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1. 发明授权

US06285551B1 Overmolded electronic assembly 有权
标题翻译：包覆成型的电子组件
公开(公告)号：US06285551B1
公开(公告)日：2001-09-04
申请号：US09692241
申请日：2000-10-20
申请人： Scott David Brandenburg , Mark Anthony Koors , Jeffery Ralph Daanen
发明人： Scott David Brandenburg , Mark Anthony Koors , Jeffery Ralph Daanen
IPC分类号： H05K720
CPC分类号： H05K5/0034 , H05K3/0061 , H05K3/284 , H05K7/20854 , H05K2201/09754 , H05K2203/1327
摘要： An overmolded electronic assembly (10) and method for forming the assembly (1) that entails enclosing a circuit board (12) having one or more circuit devices (16) mounted to its surface. The assembly (10) includes a heat-conductive member (18) in thermal contact with one or more of the circuit devices (16) mounted to the circuit board (12). An overmolded body (22) encloses the circuit board (12) and the circuit devices (16) with the heat-conductive member (18), such that the overmolded body (22) and heat-conductive member (18) form a moisture-impermeable seal around the circuit board (12) and circuit devices (16). The overmolded body (22) also includes a connector housing (28) integrally-formed in its outer surface. The method for manufacturing the overmolded electronic assembly (10) generally entails supporting the circuit board (12) with the heat-conductive member (18) such that the heat-conductive member (18) thermally contacts the circuit devices (16). An overmolded enclosure is then formed by molding a material over the surface of the circuit board (12) to form the overmolded body (22) that, with the heat-conductive member (18), encases the circuit board (12) and its circuit devices (16).
摘要翻译：包覆成型的电子组件（10）和形成组件（1）的方法，该组件（1）包含封装具有安装在其表面上的一个或多个电路装置（16）的电路板（12）。组件（10）包括与安装到电路板（12）上的一个或多个电路装置（16）热接触的导热构件（18）。包覆成型体（22）将电路板（12）和电路装置（16）与导热构件（18）封闭，使得包覆成型体（22）和导热构件（18）形成水分 - 电路板（12）和电路装置（16）周围的不透气密封。包覆成型体（22）还包括在其外表面上整体形成的连接器壳体（28）。制造包覆成型的电子组件（10）的方法通常需要用导热构件（18）支撑电路板（12），使得导热构件（18）热接触电路装置（16）。然后通过在电路板（12）的表面上模制材料形成包覆成型外壳，以形成包覆模制体（22），其与导热构件（18）一起封装电路板（12）及其电路设备（16）。

2. 发明授权

US06180436B2 Method for removing heat from a flip chip semiconductor device 失效
标题翻译：从倒装芯片半导体器件中去除热量的方法
公开(公告)号：US06180436B2
公开(公告)日：2001-01-30
申请号：US09072593
申请日：1998-05-04
申请人： Mark Anthony Koors , Glen W Devos
发明人： Mark Anthony Koors , Glen W Devos
IPC分类号： H01L2148
CPC分类号： H01L23/3675 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H05K7/20436
摘要： A method and assembly (10) for conducting heat from a semiconductor device, such as a power flip chip (12). The assembly (10) is generally constructed to dissipate heat from the chip (12) when mounted to a flexible substrate (16). Heat is conducted from the chip (12) with a heat-conductive member (26) brought into thermal contact with the surface of the chip (12) opposite solder bump connections (18) that attach the chip (12) to the substrate (16). A biasing member (30) biases the substrate (16) against the chip (12) so as to maintain thermal contact between the chip (12) and the heat-conductive member (26). A thermally-conductive lubricant (32) is preferably provided between the surface of the chip (12) and the heat-conductive member (26) in order to promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansions and movement between the chip (12), substrate (26) and heat-conductive member (26). The substrate (16) and chip (12) are preferably enclosed within a housing (14) that incorporates the heat-conductive member (26). The housing (14) may further include fins (28) in order to promote heat dissipation from the housing (14) to the environment.
摘要翻译：一种用于从诸如功率倒装芯片（12）的半导体器件传导热量的方法和组件（10）。组件（10）通常构造成当安装到柔性基板（16）时从芯片（12）散发热量。从芯片（12）传导热量，导热部件（26）与将芯片（12）连接到基板（16）的焊料凸块连接（18）相对的芯片（12）的表面热接触）。偏置构件（30）将基板（16）偏压在芯片（12）上，以便保持芯片（12）和导热构件（26）之间的热接触。优选地，在芯片（12）的表面和导热构件（26）之间设置导热润滑剂（32），以便促进热接触，同时还使由于不同的结果可能出现的任何侧向机械应变芯片（12），基板（26）和导热部件（26）之间的热膨胀和运动。衬底（16）和芯片（12）优选地封装在结合有导热构件（26）的壳体（14）内。壳体（14）还可以包括翅片（28），以便促进从壳体（14）到环境的散热。

