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1. 发明申请

WO2010093517A3 INTEGRATED UNIT FOR ELECTRICAL/RELIABILITY TESTING WITH IMPROVED THERMAL CONTROL 审中-公开
标题翻译：具有改进的热控制的电气/可靠性测试的集成单元
公开(公告)号：WO2010093517A3
公开(公告)日：2010-11-25
申请号：PCT/US2010022119
申请日：2010-01-26
申请人： QUALITAU INC , LUPASHKU MIRTCHA , HERSCHMANN JACOB , KRIEGER GEDALIAHOO
发明人： LUPASHKU MIRTCHA , HERSCHMANN JACOB , KRIEGER GEDALIAHOO
IPC分类号： G01R31/26 , G05D23/00
CPC分类号： G01R31/2863 , G01R1/0458
摘要： In accordance with an aspect, a thermally-controllable integrated unit is configured to hold devices under test. The integrated unit includes at least one heater board, comprised of a thermally-conductive material and provided with at least one global heater configured to globally heat the DUT board. A DUT board of the integrated unit includes a DUT board in thermal contact with the at least one heater board, the DUT board including a plurality of sockets, each socket configured to hold at least one DUT. The DUT has conductor paths to conduct electrical signals between test equipment and the terminals of DUTs in the sockets. Each socket includes an associated temperature sensor and a separately controllable local heater configured to, based on a temperature indication from the temperature sensor, heat a DUT in that socket.
摘要翻译：根据一个方面，热控制集成单元被配置为保持待测设备。集成单元包括至少一个由导热材料组成的加热板，并设置有至少一个配置成全面加热DUT板的全局加热器。集成单元的DUT板包括与至少一个加热板热接触的DUT板，DUT板包括多个插座，每个插座配置成保持至少一个DUT。 DUT具有导体路径，用于在测试设备和插座中DUT的端子之间传导电信号。每个插座包括相关联的温度传感器和单独可控的本地加热器，其被配置为基于来自温度传感器的温度指示，加热该插座中的DUT。

2. 发明申请

WO2010093517A2 INTEGRATED UNIT FOR ELECTRICAL/RELIABILITY TESTING WITH IMPROVED THERMAL CONTROL 审中-公开
标题翻译：用于电气/可靠性测试的集成单元，具有改进的热控制
公开(公告)号：WO2010093517A2
公开(公告)日：2010-08-19
申请号：PCT/US2010/022119
申请日：2010-01-26
申请人： QUALITAU, INC. , LUPASHKU, Mirtcha , HERSCHMANN, Jacob , KRIEGER, Gedaliahoo
发明人： LUPASHKU, Mirtcha , HERSCHMANN, Jacob , KRIEGER, Gedaliahoo
IPC分类号： G01R31/26 , G05D23/00
CPC分类号： G01R31/2863 , G01R1/0458
摘要： In accordance with an aspect, a thermally-controllable integrated unit is configured to hold devices under test. The integrated unit includes at least one heater board, comprised of a thermally-conductive material and provided with at least one global heater configured to globally heat the DUT board. A DUT board of the integrated unit includes a DUT board in thermal contact with the at least one heater board, the DUT board including a plurality of sockets, each socket configured to hold at least one DUT. The DUT has conductor paths to conduct electrical signals between test equipment and the terminals of DUTs in the sockets. Each socket includes an associated temperature sensor and a separately controllable local heater configured to, based on a temperature indication from the temperature sensor, heat a DUT in that socket.
摘要翻译：根据一个方面，热控制集成单元被配置为保持被测器件。集成单元包括至少一个加热板，其由导热材料构成并且设置有至少一个全局加热器，该全局加热器被配置为全面加热DUT板。集成单元的DUT板包括与至少一个加热板热接触的DUT板，DUT板包括多个插座，每个插座被配置为保持至少一个DUT。 DUT具有导体路径，以在测试设备和插座中的DUT端子之间传导电信号。每个插座包括相关联的温度传感器和可单独控制的局部加热器，该局部加热器被配置为基于来自温度传感器的温度指示来加热该插座中的DUT。

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