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    • 10. 发明申请
    • LOW COST CONFORMAL EMI/RFI SHIELD
    • 低成本EMI / RFI屏蔽
    • WO0117327A9
    • 2002-09-12
    • PCT/US0023764
    • 2000-08-29
    • NOKIA MOBILE PHONES LTDLACEY SIMON
    • LACEY SIMON
    • H05K3/32H05K9/00
    • H05K9/003H05K3/321H05K9/0022H05K9/0037
    • An EMI/RFI shield includes a shell made from a metalized polymeric material with a shape that is predetermined to form within at least one shielded cavity. The shell has sidewalls that terminate in a flange extending at an angle to the sidewalls. The flange has a lower surface for electrically coupling the shell to a predetermined electrical potential and an upper surface for engaging a structure, preferably a protruding rib from a cover, that exerts a compressive force on the top surface for urging the lower surface into an electrical coupling arrangement with an underlying planar conductor carrying the predetermined electrical potential (e.g., ground). The lower surface can include or be placed upon a layer of electrically conductive compliant material, such as a conductive adhesive. At least one of the sidewalls can include a projecting fluted structure having a size and location that is predetermined to engage a side of the structure that exerts the compressive force.
    • EMI / RFI屏蔽包括由金属化的聚合物材料制成的壳体,其具有预定的形状以形成在至少一个屏蔽空腔内。 壳体具有终止于与侧壁成一定角度延伸的凸缘的侧壁。 凸缘具有用于将壳体电耦合到预定电位的下表面和用于接合结构的上表面,优选地,来自盖的突出肋,其在顶表面上施加压缩力,以将下表面推入电 耦合布置与承载预定电位(例如,接地)的底层平面导体。 下表面可以包括或放置在导电柔性材料层上,例如导电粘合剂。 侧壁中的至少一个可以包括突出的凹槽结构,其具有预定的尺寸和位置,以接合施加压缩力的结构的一侧。