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    • 1. 发明申请
    • LENS ARRAY OPTICAL COUPLING TO PHOTONIC CHIP
    • 透镜阵列光耦合到光电芯片
    • WO2013025327A2
    • 2013-02-21
    • PCT/US2012/048570
    • 2012-07-27
    • INTERNATIONAL BUSINESS MACHINES CORPORATIONDOANY, Fuad, E.LEE, Benjamin, G.SCHOW, Clint, L.
    • DOANY, Fuad, E.LEE, Benjamin, G.SCHOW, Clint, L.
    • G02B6/32H01L21/302
    • G02B6/32G02B6/30G02B6/4204G02B6/4244G02B6/425H01L21/302
    • A photonic integrated circuit apparatus is disclosed. The apparatus includes a photonic chip (200) and a lens array coupling element (100). The photonic chip includes a waveguide (202) at a side edge surface of the photonic chip. The lens array coupling element is mounted on a top surface of the photonic chip and on the side edge surface. The coupling element includes a lens array (102) that is configured to modify spot sizes of light traversing to or from the waveguide. The coupling element further includes an overhang (104) on a side of the coupling element that opposes the lens array and that abuts the top surface of the photonic chip. The overhang includes a vertical stop surface (1 12) that has a depth configured to horizontally align an edge of the waveguide with a focal length of the lens array and that vertically aligns focal points of the lens array with the edge of the waveguide.
    • 公开了一种光子集成电路装置。 该装置包括光子芯片(200)和透镜阵列耦合元件(100)。 光子芯片包括在光子芯片的侧边缘表面处的波导(202)。 透镜阵列耦合元件安装在光子芯片的顶表面上并在侧边缘表面上。 耦合元件包括透镜阵列(102),其被配置为修改横穿波导或从波导穿过的光的光斑尺寸。 耦合元件还包括在耦合元件的与透镜阵列相对并且邻接光子芯片的顶表面的一侧上的突出部(104)。 突出部分包括垂直止动表面(112),该垂直止动表面(112)具有配置成水平地对准波导的边缘与透镜阵列的焦距并使透镜阵列的焦点与波导的边缘垂直对准的深度。
    • 5. 发明申请
    • LENS ARRAY OPTICAL COUPLING TO PHOTONIC CHIP
    • 透镜阵列光耦合到光电芯片
    • WO2013025327A3
    • 2014-05-08
    • PCT/US2012048570
    • 2012-07-27
    • IBMDOANY FUAD ELEE BENJAMIN GSCHOW CLINT L
    • DOANY FUAD ELEE BENJAMIN GSCHOW CLINT L
    • G02B6/32
    • G02B6/32G02B6/30G02B6/4204G02B6/4244G02B6/425H01L21/302
    • A photonic integrated circuit apparatus is disclosed. The apparatus includes a photonic chip (200) and a lens array coupling element (100). The photonic chip includes a waveguide (202) at a side edge surface of the photonic chip. The lens array coupling element is mounted on a top surface of the photonic chip and on the side edge surface. The coupling element includes a lens array (102) that is configured to modify spot sizes of light traversing to or from the waveguide. The coupling element further includes an overhang (104) on a side of the coupling element that opposes the lens array and that abuts the top surface of the photonic chip. The overhang includes a vertical stop surface (112) that has a depth configured to horizontally align an edge of the waveguide with a focal length of the lens array and that vertically aligns focal points of the lens array with the edge of the waveguide.
    • 公开了一种光子集成电路装置。 该装置包括光子芯片(200)和透镜阵列耦合元件(100)。 光子芯片包括在光子芯片的侧边缘表面处的波导(202)。 透镜阵列耦合元件安装在光子芯片的顶表面上并在侧边缘表面上。 耦合元件包括透镜阵列(102),其被配置为修改横穿波导或从波导穿过的光的光斑尺寸。 耦合元件还包括在耦合元件的与透镜阵列相对并且邻接光子芯片的顶表面的一侧上的突出部(104)。 突出部分包括垂直的止动表面(112),该垂直的止动表面(112)具有被配置为水平地对准波导的边缘与透镜阵列的焦距并使透镜阵列的焦点与波导的边缘垂直对准的深度。