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1. 发明申请

US20120187509A1 Contact Arrangement For Establishing A Spaced, Electrically Conducting Connection Between Microstructured Components 审中-公开
标题翻译：用于建立微结构元件之间的间隔导电连接的触点布置
公开(公告)号：US20120187509A1
公开(公告)日：2012-07-26
申请号：US13120994
申请日：2009-09-15
申请人： Knut Gottfried , Maik Wiemer , Axel Franke , Achim Trautmann , Ando Feyh , Sonja Knies , Joerg Froemel
发明人： Knut Gottfried , Maik Wiemer , Axel Franke , Achim Trautmann , Ando Feyh , Sonja Knies , Joerg Froemel
IPC分类号： H01L29/84 , H01L21/768 , H01L23/48
CPC分类号： B81C1/00238 , B81B2207/012 , B81C2203/0118 , B81C2203/019 , B81C2203/038 , H01L24/94 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A contact arrangement for establishing a spaced, electrically conducting connection between a first wafer and a second wafer includes an electrical connection contact, a passivation layer on the electrical connection contact, and a dielectric spacer layer arranged on the passivation layer, wherein the contact arrangement is arranged at least on one of the first wafer and the second wafer, wherein the contact arrangement comprises trenches at least partly filled with a first material capable of forming a metal-metal connection, wherein the trenches are continuous trenches from the dielectric spacer layer through the passivation layer as far as the electrical connection contact, and wherein the first material is arranged in the trenches from the electrical connection contact as far as the upper edge of the trenches.
摘要翻译：用于在第一晶片和第二晶片之间建立间隔的导电连接的接触装置包括电连接触点，电连接触点上的钝化层以及布置在钝化层上的电介质间隔层，其中触点布置是布置在所述第一晶片和所述第二晶片中的至少一个上，其中所述接触装置包括至少部分地填充有能够形成金属 - 金属连接的第一材料的沟槽，其中所述沟槽是来自所述电介质间隔层的连续沟槽，钝化层直到电连接接触，并且其中第一材料从电连接触点设置在沟槽中，直到沟槽的上边缘。

2. 发明申请

US20110284975A1 MICROSTRUCTURE, METHOD FOR PRODUCING THE SAME, DEVICE FOR BONDING A MICROSTRUCTURE AND MICROSYSTEM 有权
公开(公告)号：US20110284975A1
公开(公告)日：2011-11-24
申请号：US13146759
申请日：2010-01-26
申请人： Joerg Braeuer , Thomas Gessner , Lutz Hofmann , Joerg Froemel , Maik Wiemer , Holger Letsch , Mario Baum
发明人： Joerg Braeuer , Thomas Gessner , Lutz Hofmann , Joerg Froemel , Maik Wiemer , Holger Letsch , Mario Baum
IPC分类号： H01L29/06 , H01L29/82 , H01L21/28 , H01L29/84 , B82Y99/00
CPC分类号： B81C3/001 , B81C2203/019 , B81C2203/032
摘要： A microstructure has at least one bonding substrate and a reactive multilayer system. The reactive multilayer system has at least one surface layer of the bonding substrate with vertically oriented nanostructures spaced apart from one another. Regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures. A method for producing at least one bonding substrate and a reactive multilayer system, includes, for forming the reactive multilayer system, at least one surface layer of the bonding substrate is patterned or deposited in patterned fashion with the formation of vertically oriented nanostructures spaced apart from one another, and regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures. A device for bonding a microstructure, which has at least one bonding substrate and a reactive multilayer system, to a further structure, which has a bonding substrate. The device has a bonding chamber, which can be opened and closed and evacuated and in which the microstructure and the further structure can be introduced and aligned with one another, and also an activation mechanism, which is coupled to the bonding chamber and by means of which the reactive multilayer system of the microstructure, said reactive multilayer system being formed from reactive nanostructures with—situated therebetween—a material constituting a reaction partner with respect to the material of the nanostructures, can be activated mechanically, electrically, electromagnetically, optically and/or thermally in such a way that a self-propagating, exothermic reaction takes place between the nanostructures and the material constituting a reaction partner with respect to the material of the nanostructures. A microsystem is formed from two bonding substrates and a construction lying between the bonding substrates, the construction having a reacted reactive layer system, wherein the reacted reactive layer system is a reacted structure sequence composed of at least one surface layer—provided on the bonding substrate—with vertically oriented nanostructures spaced apart from one another, and regions filled between the nanostructures with at least one material constituting a reaction partner with respect to the material of the nanostructures. The microsystem is a sensor coated with biomaterial and/or has elements composed of polymeric material and/or at least one magnetic and/or piezoelectric and/or piezoresistive component.

