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1. 发明专利

JP2005199152A Destaticizing chamber 审中-公开
标题翻译：清洁室
公开(公告)号：JP2005199152A
公开(公告)日：2005-07-28
申请号：JP2004007071
申请日：2004-01-14
申请人： Emi Hayakawa , Kouji Kato , Toshio Kusaka , Hitoshi Tofun , 鋼治加藤 , 利男日下 , 恵美早川 , 仁史藤墳
发明人： KATO KOUJI , KUSAKA TOSHIO , TOFUN HITOSHI , HAYAKAWA EMI
IPC分类号： B08B5/02 , B08B7/00 , F24F7/06
摘要： PROBLEM TO BE SOLVED: To resolve problems of a destaticizing chamber installed in front of a clean room wherein an existing floor panel is a floor panel for a computer room where electronic equipment like a computer is set, having facing light transmitting members, liquid crystal and electrodes held therebetween and transmittably composed; and wherein whole floor is conductive to prevent static electricity near the floor by grounding; confirmation of a state of cables laid under the floor of the computer room can be performed without opening/closing the floor panel; and to resolve that use is limited and it is not suitable to destaticize human and to remove dust.
SOLUTION: The destaticizing chamber is provided with an entrance on a conductive wall face, an air shower and a driving type conveyer disposed therein, with a grounding function. Charged dust attached to human's clothes is removed on the conveyer and transferred to the outside of the room by the conveyer. Static electricity of a human and/or clothes is discharged to the wall face, static electricity charged on the wall is grounded to the earth and/or air through a conductive column. Thus, destaticizing and dedusting can be surely performed.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了解决安装在洁净室前面的静电室的问题，其中现有的地板镶板是用于计算机室的地板镶板，其中设置有诸如计算机的电子设备，具有面对的透光构件，液晶和电极保持在其间并且可透射地组成; 并且其中整个地板是导电的，以通过接地来防止地板附近的静电; 可以在不打开/关闭地板面板的情况下执行放置在计算机室的地板下的电缆的状态的确认; 并且解决这种使用是有限的，不适合去除人类和去除灰尘。解决方案：静电室在导电壁面上设置入口，空气淋浴器和设置在其中的驱动型输送机具有接地功能。附着在人的衣服上的附着的灰尘在输送机上被移走，并由输送机转移到房间的外部。人和/或衣服的静电被排出到壁面上，充电在墙壁上的静电通过导电柱接地到地面和/或空气。因此，可以肯定地进行静电除尘。版权所有（C）2005，JPO＆NCIPI

2. 发明授权

US6166432A Substrate for use in wafer attracting apparatus and manufacturing method thereof 失效
标题翻译：用于晶片吸引装置的基板及其制造方法
公开(公告)号：US6166432A
公开(公告)日：2000-12-26
申请号：US34021
申请日：1998-03-02
申请人： Masashi Ohno , Naohito Yamada , Takahiro Inoue , Kouji Kato
发明人： Masashi Ohno , Naohito Yamada , Takahiro Inoue , Kouji Kato
IPC分类号： H01L21/683 , H02N13/00 , H01L23/053 , H01L23/12
CPC分类号： H01L21/6833 , Y10T279/23
摘要： A wafer attracting apparatus includes a substrate made of a ceramic material and adapted to attract and hold a wafer onto an attracting surface thereof, wherein the attracting surface is constituted by a ductile worked surface, the ductile worked surface has concave portions, a diameter of each of the concave portions is 0.1 .mu.m or less, and when the wafer is attracted onto the attracting surface of the substrate and released therefrom, the number of particles attaching to that wafer is 9.3 or less per 1 cm.sup.2.
摘要翻译：晶片吸引装置包括由陶瓷材料制成并适于将晶片吸引并保持在其吸引表面上的衬底，其中吸引表面由延性加工表面构成，延性加工表面具有凹部，每个的直径的凹部的面积为0.1μm以下，并且当晶片被吸引到基板的吸引面上并从基板上吸引后，附着于该晶片的粒子数为每1cm3 9.3以下。

3. 发明授权

US06491571B1 Substrate for use in wafer attracting apparatus and manufacturing method thereof 有权
标题翻译：用于晶片吸引装置的基板及其制造方法
公开(公告)号：US06491571B1
公开(公告)日：2002-12-10
申请号：US09531462
申请日：2000-03-20
申请人： Masashi Ohno , Naohito Yamada , Takahiro Inoue , Kouji Kato
发明人： Masashi Ohno , Naohito Yamada , Takahiro Inoue , Kouji Kato
IPC分类号： B24B722
CPC分类号： H01L21/6833 , Y10T279/23
摘要： A wafer attracting apparatus includes a substrate made of a ceramic material and adapted to attract and hold a wafer onto an attracting surface thereof, wherein the attracting surface is constituted by a ductile worked surface, the ductile worked surface has concave portions, a diameter of each of the concave portions is 0.1 &mgr;m or less, and when the wafer is attracted onto the attracting surface of the substrate and released therefrom, the number of particles attaching to that wafer is 9.3 or less per 1 cm2.
摘要翻译：晶片吸引装置包括由陶瓷材料制成并适于将晶片吸引并保持在其吸引表面上的衬底，其中吸引表面由延性加工表面构成，延性加工表面具有凹部，每个的直径的凹部的厚度为0.1μm以下，并且当晶片被吸引到基板的吸附面上并被剥离时，附着在该晶片上的粒子的数量为每1cm 3为9.3以下。

4. 发明授权

US5076026A Microscopic grinding method and microscopic grinding device 失效
标题翻译：微观研磨方法和微观研磨装置
公开(公告)号：US5076026A
公开(公告)日：1991-12-31
申请号：US621430
申请日：1990-12-04
申请人： Shinichi Mizuguchi , Syuji Ueda , Kouji Kato , Noritsugu Umehara
发明人： Shinichi Mizuguchi , Syuji Ueda , Kouji Kato , Noritsugu Umehara
IPC分类号： B24B31/112 , B23Q1/34 , B24B1/00 , B24B13/00 , B24B35/00 , B24B37/00 , G01Q20/04 , G01Q60/32
CPC分类号： B23Q1/34 , B24B1/005 , B24B13/00 , B24B35/005
摘要： A microscopic grinding device grinds a workpiece at ultrahigh precision with the use of magnetic grinding fluid actuated microscopically in three dimensional directions by Z- and XY-axis actuators. The magnetic grinding fluid is magnetically supported between a grinding member and the workpiece by the magnetic field. Because magnetic field is generated to form a magnetic circuit within the device itself where no workpiece is necessary to form the magnetic circuit, the device can be used with equal results even with workpieces made from non-magnetic material. The pressure applied to the workpiece by the grinding member via the magnetic grinding fluid is detected by a load cell for feeding back a signal indicative of the detected pressure to the controller. The controller controls the actuators to actuate the grinding member such that the pressure applied from the grinding member, via the magnetic fluid, to the workpiece is maintained within a predetermined range.

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