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    • 1. 发明授权
    • Apparatus and method for verifying process integrity
    • 验证过程完整性的装置和方法
    • US06463570B1
    • 2002-10-08
    • US09625620
    • 2000-07-26
    • Michael J. DunnMark Brandon Fuselier
    • Michael J. DunnMark Brandon Fuselier
    • G06F1750
    • H01L22/14H01L22/34
    • An apparatus and method for verifying a process step in the fabrication of an integrated circuit device is implemented. A ring oscillator is fabricated on the dice constituting the integrated circuit device being manufactured. The ring oscillator structure is adapted for sensitizing the ring oscillator to variations in the process step being verified. During test of the wafer containing the dice, a scan of the frequency of the ring oscillator across the wafer for each die under test is made. Deviations in the ring oscillator frequency from a preselected nominal value delimit regions of the wafer for which the process step is marginal.
    • 实现了用于验证集成电路器件的制造中的工艺步骤的装置和方法。 在构成正在制造的集成电路器件的骰子上制造环形振荡器。 环形振荡器结构适于使环形振荡器对正在验证的工艺步骤中的变化进行敏感。 在包含骰子的晶片的测试期间,对每个待测试晶片的晶片周期进行环形振荡器的频率的扫描。 来自预选的标称值的环形振荡器频率的偏差限制了晶片的过程步骤边缘的区域。
    • 2. 发明授权
    • Detecting die speed variations
    • 检测模具速度变化
    • US06410350B1
    • 2002-06-25
    • US09607150
    • 2000-06-29
    • Mark Brandon FuselierStephen Doug RayMichael James DunnRoger T. WilliamsMichael V. Fenske
    • Mark Brandon FuselierStephen Doug RayMichael James DunnRoger T. WilliamsMichael V. Fenske
    • H01L2166
    • G11C29/025G01R31/3016G01R31/31707G01R31/31725G11C29/006G11C29/50012
    • An apparatus and method for detecting speed variations across a die, a flash field, i.e., multiple dies, and multiple flash fields. In one embodiment, a method comprises the step of inserting a plurality of functional circuits at strategic locations across a die or flash field or multiple flash fields where each of the plurality of functional circuits generates data, e.g., values, frequency, etc., correlated to the die speeds at the strategic locations. The method further comprises reading the data generated by the plurality of functional circuits that may be correlated to the die speeds at the strategic locations. Speed variations across the die or flash field or multiple flash fields may then be subsequently detected based on the data generated by the plurality of functional circuits. Upon analyzing the data generated by the plurality of functional circuits, adjustments may be made to the manufacturing process to improve the number of acceptable integrated circuits or chips disposed in the dies.
    • 一种用于检测管芯上的速度变化,闪光场,即多个管芯和多个闪光场的装置和方法。 在一个实施例中,一种方法包括以下步骤:跨越管芯或闪存场或多个闪存场的战略位置插入多个功能电路,其中多个功能电路中的每一个产生数据,例如值,频率等相关 在战略地点的死亡速度。 该方法还包括读取由多个功能电路产生的数据,这些数据可能与战略位置处的模具速度相关。 然后可以基于由多个功能电路产生的数据随后检测管芯或闪光场或多个闪光场的速度变化。 在分析由多个功能电路产生的数据时,可以对制造过程进行调整,以改善设置在管芯中的可接受集成电路或芯片的数量。
    • 3. 发明授权
    • Electrically quantifying transistor spacer width
    • 电子量子化晶体管间隔物宽度
    • US06287877B1
    • 2001-09-11
    • US09668524
    • 2000-09-22
    • Roger WilliamsMark Brandon FuselierMichael Verne Fenske
    • Roger WilliamsMark Brandon FuselierMichael Verne Fenske
    • G01R3126
    • G01R31/275G01R31/2621
    • A method for electrically quantifying a semiconductor device's spacers' width. In one embodiment, a method comprises the step of measuring a resistance across a region of interest of each of a plurality of semiconductor structures including the semiconductor device in question, where the region of interest may be a source or drain region of the semiconductor structure or may be one of a plurality of lightly doped drain regions of the semiconductor structure. The method further comprises determining a width of one of a plurality of lightly doped drain regions of the semiconductor device from the resistance across the region of interest of each of the plurality of semiconductor structures. The method further comprises determining the semiconductor device's spacers' width from the width of one of the plurality of lightly doped drain regions of the semiconductor device.
    • 一种用于电化学半导体器件间隔物宽度的方法。 在一个实施例中,一种方法包括测量包括所讨论的半导体器件的多个半导体结构中的每一个的感兴趣区域的电阻的步骤,其中感兴趣区域可以是半导体结构的源极或漏极区域,或 可以是半导体结构的多个轻掺杂漏区中的一个。 该方法还包括从跨越多个半导体结构中的每一个的感兴趣区域的电阻确定半导体器件的多个轻掺杂漏极区域中的一个的宽度。 该方法还包括从半导体器件的多个轻掺杂漏区之一的宽度确定半导体器件的间隔物的宽度。