3. 发明授权

US06180045B2 Method of forming an overmolded electronic assembly 失效
标题翻译：形成二模制电子组件的方法
公开(公告)号：US06180045B2
公开(公告)日：2001-01-30
申请号：US09081498
申请日：1998-05-20
申请人： Scott David Brandenburg , Mark Anthony Koors , Jeffery Ralph Daanen
发明人： Scott David Brandenburg , Mark Anthony Koors , Jeffery Ralph Daanen
IPC分类号： B29C4514
CPC分类号： H05K5/0034 , H05K3/0061 , H05K3/284 , H05K7/20854 , H05K2201/09754 , H05K2203/1327
摘要： An overmolded electronic assembly (10) and method for forming the assembly (1) that entails enclosing a circuit board (12) having one or more circuit devices (16) mounted to its surface. The assembly (10) includes a heat-conductive member (18) in thermal contact with one or more of the circuit devices (16) mounted to the circuit board (12). An overmolded body (22) encloses the circuit board (12) and the circuit devices (16) with the heat-conductive member (18), such that the overmolded body (22) and heat-conductive member (18) form a moisture-impermeable seal around the circuit board (12) and circuit devices (16). The overmolded body (22) also includes a connector housing (28) integrally-formed in its outer surface. The method for manufacturing the overmolded electronic assembly (10) generally entails supporting the circuit board (12) with the heat-conductive member (18) such that the heat-conductive member (18) thermally contacts the circuit devices (16). An overmolded enclosure is then formed by molding a material over the surface of the circuit board (12) to form the overmolded body (22) that, with the heat-conductive member (18), encases the circuit board (12) and its circuit devices (16).
摘要翻译：包覆成型的电子组件（10）和形成组件（1）的方法，该组件（1）包含封装具有安装在其表面上的一个或多个电路装置（16）的电路板（12）。组件（10）包括与安装到电路板（12）上的一个或多个电路装置（16）热接触的导热构件（18）。包覆成型体（22）将电路板（12）和电路装置（16）与导热构件（18）封闭，使得包覆成型体（22）和导热构件（18）形成水分 - 电路板（12）和电路装置（16）周围的不透水密封。包覆成型体（22）还包括在其外表面上整体形成的连接器壳体（28）。制造包覆成型的电子组件（10）的方法通常需要用导热构件（18）支撑电路板（12），使得导热构件（18）热接触电路装置（16）。然后通过在电路板（12）的表面上模制材料形成包覆成型外壳，以形成包覆模制体（22），其与导热构件（18）一起封装电路板（12）及其电路设备（16）。

4. 发明授权

US6043937A Head up display system using a diffusing image plane 有权
标题翻译：使用漫射图像平面的头部显示系统
公开(公告)号：US6043937A
公开(公告)日：2000-03-28
申请号：US266378
申请日：1999-03-11
申请人： Mark William Hudson , Ning Wu , Doyle Joseph Groves , Timothy James Newman , Dale James Igram , Jianhua Li , Gerald Jay Witt , Mark Anthony Koors , Mark Robert Vincen
发明人： Mark William Hudson , Ning Wu , Doyle Joseph Groves , Timothy James Newman , Dale James Igram , Jianhua Li , Gerald Jay Witt , Mark Anthony Koors , Mark Robert Vincen
IPC分类号： G02B27/01 , G02B27/14 , F21V13/02
CPC分类号： G02B27/0101
摘要： A head up display system having a diffusing image plane or diffuser. The light output of a relatively small image source is imaged on the diffuser by way of imaging optics. A mirror is used to image light from the diffuser onto a windshield and correct for distortion caused by the windshield. The diffuser is advantageously used when a large field-of-view is desired, or sun load characteristics need to be addressed. The diffuser may be flat or curved in order to optimize the system for different applications. The magnification of the mirror may be made relatively low, and the solar energy density that is made incident on the image source is reduced, providing for a low cost, high performance, color head up display system.
摘要翻译：具有扩散图像平面或扩散器的头部显示系统。相对小的图像源的光输出通过成像光学器件成像在扩散器上。使用镜子将来自扩散器的光图像挡在挡风玻璃上并纠正由挡风玻璃引起的变形。当需要大的视场时，或者需要解决太阳负载特性时，扩散器有利地使用。扩散器可以是平坦的或弯曲的，以便优化用于不同应用的系统。可以使反射镜的放大率相对较低，并且降低入射到图像源上的太阳能密度，为低成本，高性能的彩色头部显示系统提供。

