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    • 1. 发明授权
    • Memory units and related semiconductor devices including nanowires
    • 存储器单元和包括纳米线的相关半导体器件
    • US08338815B2
    • 2012-12-25
    • US12851268
    • 2010-08-05
    • Moon-Sook LeeByeong-Ok ChoMan-Hyoung RyooTakahiro Yasue
    • Moon-Sook LeeByeong-Ok ChoMan-Hyoung RyooTakahiro Yasue
    • H01L29/04H01L47/00
    • H01L27/11507B82Y10/00H01L27/10H01L27/1021H01L27/24
    • Methods of fabricating a memory unit are provided including forming a plurality of first nanowire structures, each of which includes a first nanowire extending in a first direction parallel to the first substrate and a first electrode layer enclosing the first nanowire, on a first substrate. The first electrode layers are partially removed to form first electrodes beneath the first nanowires. A first insulation layer filling up spaces between structures, each of which includes the first nanowire and the first electrode, is formed on the first substrate. A second electrode layer is formed on the first nanowires and the first insulation layer. A plurality of second nanowires is formed on the second electrode layer, each of which extends in a second direction perpendicular to the first direction. The second electrode layer is partially etched using the second nanowires as an etching mask to form a plurality of second electrodes. Related memory units, methods of fabricating semiconductor devices and semiconductor devices are also provided.
    • 提供了一种制造存储器单元的方法,包括形成多个第一纳米线结构,每个第一纳米线结构包括在第一衬底上沿与第一衬底平行的第一方向延伸的第一纳米线和包围第一纳米线的第一电极层。 第一电极层被部分地去除以在第一纳米线下方形成第一电极。 填充第一基板上形成有第一纳米线和第一电极的结构之间的空间的第一绝缘层。 在第一纳米线和第一绝缘层上形成第二电极层。 多个第二纳米线形成在第二电极层上,每个第二纳米线沿垂直于第一方向的第二方向延伸。 使用第二纳米线作为蚀刻掩模来部分蚀刻第二电极层以形成多个第二电极。 还提供了相关的存储单元,制造半导体器件和半导体器件的方法。
    • 6. 发明申请
    • Integrated circuit semiconductor device with overlay key and alignment key and method of fabricating the same
    • 具有覆盖键和对准键的集成电路半导体器件及其制造方法
    • US20050031995A1
    • 2005-02-10
    • US10867468
    • 2004-06-14
    • Chang-Jin KangMyeong-Cheol KimMan-Hyoung RyooSi-Hyeung LeeDoo-Youl Lee
    • Chang-Jin KangMyeong-Cheol KimMan-Hyoung RyooSi-Hyeung LeeDoo-Youl Lee
    • G03F9/00G03F7/00G03F7/20H01L21/027H01L23/544
    • H01L23/544G03F7/70633G03F9/7076G03F9/708G03F9/7084H01L2223/54453H01L2924/0002H01L2924/00
    • An integrated circuit semiconductor device including a cell region formed in a first portion of a silicon substrate, the cell region including a first trench formed in the silicon substrate, a first buried insulating layer filled in the first trench, a first insulating pattern formed over the silicon substrate, and a first conductive pattern formed over the first insulating pattern. An overlay key region is formed in a second portion of the silicon substrate and includes a second trench formed in the silicon substrate, a second insulating pattern formed over the silicon substrate and used as an overlay key, and a second conductive pattern formed over the second insulating pattern and formed by correcting overlay and alignment errors using the second insulating pattern. An alignment key region is formed in a third portion of the silicon substrate and includes a third trench formed in the silicon substrate and used as an alignment key, a second buried insulating layer formed in the third trench, and a third conductive pattern formed over the second buried insulating layer and the third trench.
    • 一种集成电路半导体器件,包括形成在硅衬底的第一部分中的单元区域,所述单元区域包括形成在所述硅衬底中的第一沟槽,填充在所述第一沟槽中的第一掩埋绝缘层,形成在所述第一沟槽上的第一绝缘图案 硅衬底和形成在第一绝缘图案上的第一导电图案。 覆盖键区域形成在硅衬底的第二部分中,并且包括在硅衬底中形成的第二沟槽,形成在硅衬底上并用作覆盖键的第二绝缘图案,以及形成在第二衬底上的第二导电图案 绝缘图案,并且通过使用第二绝缘图案校正覆盖和对准误差而形成。 对准键区域形成在硅衬底的第三部分中,并且包括形成在硅衬底中并用作对准键的第三沟槽,形成在第三沟槽中的第二掩埋绝缘层和形成在第三沟槽上的第三导电图案 第二掩埋绝缘层和第三沟槽。
    • 9. 发明授权
    • Integrated circuit semiconductor device with overlay key and alignment key and method of fabricating the same
    • 具有覆盖键和对准键的集成电路半导体器件及其制造方法
    • US08080886B2
    • 2011-12-20
    • US12111651
    • 2008-04-29
    • Chang-Jin KangMyeong-Cheol KimMan-Hyoung RyooSi-Hyeung LeeDoo-Youl Lee
    • Chang-Jin KangMyeong-Cheol KimMan-Hyoung RyooSi-Hyeung LeeDoo-Youl Lee
    • H01L23/544
    • H01L23/544G03F7/70633G03F9/7076G03F9/708G03F9/7084H01L2223/54453H01L2924/0002H01L2924/00
    • An integrated circuit semiconductor device including a cell region formed in a first portion of a silicon substrate, the cell region including a first trench formed in the silicon substrate, a first buried insulating layer filled in the first trench, a first insulating pattern formed over the silicon substrate, and a first conductive pattern formed over the first insulating pattern. An overlay key region is formed in a second portion of the silicon substrate and includes a second trench formed in the silicon substrate, a second insulating pattern formed over the silicon substrate and used as an overlay key, and a second conductive pattern formed over the second insulating pattern and formed by correcting overlay and alignment errors using the second insulating pattern. An alignment key region is formed in a third portion of the silicon substrate and includes a third trench formed in the silicon substrate and used as an alignment key, a second buried insulating layer formed in the third trench, and a third conductive pattern formed over the second buried insulating layer and the third trench.
    • 一种集成电路半导体器件,包括形成在硅衬底的第一部分中的单元区域,所述单元区域包括形成在所述硅衬底中的第一沟槽,填充在所述第一沟槽中的第一掩埋绝缘层,形成在所述第一沟槽上的第一绝缘图案 硅衬底和形成在第一绝缘图案上的第一导电图案。 覆盖键区域形成在硅衬底的第二部分中,并且包括在硅衬底中形成的第二沟槽,形成在硅衬底上并用作覆盖键的第二绝缘图案,以及形成在第二衬底上的第二导电图案 绝缘图案,并且通过使用第二绝缘图案校正覆盖和对准误差而形成。 对准键区域形成在硅衬底的第三部分中,并且包括形成在硅衬底中并用作对准键的第三沟槽,形成在第三沟槽中的第二掩埋绝缘层和形成在第三沟槽上的第三导电图案 第二掩埋绝缘层和第三沟槽。