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1. 发明申请

US20130084709A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：US20130084709A1
公开(公告)日：2013-04-04
申请号：US13628650
申请日：2012-09-27
申请人： Masahiro MIYAGI , Kazunori FUJIKAWA
发明人： Masahiro MIYAGI , Kazunori FUJIKAWA
IPC分类号： B08B3/08 , H01L21/465 , H01L21/306
CPC分类号： H01L21/67028
摘要： In a substrate processing apparatus, an anti-static liquid supply part supplies the anti-static liquid having electrical resistivity higher than that of an SPM liquid onto a substrate to puddle an entire upper surface of the substrate with the anti-static liquid, to thereby gradually remove static electricity from the substrate. Then, the processing liquid supply part supplies the SPM liquid onto the substrate to thereby perform an SPM process. In the SPM process, it is thereby possible to prevent a large amount of electric charges from rapidly moving from the substrate to the SPM liquid and prevent any damage to the substrate. Further, by maintaining the electrical resistivity of the anti-static liquid at the target electrical resistivity, it is possible to increase the static elimination efficiency of the substrate and shorten the time required for the static elimination process within the limits of causing no damage to the substrate.
摘要翻译：在基板处理装置中，防静电液体供给部件将具有比SPM液体的电阻率高的抗静电液供给到基板上，从而将基板的整个上表面与防静电液体混合，由此逐渐从基材中除去静电。然后，处理液供给部将SPM液供给到基板上，由此进行SPM处理。在SPM工艺中，可以防止大量电荷从基板迅速移动到SPM液体，并且防止对基板的任何损坏。此外，通过将防静电液体的电阻率保持在目标电阻率，可以提高基板的静电消除效率，并且可以在不损害静电消除的限度内缩短静电消除处理所需的时间基质。

2. 发明申请

US20070080057A1 PLATING APPARATUS, PLATING CUP AND CATHODE RING 审中-公开
标题翻译：电镀设备，镀银和阴极环
公开(公告)号：US20070080057A1
公开(公告)日：2007-04-12
申请号：US11609026
申请日：2006-12-11
申请人： Yasuhiro MIZOHATA , Hideaki MATSUBARA , Masahiro MIYAGI , Ryuichi HAYAMA
发明人： Yasuhiro MIZOHATA , Hideaki MATSUBARA , Masahiro MIYAGI , Ryuichi HAYAMA
IPC分类号： C25D17/00
CPC分类号： H01L21/2885 , C25D5/003 , C25D5/04 , C25D5/08 , C25D7/123 , C25D17/001 , C25D17/005 , C25D17/06 , C25D17/12 , C25D21/08
摘要： A plating apparatus (10) provided with: a plating vessel (61a to 61d) having a cylindrical side wall (361) for containing a plating liquid; a substrate holding mechanism (74a to 74d) for generally horizontally holding a generally round substrate (W) to be treated; a cathode ring (80) provided in the substrate holding mechanism and having substantially the same inner diameter as the plating vessel for sealing a peripheral edge portion of a lower surface of the substrate, the cathode ring having a cathode (83) to be brought into contact with the substrate held by the substrate holding mechanism; and a rotative driving mechanism (45) for rotating the substrate held by the substrate holding mechanism together with the cathode ring; wherein the plating vessel has an upper edge portion complementary in configuration to a portion of the cathode ring opposed to the plating vessel so that the lower surface of the substrate held by the substrate holding mechanism can approach the plating vessel so as to be substantially flush with the upper edge of the plating vessel without interference between the upper edge portion of the plating vessel and the cathode ring.
摘要翻译：一种电镀装置（10），具备：电镀槽（61a〜61d），具有容纳镀液的圆筒状的侧壁（361）用于大致水平地保持待处理的大致圆形的基板（W）的基板保持机构（74a〜74d）阴极环（80），设置在所述基板保持机构中并且具有与用于密封所述基板的下表面的周缘部的电镀容器大致相同的内径，所述阴极环具有将被引入的阴极（83）与由基板保持机构保持的基板接触; 以及用于使由所述基板保持机构保持的所述基板与所述阴极环一起旋转的旋转驱动机构（45）其特征在于，所述电镀槽具有与所述阴极环的与所述电镀槽相对的部分的形状互补的上边缘部，使得被所述基板保持机构保持的所述基板的下表面能够接近所述电镀槽，电镀槽的上边缘与电镀槽的上边缘部分和阴极环之间没有干涉。

3. 发明申请

US20120090649A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：US20120090649A1
公开(公告)日：2012-04-19
申请号：US13245375
申请日：2011-09-26
申请人： Hiroaki TAKAHASHI , Toru ENDO , Masahiro MIYAGI , Koji HASHIMOTO
发明人： Hiroaki TAKAHASHI , Toru ENDO , Masahiro MIYAGI , Koji HASHIMOTO
IPC分类号： B08B3/04
CPC分类号： H01L21/67051 , B05D1/005 , G11B5/8404 , G11B7/266 , H01L21/02052 , H01L21/68728
摘要： A substrate processing apparatus includes a substrate holding unit that horizontally holds a substrate in non-contact with a major surface of the substrate, a processing liquid supply unit that supplies a processing liquid to the major surface of the substrate held by the substrate holding unit, and a hydrophilic surface placing unit that places an annular hydrophilic surface along a peripheral portion of the major surface of the substrate held by the substrate holding unit such that the hydrophilic surface comes into contact with a liquid film of the processing liquid held on the major surface of the substrate.
摘要翻译：一种基板处理装置，包括：基板保持单元，其水平地保持与基板的主表面不接触的基板;处理液供给单元，其将处理液供给到由所述基板保持单元保持的基板的主表面; 以及亲水性表面放置单元，其沿着由基板保持单元保持的基板的主表面的周边部分设置环状亲水性表面，使得亲水表面与保持在主表面上的处理液体的液膜接触的基底。