3. 发明授权

US08299630B2 Microstructure with reactive bonding 有权
标题翻译：具有反应性键合的微结构
公开(公告)号：US08299630B2
公开(公告)日：2012-10-30
申请号：US13146759
申请日：2010-01-26
申请人： Joerg Braeuer , Thomas Gessner , Lutz Hofmann , Joerg Froemel , Maik Wiemer , Holger Letsch , Mario Baum
发明人： Joerg Braeuer , Thomas Gessner , Lutz Hofmann , Joerg Froemel , Maik Wiemer , Holger Letsch , Mario Baum
IPC分类号： H01L23/48 , H01L29/40 , H01L21/44 , H01L21/48
CPC分类号： B81C3/001 , B81C2203/019 , B81C2203/032
摘要： A microstructure has at least one bonding substrate and a reactive multilayer system. The reactive multilayer system has at least one surface layer of the bonding substrate with vertically oriented nanostructures spaced apart from one another. Regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures. A method for producing at least one bonding substrate and a reactive multilayer system, includes, for forming the reactive multilayer system, at least one surface layer of the bonding substrate is patterned or deposited in patterned fashion with the formation of vertically oriented nanostructures spaced apart from one another, and regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures. A microsystem is formed from two bonding substrates and a construction lying between the bonding substrates, the construction having a reacted reactive layer system. The microsystem is a sensor coated with biomaterial and/or has elements composed of polymeric material and/or at least one magnetic and/or piezoelectric and/or piezoresistive component.
摘要翻译：微结构具有至少一个键合衬底和反应性多层体系。反应性多层体系具有至少一个表面层，该表面层具有彼此间隔开的垂直取向的纳米结构的接合基底。纳米结构之间的区域填充有至少一种相对于纳米结构材料构成反应伴侣的材料。一种用于制造至少一个接合基材和反应性多层体系的方法，包括用于形成反应性多层体系的方法，所述接合基材的至少一个表面层以图案化方式图案化或沉积，形成垂直取向的纳米结构，并且纳米结构之间的区域填充有相对于纳米结构的材料构成反应伴侣的至少一种材料。微系统由两个接合基板和位于接合基板之间的结构形成，该结构具有反应的反应层系统。微系统是涂覆有生物材料的传感器和/或具有由聚合物材料和/或至少一个磁性和/或压电和/或压阻组件组成的元件。

4. 发明授权

US06863832B1 Method for producing a torsion spring 失效
标题翻译：扭簧的制造方法
公开(公告)号：US06863832B1
公开(公告)日：2005-03-08
申请号：US10031957
申请日：2000-07-20
申请人： Maik Wiemer , Karla Hiller , Detlef Billep , Uwe Breng , Bruno Rvrko , Eberhard Handrich
发明人： Maik Wiemer , Karla Hiller , Detlef Billep , Uwe Breng , Bruno Rvrko , Eberhard Handrich
IPC分类号： B81B3/00 , B81C1/00 , G01C19/56 , G01P15/08 , C23F1/00
CPC分类号： B81B3/0051 , B81B2201/0242 , B81C2201/0133 , G01C19/56 , G01P15/0888
摘要： A method for producing a silicon torsion spring capable, for example, of reading the rotation rate in a microstructured torsion spring/mass system. The system that is produced achieves a low torsional stiffness compared to a relatively high transverse stiffness in the lateral and vertical directions. The method proceeds from a wafer or wafer composite and, upon suitable mask coverage, a spring with a V-shaped cross section is formed by anisotropic wet-chemical etching which preferably extends over the entire wafer thickness and is laterally delimited only by [111] planes. Two of the wafers or wafer composites prepared in this way are rotated through 180° and joined to one another oriented mirrorsymmetrically with respect to one another, so that overall the desired X-shaped cross section is formed.
摘要翻译：一种制造例如在微结构扭转弹簧/质量体系中读取旋转速度的硅扭转弹簧的方法。与横向和垂直方向上相对较高的横向刚度相比，所生产的系统达到较低的扭转刚度。该方法从晶片或晶片复合材料进行，并且在合适的掩模覆盖时，通过各向异性湿化学蚀刻形成具有V形横截面的弹簧，其优选地在整个晶片厚度上延伸并且仅由[111] 飞机以这种方式制备的两个晶片或晶片复合体相对于彼此对称地旋转180°并且彼此相对地定向成反射镜，从而形成所需的X形横截面。

