1/13318G02F1/1362H01L27/1446H01L31/0232H01L31/153H01L31/1804Y02E10/547
    • Provided are a display device in which variation in output characteristics of the photodiode is suppressed, and a method for manufacturing the display device. The display device is provided with the active matrix substrate (2) and photodiode (6). First, on a substrate of glass (12), a silicon film (8) and an interlayer insulation film (15) for covering the silicon film (8) are formed in this order. Then, a metal film is formed, and metal lines (10, 11) traversing the silicon film (8) are formed by etching the metal film. Then, p-type impurity ions are implanted by using a mask that has an opening (24a) that exposes a portion that overlaps a region where a p-layer (9a) is to be formed, a part of the opening (24a) being formed with the metal line (10). Furthermore, n-type impurity ions are implanted by using a mask that has an opening (25b) that exposes a portion that overlaps a region where an n-layer (9c) is to be formed, a part of the opening (25a) being formed with the metal line (11).
    • 提供了抑制光电二极管的输出特性的变化的显示装置及其制造方法。 显示装置设置有有源矩阵基板(2)和光电二极管(6)。 首先,在玻璃基板(12)上依次形成用于覆盖硅膜(8)的硅膜(8)和层间绝缘膜(15)。 然后,形成金属膜,通过蚀刻金属膜形成穿过硅膜(8)的金属线(10,11)。 然后,通过使用具有露出与形成有p层(9a)的区域重叠的部分的开口(24a)的掩模来注入p型杂质离子,开口部(24a)的一部分 与金属线(10)形成。 此外,通过使用具有露出与要形成n层(9c)的区域重叠的部分的开口(25b)的掩模来注入n型杂质离子,所述开口(25a)的一部分为 与金属线(11)形成。
    • 10. 发明申请
    • Elastic Network Structure
    • 弹性网络结构
    • US20080146763A1
    • 2008-06-19
    • US11722265
    • 2005-12-20
    • Masaki YamanakaYoshihiro Matsui
    • Masaki YamanakaYoshihiro Matsui
    • C08F110/02
    • D04H13/00D04H3/03D04H3/05Y10T442/601Y10T442/69
    • Provided is an elastic network structure having durability and cushioning properties suitable for furniture, bedding such as a bed, seats for vehicles, seats for shipping, etc., the network structure being lightweight and having excellent chemical resistance, excellent light resistance, soft repellency, and excellent cushioning characteristics in a low temperature environment. The elastic network structure comprises a three-dimensional random loop bonded structure obtained by forming random loops with curling treatment of a continuous linear structure having not less than 300 decitex, and by making each loop mutually contact in a molten state to weld the majority of contacted part, the continuous linear structure mainly including a low density polyethylene resin with a specific gravity of not more than 0.94 g/cm3.
    • 本发明提供一种具有耐用性和缓冲性的弹性网状结构,其适用于家具,床上用品,车辆用座椅,运输座椅等,网状结构重量轻,耐化学性优异,耐光性优异,防排斥性, 在低温环境下具有优异的缓冲特性。 弹性网络结构包括通过形成具有不小于300分特的连续线性结构的卷曲处理的随机环获得的三维随机环接合结构,并且通过使每个环在熔融状态下相互接触以焊接大部分接触 部分,连续线性结构主要包括比重不超过0.94g / cm 3的低密度聚乙烯树脂。