4. 发明申请

US20130084710A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：US20130084710A1
公开(公告)日：2013-04-04
申请号：US13628772
申请日：2012-09-27
申请人： Masahiro MIYAGI
发明人： Masahiro MIYAGI
IPC分类号： H01L21/306 , H01L21/302
CPC分类号： H01L21/67023 , H01L21/31133
摘要： A substrate processing apparatus comprises a single-substrate processing apparatus for processing substrates one by one, and an anti-static liquid storage part for storing an anti-static liquid having electrical resistivity maintained at target electrical resistivity higher than the electrical resistivity of an SPM liquid. A plurality of substrates held in a cartridge are immersed in the anti-static liquid inside the anti-static liquid storage part and both main surfaces of the substrate entirely come into contact with the anti-static liquid. From the substrates, static electricity is relatively gently removed. Then, after the static elimination process are finished, a processing liquid supply part supplies the SPM liquid onto an upper surface of the substrate and an SPM process is thereby performed. It is thereby possible to prevent a large amount of electric charges from rapidly moving from the substrate to the SPM liquid and also possible to prevent any damage to the substrate.
摘要翻译：基板处理装置包括一个一个地处理基板的单基板处理装置和用于存储电阻率保持在目标电阻率高于SPM液体的电阻率的电阻率的防静电液体的防静电液体存储部分。保持在盒中的多个基板被浸渍在防静电液体存储部分内的防静电液体中，并且基板的两个主表面完全与防静电液体接触。从基板，静电相对轻轻地去除。然后，在静电消除处理结束后，处理液供给部将SPM液供给到基板的上表面，从而进行SPM处理。从而可以防止大量电荷从基板迅速移动到SPM液体，并且还可以防止对基板的任何损坏。

5. 发明申请

US20130078381A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：US20130078381A1
公开(公告)日：2013-03-28
申请号：US13596903
申请日：2012-08-28
申请人： Masahiro MIYAGI , Koji HASHIMOTO , Toru ENDO
发明人： Masahiro MIYAGI , Koji HASHIMOTO , Toru ENDO
IPC分类号： B05D1/02 , B05C13/00 , B05C11/10 , B05B1/00
CPC分类号： B05C11/08 , B05B1/00 , B05C5/0225 , B05C11/10 , B05C11/1036 , B05C11/1039 , B05C13/00 , B05D1/02 , H01L21/67051
摘要： A substrate processing apparatus comprising a substrate holding rotating mechanism, a process liquid supply mechanism having a nozzle for dispensing a process liquid toward a principal face of the substrate, a processing liquid reservoir for holding sufficient process liquid to form a liquid film covering the whole principal face of the substrate, a liquid film forming unit for forming the liquid film by supplying the process liquid onto the principal face of the substrate in a single burst, and a control unit for controlling the liquid film forming unit and the process liquid supply mechanism such that the process liquid is dispensed from the process liquid nozzle toward the principal face of the substrate after formation of the liquid film covering the whole area of the principal face of the substrate by the liquid film forming unit.
摘要翻译：一种基板处理装置，包括基板保持旋转机构，具有用于向基板的主面分配处理液的喷嘴的处理液供给机构，用于保持足够的处理液以形成覆盖整个主体的液膜的处理液储存器基板的表面，用于通过将处理液体单次供给到基板的主面上来形成液膜的液膜形成单元，以及用于控制液膜形成单元和处理液供给机构的控制单元，在通过液膜形成单元形成覆盖基板的主面的整个区域的液膜之后，处理液体从处理液喷嘴分配到基板的主面。

6. 发明申请

US20070218656A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开
标题翻译：基板处理装置和基板处理方法
公开(公告)号：US20070218656A1
公开(公告)日：2007-09-20
申请号：US11686470
申请日：2007-03-15
申请人： Masahiro MIYAGI
发明人： Masahiro MIYAGI
IPC分类号： H01L21/20
CPC分类号： H01L21/67051
摘要： A substrate processing apparatus comprises an applying part which is a two-fluid nozzle for applying droplets of a cleaning solution onto a substrate, a cleaning solution supply part for supplying the cleaning solution into the applying part, and a ring-shaped induction electrode located close to an outlet of the applying part. An electric potential difference is generated between the induction electrode and the conductive liquid contact part (i.e., the cleaning solution supply part and the cleaning solution tube in the applying part) to induce charge on the cleaning solution in the vicinity of the outlet. In the substrate processing apparatus, since the substrate is cleaned by the droplets of the cleaning solution on which charge having an opposite polarity to that of the electric potential of the substrate after cleaning is induced, it is possible to suppress charging of the substrate during and after cleaning.
摘要翻译：一种基板处理装置，其特征在于，具备：涂布部，该涂布部是用于将清洗液滴到基板上的双流体喷嘴;清洗液供给部，其将清洗液供给到涂布部;以及环状感应电极，到施加部件的出口。在感应电极和导电液体接触部分（即，施加部分中的清洁溶液供应部分和清洁溶液管）之间产生电位差，以在出口附近的清洁溶液上引起电荷。在基板处理装置中，由于基板被清洗后的清洗液的液滴被清洗，因此，清洗后的电极具有与基板的电位相反极性的电荷，因此可以抑制基板的充电清洁后。

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