5. 发明授权

US5614742A Micromechanical accelerometer with plate-like semiconductor wafers 失效
标题翻译：具有板状半导体晶片的微机械加速度计
公开(公告)号：US5614742A
公开(公告)日：1997-03-25
申请号：US587604
申请日：1996-01-02
申请人： Thomas Gessner , Martin Hafen , Eberhard Handrich , Peter Leinfelder , Bruno Ryrko , Egbert Vetter , Maik Wiemer
发明人： Thomas Gessner , Martin Hafen , Eberhard Handrich , Peter Leinfelder , Bruno Ryrko , Egbert Vetter , Maik Wiemer
IPC分类号： G01P15/08 , G01P15/125 , H01L21/306 , H01L29/84 , H01L29/82
CPC分类号： G01P15/0802 , G01P15/125 , G01P2015/0828 , Y10S148/012 , Y10S73/01
摘要： A high precision micromechanical accelerometer comprises a layered structure of five (5) semiconductor wafers insulated from one another by thin oxide layers. The accelerometer is formed by first connecting a coverplate and a baseplate to associated insulating plates. Counter-electrodes, produced by anisotropic etching from the respective insulating plates, are fixed to the coverplate and the baseplate respectively. The counter-electrodes are contactable through the cover or baseplate via contact windows. A central wafer contains a unilaterally linked mass (pendulum) that is also produced by anisotropic etching and which serves as a movable central electrode of a differential capacitor. The layered structure is hermetically sealed by semiconductor fusion bonding. A stepped gradation from the top is formed at a wafer edge region for attaching contact pads to individual wafers to permit electrical contacting of individual wafers. The invention permits fabrication of a .mu.B device characterized by extremely small leakage capacitances and high temperature stability.
摘要翻译：高精度微机械加速度计包括由半氧化物层彼此绝缘的五（5）个半导体晶片的分层结构。通过首先将盖板和底板连接到相关联的绝缘板来形成加速度计。通过各自绝缘板的各向异性蚀刻制成的对电极分别固定在盖板和底板上。相对电极可以通过接触窗口通过盖板或底板接触。中央晶片包含单向连接的质量（摆），其也通过各向异性蚀刻产生，并且用作差分电容器的可移动中心电极。层状结构通过半导体熔融粘合而密封。在晶片边缘区域形成从顶部的阶梯状梯度，用于将接触焊盘附接到单个晶片以允许单个晶片的电接触。本发明允许制造以极小的泄漏电容和高温稳定性为特征的μB器件。

6. 发明授权

US5504032A Micromechanical accelerometer and method of manufacture thereof 失效
标题翻译：微机械加速度计及其制造方法
公开(公告)号：US5504032A
公开(公告)日：1996-04-02
申请号：US224750
申请日：1994-04-07
申请人： Thomas Gessner , Martin Hafen , Eberhard Handrich , Peter Leinfelder , Bruno Ryrko , Egbert Vetter , Maik Wiemer
发明人： Thomas Gessner , Martin Hafen , Eberhard Handrich , Peter Leinfelder , Bruno Ryrko , Egbert Vetter , Maik Wiemer
IPC分类号： G01P15/08 , G01P15/125 , H01L21/306 , H01L29/84 , H01L21/76
CPC分类号： G01P15/0802 , G01P15/125 , G01P2015/0828 , Y10S148/012 , Y10S73/01
摘要： A high precision micromechanical accelerometer comprises a layered structure of five (5) semiconductor wafers insulated from one another by thin semiconductor material oxide layers. The accelerometer is formed by first connecting a coverplate and a baseplate to associated insulating plates. Counter-electrodes, produced by anisotropic etching from the respective insulating plates, are fixed to the coverplate and the baseplate respectively. The counter-electrodes are contactable through the cover or baseplate via contact windows. A central wafer contains a unilaterally linked mass (pendulum) that is also produced by anisotropic etching and which serves as a movable central electrode of a differential capacitor. The layered structure is hermetically sealed by semiconductor fusion bonding. A stepped gradation from the top is formed at a wafer edge region for attaching contact pads to individual wafers to permit electrical contacting of individual wafers. The invention permits fabrication of a .mu.B device characterized by extremely small leakage capacitances and high temperature stability.
摘要翻译：一种高精度微机械加速度计包括由薄半导体材料氧化物层彼此绝缘的五（5）个半导体晶片的分层结构。通过首先将盖板和底板连接到相关联的绝缘板来形成加速度计。通过各自绝缘板的各向异性蚀刻制成的对电极分别固定在盖板和基板上。相对电极可以通过接触窗口通过盖板或底板接触。中央晶片包含单向连接的质量（摆），其也通过各向异性蚀刻产生，并且用作差分电容器的可移动中心电极。层状结构通过半导体熔融粘合而密封。在晶片边缘区域形成从顶部的阶梯状梯度，用于将接触焊盘附接到单个晶片以允许单个晶片的电接触。本发明允许制造以极小的泄漏电容和高温稳定性为特征的μB器件。

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