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1. 发明申请

US20130075795A1 Aerogel dielectric layer 有权
公开(公告)号：US20130075795A1
公开(公告)日：2013-03-28
申请号：US13200477
申请日：2011-09-23
申请人： Mark S. Hauhe , Jason G. Milne , Terry C. Cisco
发明人： Mark S. Hauhe , Jason G. Milne , Terry C. Cisco
IPC分类号： H01L29/772 , H01L21/56 , H01L23/48
CPC分类号： H01L21/563 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0 or less and a compression strength of at least approximately 100 psi.

2. 发明申请

US20100003785A1 STACKED INTEGRATED CIRCUIT ASSEMBLY 有权
标题翻译：堆叠式集成电路总成
公开(公告)号：US20100003785A1
公开(公告)日：2010-01-07
申请号：US12557205
申请日：2009-09-10
申请人： Tse E. WONG , Samuel D. TONOMURA , Stephen E. SOX , Timothy E. DEARDEN , Clifton QUAN , Polwin C. CHAN , Mark S. HAUHE
发明人： Tse E. WONG , Samuel D. TONOMURA , Stephen E. SOX , Timothy E. DEARDEN , Clifton QUAN , Polwin C. CHAN , Mark S. HAUHE
IPC分类号： H01L21/60
CPC分类号： H01L25/0657 , H01L21/563 , H01L23/3128 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32145 , H01L2224/73203 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/00014 , H01L2924/01078 , H01L2924/15311 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： In one or more embodiments, a method of producing a stacked integrated circuit assembly includes providing a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC may be disposed between the substrate and the SFIC. The method includes making at least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC.
摘要翻译：在一个或多个实施例中，一种制造堆叠集成电路组件的方法包括提供具有至少一个衬底连接焊盘的顶表面的衬底。第一倒装芯片集成电路（FFIC）设置在基板上方，第二倒装芯片集成电路（SFIC）设置在FFIC上方。 FFIC可以设置在基板和SFIC之间。该方法包括在衬底连接焊盘和FFIC之间进行至少一个焊接连接以及FFIC和SFIC之间的至少一个焊接连接。

3. 发明授权

US07605477B2 Stacked integrated circuit assembly 有权
标题翻译：堆叠式集成电路组件
公开(公告)号：US07605477B2
公开(公告)日：2009-10-20
申请号：US11698602
申请日：2007-01-25
申请人： Tse E. Wong , Samuel D. Tonomura , Stephen E. Sox , Timothy E. Dearden , Clifton Quan , Polwin C. Chan , Mark S. Hauhe
发明人： Tse E. Wong , Samuel D. Tonomura , Stephen E. Sox , Timothy E. Dearden , Clifton Quan , Polwin C. Chan , Mark S. Hauhe
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L25/0657 , H01L21/563 , H01L23/3128 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32145 , H01L2224/73203 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/00014 , H01L2924/01078 , H01L2924/15311 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A stacked integrated circuit assembly includes a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC is disposed between the substrate and the SFIC. The stacked integrated circuit assembly includes least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC.
摘要翻译：堆叠集成电路组件包括具有至少一个衬底连接焊盘的顶表面的衬底。第一倒装芯片集成电路（FFIC）设置在基板上方，第二倒装芯片集成电路（SFIC）设置在FFIC上方。 FFIC设置在基板和SFIC之间。堆叠集成电路组件包括衬底连接焊盘和FFIC之间的至少一个焊接连接以及FFIC和SFIC之间的至少一个焊接连接。

4. 发明授权

US07298235B2 Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces 有权
标题翻译：电路板组件和将芯片连接到具有不覆盖RF迹线的焊脚的电路板的方法
公开(公告)号：US07298235B2
公开(公告)日：2007-11-20
申请号：US10756649
申请日：2004-01-13
申请人： Mark S. Hauhe , Kevin C. Rolston , Clifton Quan , Harold S. Fenger , Tse E. Wong
发明人： Mark S. Hauhe , Kevin C. Rolston , Clifton Quan , Harold S. Fenger , Tse E. Wong
IPC分类号： H01P1/00
CPC分类号： H01Q21/0087 , H01L2224/73204 , H01L2924/07811 , H01L2924/1305 , H01Q21/0025 , H01L2924/00
摘要： An antenna array is assembled by direct attaching a flip chip transmit/receive (T/R) module to an antenna circuit board. A fillet bond is applied to the circuit board and the flip chip T/R module around at least a portion of the periphery of the flip chip T/R module.
摘要翻译：通过将倒装芯片发送/接收（T / R）模块直接附接到天线电路板来组装天线阵列。在倒装芯片T / R模块的周边的至少一部分周围的电路板和倒装芯片T / R模块上施加圆角接合。