5. 发明授权

US06365964B1 Heat-dissipating assembly for removing heat from a flip chip semiconductor device 有权
标题翻译：用于从倒装芯片半导体器件去除热量的散热组件
公开(公告)号：US06365964B1
公开(公告)日：2002-04-02
申请号：US09692240
申请日：2000-10-20
申请人： Mark Anthony Koors , Glen W Devos
发明人： Mark Anthony Koors , Glen W Devos
IPC分类号： H01L2334
CPC分类号： H01L23/3675 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H05K7/20436
摘要： A method and assembly (10) for conducting heat from a semiconductor device, such as a power flip chip (12). The assembly (10) is generally constructed to dissipate heat from the chip (12) when mounted to a flexible substrate (16). Heat is conducted from the chip (12) with a heat-conductive member (26) brought into thermal contact with the surface of the chip (12) opposite solder bump connections (18) that attach the chip (12) to the substrate (16). A biasing member (30) biases the substrate (16) against the chip (12) so as to maintain thermal contact between the chip (12) and the heat-conductive member (26). A thermally-conductive lubricant (32) is preferably provided between the surface of the chip (12) and the heat-conductive member (26) in order to promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansions and movement between the chip (12), substrate (26) and heat-conductive member (26). The substrate (16) and chip (12) are preferably enclosed within a housing (14) that incorporates the heat-conductive member (26). The housing (14) may further include fins (28) in order to promote heat dissipation from the housing (14) to the environment.
摘要翻译：一种用于从诸如功率倒装芯片（12）的半导体器件传导热量的方法和组件（10）。组件（10）通常构造成当安装到柔性基板（16）时从芯片（12）散发热量。从芯片（12）传导热量，导热部件（26）与将芯片（12）连接到基板（16）的焊料凸块连接（18）相对的芯片（12）的表面热接触）。偏置构件（30）将基板（16）偏压在芯片（12）上，以便保持芯片（12）和导热构件（26）之间的热接触。优选地，在芯片（12）的表面和导热构件（26）之间设置导热润滑剂（32），以便促进热接触，同时还使由于不同的结果可能出现的任何侧向机械应变芯片（12），基板（26）和导热部件（26）之间的热膨胀和运动。衬底（16）和芯片（12）优选地封装在结合有导热构件（26）的壳体（14）内。壳体（14）还可以包括翅片（28），以便促进从壳体（14）到环境的散热。

6. 发明授权

US06262489B1 Flip chip with backside electrical contact and assembly and method therefor 有权
标题翻译：具有背面电接触和组装的倒装芯片及其方法
公开(公告)号：US06262489B1
公开(公告)日：2001-07-17
申请号：US09434552
申请日：1999-11-08
申请人： Mark Anthony Koors , Robert Vajagich , Charles I Delheimer , Scott David Brandenburg , Gary Eugene Oberlin
发明人： Mark Anthony Koors , Robert Vajagich , Charles I Delheimer , Scott David Brandenburg , Gary Eugene Oberlin
IPC分类号： H01L2348
CPC分类号： H01L24/81 , H01L2224/13111 , H01L2224/16 , H01L2224/73253 , H01L2224/81191 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/16152 , H01L2924/00
摘要： A method and assembly for mounting an IC semiconductor device to a substrate using flip chip technology. The assembly generally entails a flip chip having a first surface, an oppositely-disposed second surface, an integrated circuit that includes a vertical device on the first surface, and an electrical contact for the vertical device on the second surface. The flip chip is bonded with first solder connections to a first conductor pattern on a substrate, so that the first solder connections electrically and mechanically connect the flip chip to the substrate. The assembly further includes an electrical contact member that is positioned so that the flip chip is between the contact member and the substrate. The contact member is electrically and mechanically connected to a second conductor pattern on the substrate with second solder connections. A third solder connection electrically and mechanically connects the contact member to the electrical contact on the second surface of the flip chip.
摘要翻译：一种使用倒装芯片技术将IC半导体器件安装到衬底的方法和组件。组件通常需要具有第一表面，相对设置的第二表面的倒装芯片，包括在第一表面上的垂直器件的集成电路和用于第二表面上的垂直器件的电接触。倒装芯片通过与衬底上的第一导体图案的第一焊接接合而接合，使得第一焊接连接将倒装芯片电连接和机械连接到衬底。组件还包括电接触构件，其被定位成使得倒装芯片位于接触构件和衬底之间。接触构件通过第二焊接连接电连接和机械连接到衬底上的第二导体图案。第三焊接连接将接触构件电连接并机械地连接到倒装芯片的第二表面上的电触头。

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