5. 发明授权

US07525498B2 Antenna array 有权
标题翻译：天线阵列
公开(公告)号：US07525498B2
公开(公告)日：2009-04-28
申请号：US11545841
申请日：2006-10-11
申请人： Clifton Quan , Mark S. Hauhe
发明人： Clifton Quan , Mark S. Hauhe
IPC分类号： H01Q13/10
CPC分类号： H01Q21/064 , H01Q23/00
摘要： An antenna array includes a folded thin flexible circuit board with a thin dielectric layer and a conductor layer pattern formed on a first surface of the dielectric layer. The circuit board may be folded in a plurality of folds to form a pleated structure. An array of radiator structures is formed on the first surface, A conductor trace pattern is formed on the folded circuit board. A plurality of active RF circuit devices is attached to the folded circuit board in signal communication with the conductor trace pattern.
摘要翻译：天线阵列包括具有薄介电层的折叠薄柔性电路板和形成在电介质层的第一表面上的导体层图案。电路板可以折叠成多个折叠以形成打褶结构。散热器结构阵列形成在第一表面上，在折叠电路板上形成导体迹线图形。多个有源RF电路装置附接到与导体迹线图案信号通信的折叠电路板。

6. 发明申请

US20080179758A1 Stacked integrated circuit assembly 有权
标题翻译：堆叠式集成电路组件
公开(公告)号：US20080179758A1
公开(公告)日：2008-07-31
申请号：US11698602
申请日：2007-01-25
申请人： Tse E. Wong , Samuel D. Tonomura , Stephen E. Sox , Timothy E. Dearden , Clifton Quan , Polwin C. Chan , Mark S. Hauhe
发明人： Tse E. Wong , Samuel D. Tonomura , Stephen E. Sox , Timothy E. Dearden , Clifton Quan , Polwin C. Chan , Mark S. Hauhe
IPC分类号： H01L23/538 , H01L27/14 , H01L21/70
CPC分类号： H01L25/0657 , H01L21/563 , H01L23/3128 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32145 , H01L2224/73203 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/00014 , H01L2924/01078 , H01L2924/15311 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A stacked integrated circuit assembly includes a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC is disposed between the substrate and the SFIC. The stacked integrated circuit assembly includes least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC.
摘要翻译：堆叠集成电路组件包括具有至少一个衬底连接焊盘的顶表面的衬底。第一倒装芯片集成电路（FFIC）设置在基板上方，第二倒装芯片集成电路（SFIC）设置在FFIC上方。 FFIC设置在基板和SFIC之间。堆叠集成电路组件包括衬底连接焊盘和FFIC之间的至少一个焊接连接以及FFIC和SFIC之间的至少一个焊接连接。

7. 发明授权

US08026863B2 Transmit/receive module communication and control architechture for active array 有权
标题翻译：用于主动阵列的发射/接收模块通信和控制建筑
公开(公告)号：US08026863B2
公开(公告)日：2011-09-27
申请号：US12381867
申请日：2009-03-17
申请人： Richard D. Young , Clifton Quan , Mark S. Hauhe , Mark E. Stading , Chaim Warzman , Adam C. Von
发明人： Richard D. Young , Clifton Quan , Mark S. Hauhe , Mark E. Stading , Chaim Warzman , Adam C. Von
IPC分类号： H01Q21/00
CPC分类号： H04B7/0617 , H01Q21/0025 , H01Q21/064 , H04B7/086
摘要： A distributed control system for an active array antenna system is disclosed. In an exemplary embodiment, the array system employs many transmit/receive (T/R) modules each with an associated radiator element, a phase shifter element and a set of RF switch elements to set the module to transmit or receive modes. The array system is arranged to generate a transmit or receive array beam. The distributed control system in an exemplary embodiment includes an array processor for controlling the array, the processor configured to generate command signals to set the T/R module elements to transmit or receive mode and to steer the array beam to a desired direction. The command signals to steer the array beam include phase slopes common to all T/R modules in a given array or subarray. Each T/R module includes a beam steering control function configured to convert the phase slope data to phase data to set the phase shifter element for that T/R module to a phase shift setting for the beam direction associated with the phase slope index data.
摘要翻译：公开了一种用于有源阵列天线系统的分布式控制系统。在示例性实施例中，阵列系统采用多个发射/接收（T / R）模块，每个发射/接收（T / R）模块具有相关联的辐射体元件，移相器元件和一组RF开关元件，以将模块设置为发射或接收模式。阵列系统被布置成产生发射或接收阵列波束。在示例性实施例中的分布式控制系统包括用于控制阵列的阵列处理器，所述处理器被配置为产生命令信号以将T / R模块元件设置为发射或接收模式并将阵列波束引导到期望的方向。用于引导阵列波束的命令信号包括给定阵列或子阵列中所有T / R模块共用的相位斜率。每个T / R模块包括波束转向控制功能，其配置为将相位斜率数据转换为相位数据，以将该T / R模块的移相器元件设置为与相位斜率索引数据相关联的波束方向的相移设置。

8. 发明申请

US20100073233A1 Transmit/receive module communication and control architechture for active array 有权
标题翻译：用于主动阵列的发射/接收模块通信和控制建筑
公开(公告)号：US20100073233A1
公开(公告)日：2010-03-25
申请号：US12381867
申请日：2009-03-17
申请人： Richard D. Young , Clifton Quan , Mark S. Hauhe , Mark E. Stading , Chaim Warzman , Adam C. Von
发明人： Richard D. Young , Clifton Quan , Mark S. Hauhe , Mark E. Stading , Chaim Warzman , Adam C. Von
IPC分类号： H01Q3/00 , H01Q3/12
CPC分类号： H04B7/0617 , H01Q21/0025 , H01Q21/064 , H04B7/086
摘要： A distributed control system for an active array antenna system is disclosed. In an exemplary embodiment, the array system employs many transmit/receive (T/R) modules each with an associated radiator element, a phase shifter element and a set of RF switch elements to set the module to transmit or receive modes. The array system is arranged to generate a transmit or receive array beam. The distributed control system in an exemplary embodiment includes an array processor for controlling the array, the processor configured to generate command signals to set the T/R module elements to transmit or receive mode and to steer the array beam to a desired direction. The command signals to steer the array beam include phase slopes common to all T/R modules in a given array or subarray. Each T/R module includes a beam steering control function configured to convert the phase slope data to phase data to set the phase shifter element for that T/R module to a phase shift setting for the beam direction associated with the phase slope index data.
摘要翻译：公开了一种用于有源阵列天线系统的分布式控制系统。在示例性实施例中，阵列系统采用多个发射/接收（T / R）模块，每个发射/接收（T / R）模块具有相关联的辐射体元件，移相器元件和一组RF开关元件，以将模块设置为发射或接收模式。阵列系统被布置成产生发射或接收阵列波束。在示例性实施例中的分布式控制系统包括用于控制阵列的阵列处理器，所述处理器被配置为产生命令信号以将T / R模块元件设置为发射或接收模式并将阵列波束引导到期望的方向。用于引导阵列波束的命令信号包括给定阵列或子阵列中所有T / R模块共用的相位斜率。每个T / R模块包括波束转向控制功能，其被配置为将相位斜率数据转换为相位数据，以将该T / R模块的移相器元件设置为与相位斜率索引数据相关联的波束方向的相移设置。

9. 发明申请

US20080088519A1 Antenna array 有权
标题翻译：天线阵列
公开(公告)号：US20080088519A1
公开(公告)日：2008-04-17
申请号：US11545841
申请日：2006-10-11
申请人： Clifton Quan , Mark S. Hauhe
发明人： Clifton Quan , Mark S. Hauhe
IPC分类号： H01Q13/18 , H01Q1/42
CPC分类号： H01Q21/064 , H01Q23/00
摘要： An antenna array includes a folded thin flexible circuit board with a thin dielectric layer and a conductor layer pattern formed on a first surface of the dielectric layer. The circuit board may be folded in a plurality of folds to form a pleated structure. An array of radiator structures is formed on the first surface, A conductor trace pattern is formed on the folded circuit board. A plurality of active RF circuit devices is attached to the folded circuit board in signal communication with the conductor trace pattern.
摘要翻译：天线阵列包括具有薄介电层的折叠薄柔性电路板和形成在电介质层的第一表面上的导体层图案。电路板可以折叠成多个折叠以形成打褶结构。散热器结构阵列形成在第一表面上，在折叠电路板上形成导体迹线图形。多个有源RF电路装置附接到与导体迹线图案信号通信的折叠电路板。

10. 发明授权

US07057563B2 Radiator structures 有权
标题翻译：散热器结构
公开(公告)号：US07057563B2
公开(公告)日：2006-06-06
申请号：US10856443
申请日：2004-05-28
申请人： Gerald A. Cox , Mark S. Hauhe , Stan W. Livingston , Colleen Tallman , Clifton Quan , Anita L. Reinehr , Yanmin Zhang
发明人： Gerald A. Cox , Mark S. Hauhe , Stan W. Livingston , Colleen Tallman , Clifton Quan , Anita L. Reinehr , Yanmin Zhang
IPC分类号： H01Q1/38
CPC分类号： H01Q13/085 , H01Q1/085 , H01Q1/087 , H01Q1/38
摘要： A foldable radiator assembly includes a flexible dielectric substrate structure having a radiator conductor pattern formed therein. The flexible substrate structure can be flexible for movement between a folded position and a deployed position, or can be fixed in position by dielectric structures. An excitation circuit excites the radiator conductor pattern with RF energy. Strips of the radiator assemblies can be used to form an array aperture.
摘要翻译：可折叠散热器组件包括其中形成有散热器导体图案的柔性电介质基片结构。柔性基板结构可以是柔性的，用于在折叠位置和展开位置之间移动，或者可以通过电介质结构固定在适当位置。激励电路用RF能量激发散热器导体图案。散热器组件的条可用于形成阵列孔。

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